Patents by Inventor Atsuhiko Imai

Atsuhiko Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8815205
    Abstract: A production method comprising the steps of: spraying an aluminum hydroxide powder having a specific surface area measured by a nitrogen adsorption method of 0.3 m2/g or more and 3 m2/g or less; a ratio of an average particle diameter D50, which is a particle diameter at which 50% by weight of particles from the finest particle side are accumulated in a particle diameter distribution measured by a laser diffraction scattering method, to a sphere conversion particle diameter Dbet calculated from a specific surface area, of 10 or less; and the average particle diameter D50 of 2 ?m or more and 100 ?m or less, into flames, and then collecting it in the form of a powder to give a spherical alumina powder having a small specific surface area and a low uranium content, and capable of providing high thermal conductivity to resin compositions.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: August 26, 2014
    Assignees: Nippon Steel & Sumikin Materials Co., Ltd., Sumitomo Chemical Company, Limited
    Inventors: Kiyoshi Sawano, Atsuhiko Imai, Takayuki Kashihara, Yusuke Kawamura, Hiroshi Takahashi
  • Patent number: 8051304
    Abstract: In a power supply apparatus for supplying a target power supply voltage to a microprocessor, a system controller sets the target power supply voltage to be supplied to the microprocessor based on a voltage configuration signal outputted from the microprocessor and outputs a voltage setting signal corresponding to the target power supply voltage. The regulator circuit generates the target power supply voltage set by the system controller based on the voltage setting signal outputted from the system controller and supplies the voltage to the microprocessor 10. The system controller acquires the conditions of the microprocessor, such as the operating time and temperature of the microprocessor and the amount of computation in the microprocessor, and reflects the acquired conditions on the setting of the power supply voltage.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: November 1, 2011
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Iwao Takiguchi, Kazuaki Mitsui, Tetsuji Tamura, Atsuhiko Imai
  • Publication number: 20110256051
    Abstract: A production method comprising the steps of: spraying an aluminum hydroxide powder having a specific surface area measured by a nitrogen adsorption method of 0.3 m2/g or more and 3 m2/g or less; a ratio of an average particle diameter D50, which is a particle diameter at which 50% by weight of particles from the finest particle side are accumulated in a particle diameter distribution measured by a laser diffraction scattering method, to a sphere conversion particle diameter Dbet calculated from a specific surface area, of 10 or less; and the average particle diameter D50 of 2 ?m or more and 100 ?m or less, into flames, and then collecting it in the form of a powder to give a spherical alumina powder having a small specific surface area and a low uranium content, and capable of providing high thermal conductivity to resin compositions.
    Type: Application
    Filed: April 14, 2011
    Publication date: October 20, 2011
    Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED, Nippon Steel Materials Co., Ltd.
    Inventors: Kiyoshi Sawano, Atsuhiko Imai, Takayuki Kashihara, Yusuke Kawamura, Hiroshi Takahashi
  • Patent number: 7954101
    Abstract: This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: May 31, 2011
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Kenichi Adachi, Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura
  • Patent number: 7831842
    Abstract: A heat generation amount estimation unit acquires the number of sub processors currently in operation, acquires the current operating frequency, and estimates the amount of heat generation after a period ?t. A temperature control unit estimates the temperature after the period ?t based on the current temperature input from a temperature sensor and the amount of heat generation estimated, and compares it with a predetermined threshold temperature. If the predetermined threshold temperature is reached, the temperature control unit acquires the number of sub processors available in parallel after the period ?t from a task management unit, and consults a performance table to determine which operation point to shift to. A sub processor control unit and a frequency control unit switch to the number of sub processors in operation and the operating frequency accordingly. The performance table lists possible operation points in order of performance.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: November 9, 2010
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Kenichi Adachi, Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura
  • Patent number: 7520669
    Abstract: A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: April 21, 2009
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura, Kenichi Adachi
  • Publication number: 20090037752
    Abstract: In a power supply apparatus for supplying a target power supply voltage to a microprocessor, a system controller sets the target power supply voltage to be supplied to the microprocessor based on a voltage configuration signal outputted from the microprocessor and outputs a voltage setting signal corresponding to the target power supply voltage. The regulator circuit generates the target power supply voltage set by the system controller based on the voltage setting signal outputted from the system controller and supplies the voltage to the microprocessor 10. The system controller acquires the conditions of the microprocessor, such as the operating time and temperature of the microprocessor and the amount of computation in the microprocessor, and reflects the acquired conditions on the setting of the power supply voltage.
