Patents by Inventor Atsuhiro Harada

Atsuhiro Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120005497
    Abstract: A terminal apparatus updating method is disclosed which includes: performing a wireless power supply process of wirelessly supplying power to a terminal apparatus equipped with a wireless power reception portion so as to start up the terminal apparatus thus powered; performing a wireless transmission process of wirelessly transmitting firmware write data to the terminal apparatus started up in the wireless power supply process using a suitable wireless communication function; performing a write process of causing the terminal apparatus having received the firmware write data in the wireless transmission process to write the firmware write data to a storage portion inside the terminal apparatus; and stopping the wireless power supply process upon determination that the write process is completed.
    Type: Application
    Filed: April 13, 2011
    Publication date: January 5, 2012
    Applicant: Sony Corporation
    Inventors: Sotaro Tsukamoto, Atsuhiro Harada, Makoto Ueda
  • Publication number: 20070278642
    Abstract: A semiconductor device includes a first semiconductor module having a semiconductor part on a board and conductive parts for making connection with another board on an upper surface of the board, a second semiconductor module having a semiconductor part on a board and conductive parts for making connection with another board on a lower surface of the board, and a plurality of relay boards placed between conductive parts formed on an upper surface of the first semiconductor module and the conductive parts formed on a lower surface of the second semiconductor module for connecting both surfaces' conductive parts, a side length of the relay board corresponding to one of a plurality of divided portions of a side of the first semiconductor module's board, the relay board having a plurality of conductive via formed on an upper and lower surface of the relay board allowing electric conduction between both surfaces.
    Type: Application
    Filed: May 24, 2007
    Publication date: December 6, 2007
    Applicant: Sony Corporation
    Inventors: Hiroyuki Yamaguchi, Kazuya Oota, Atsuhiro Harada