    Type: Application
    Filed: April 24, 2006
    Publication date: February 5, 2009
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Iwao Takiguchi, Kazuaki Mitsui, Tetsuji Tamura, Atsuhiko Imai
  • Publication number: 20080043807
    Abstract: A temperature sensor measures a temperature of a certain location inside a processor. An overall heat amount measurement unit measures the overall amount of heat of the processor. A temperature estimation unit estimates the temperatures of a plurality of hot spots occurring in the processor based on the temperature of the certain location detected by the temperature sensor, and determines the maximum temperature of the processor. The temperature estimation unit switches between maximum load temperature estimation coefficients and individual load temperature estimation coefficients stored in a storing unit for reference, depending on the overall amount of heat of the processor, and applies them to a temperature estimation function(s) for converting the sensor temperature into the temperatures of the hot spots.
    Type: Application
    Filed: April 26, 2005
    Publication date: February 21, 2008
    Applicant: Sony Computer Entertainment Inc.
    Inventors: Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura, Kenichi Adachi
  • Publication number: 20070198134
    Abstract: An instruction decoder identifies, for each instruction, an operational block involved in the execution of the instruction and an associated heat release coefficient. The instruction decoder stores identified information in a heat release coefficient profile. An instruction scheduler schedules the instructions in accordance with the dependence of the instructions on data. A heat release frequency adder cumulatively adds the heat release coefficient to the heat release frequency of the operational block held in the operational block heat release frequency register as the execution of the scheduled instructions proceeds. A heat release frequency subtractor subtracts from the heat release frequency of the operational blocks in the operational block heat release frequency register in accordance with heat discharge that occurs with time.
    Type: Application
    Filed: December 22, 2004
    Publication date: August 23, 2007
    Applicant: Sony Computer Enterainment Inc.
    Inventors: Kenichi Adachi, Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura
  • Publication number: 20070143763
    Abstract: A heat generation amount estimation unit acquires the number of sub processors currently in operation, acquires the current operating frequency, and estimates the amount of heat generation after a period ?t. A temperature control unit estimates the temperature after the period ?t based on the current temperature input from a temperature sensor and the amount of heat generation estimated, and compares it with a predetermined threshold temperature. If the predetermined threshold temperature is reached, the temperature control unit acquires the number of sub processors available in parallel after the period ?t from a task management unit, and consults a performance table to determine which operation point to shift to. A sub processor control unit and a frequency control unit switch to the number of sub processors in operation and the operating frequency accordingly. The performance table lists possible operation points in order of performance.
    Type: Application
    Filed: April 8, 2005
    Publication date: June 21, 2007
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Kenichi Adachi, Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura
  • Publication number: 20070074216
    Abstract: This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.
    Type: Application
    Filed: April 8, 2005
    Publication date: March 29, 2007
    Applicant: Sony Computer Entertainment Inc.
    Inventors: Kenichi Adachi, Kazuaki Yazawa, Iwao Takiguchi, Atsuhiko Imai, Tetsuji Tamura
  • Patent number: 7167778
    Abstract: A temperature predicting unit predicts the temperature of an electronic device after a predetermined period, and the speed of temperature variation from the operating state of the load. Based on the results of prediction by the temperature predicting unit, a selection unit instructs either one or both of a nozzle control unit and an electric fan control unit to exercise control. According to a control signal from the selection unit, the nozzle control unit transmits a control signal to a nozzle unit to drive a jet cooling apparatus. According to a control signal from the selection unit, the electric fan control unit transmits a control signal to an electric fan unit to drive an electric fan. The selection unit selects the electric fan when the predicted speed of temperature variation exceeds a predetermined threshold, and selects the jet cooling apparatus when the predetermined thresholds is not exceeded.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: January 23, 2007
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Kazuaki Yazawa, Iwao Takiguchi, Tetsuji Tamura, Atsuhiko Imai, Kenichi Adachi
  • Publication number: 20060150388
    Abstract: The present invention provides a metal foil tube with a thickness of 10 to 100 ?m and a method and apparatus of production of the metal foil tube enabling even an extremely thin metal foil to be reliably finished into a tube, that is, a metal foil tube comprised of a metal foil sheet W with a thickness t of 10 to 100 ?m joined by welding, the method of production of the metal foil tube shaping the metal foil sheet W to form an overlap part G, then welding the facing sides and finishing the weld zone part flat.
    Type: Application
    Filed: January 19, 2004
    Publication date: July 13, 2006
    Inventors: Koki Inada, Kazutoshi Iwami, Atsuhiko Imai, Hiroki Kobayashi, Yasuo Takahashi, Mukio Yamanaka, Tohru Saito
  • Publication number: 20050273208
    Abstract: A temperature predicting unit predicts the temperature of an electronic device after a predetermined period, and the speed of temperature variation from the operating state of the load. Based on the results of prediction by the temperature predicting unit, a selection unit instructs either one or both of a nozzle control unit and an electric fan control unit to exercise control. According to a control signal from the selection unit, the nozzle control unit transmits a control signal to a nozzle unit to drive a jet cooling apparatus. According to a control signal from the selection unit, the electric fan control unit transmits a control signal to an electric fan unit to drive an electric fan. The selection unit selects the electric fan when the predicted speed of temperature variation exceeds a predetermined threshold, and selects the jet cooling apparatus when the predetermined thresholds is not exceeded.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 8, 2005
    Inventors: Kazuaki Yazawa, Iwao Takiguchi, Tetsuji Tamura, Atsuhiko Imai, Kenichi Adachi
  • Patent number: 6908028
    Abstract: The present invention provides a method of manufacturing a honeycomb body (1) formed by winding a flat metal foil (3) and a corrugated metal foil (4) in layers and brazing them, capable of reducing the equipment cost of honeycomb body manufacturing facilities and conforming to the countermeasure against an engine misfire problem of the honeycomb body, without causing insufficient or excessive application of adhesive which is seen in the cases of adhesive application methods using rolls; and relates to a method of manufacturing a honeycomb body characterized by: applying an adhesive to the portions to be brazed of the flat or corrugated foil corresponding to a bonding portion (17) which is located at one or both ends of the honeycomb body and/or a bonding portion (18) inside the honeycomb body over a cross section which is located away from one or both ends thereof in the axial direction; then, winding the flat and corrugated foils in layers to form a honeycomb body; then, making the portion of one or both end
    Type: Grant
    Filed: September 6, 2001
    Date of Patent: June 21, 2005
    Assignee: Nippon Steel Corporation
    Inventors: Toru Utsumi, Takeshi Shinoda, Atsuhiko Imai, Kazutoshi Iwami, Masayuki Kasuya
  • Publication number: 20030073561
    Abstract: The present invention provides a method of manufacturing a honeycomb body (1) formed by winding a flat metal foil (3) and a corrugated metal foil (4) in layers and brazing them, capable of reducing the equipment cost of honeycomb body manufacturing facilities and conforming to the countermeasure against an engine misfire problem of the honeycomb body, without causing insufficient or excessive application of adhesive which is seen in the cases of adhesive application methods using rolls; and relates to a method of manufacturing a honeycomb body characterized by: applying an adhesive to the portions to be brazed of the flat or corrugated foil corresponding to a bonding portion (17) which is located at one or both ends of the honeycomb body and/or a bonding portion (18) inside the honeycomb body over a cross section which is located away from one or both ends thereof in the axial direction; then, winding the flat and corrugated foils in layers to form a honeycomb body; then, making the portion of one or both end
    Type: Application
    Filed: June 10, 2002
    Publication date: April 17, 2003
    Inventors: Toru Utsumi, Takeshi Shinoda, Atsuhiko Imai, Kazutoshi Iwami, Masayuki Kasuya