Abstract: A semiconductor integrated circuit includes a first circuit, a second circuit and a control circuit. The first circuit is configured by a first MOS transistor, and a threshold voltage of the first MOS transistor is a first threshold voltage. The second circuit has same logic as the first circuit, and is configured by a second MOS transistor. A threshold voltage of the second MOS transistor is a second threshold voltage, and the second threshold voltage is lower than the first threshold voltage. The control circuit makes one of the first circuit and the second circuit operate depending on a temperature of a chip. The first circuit and the second circuit are installed in a chip.

Abstract: A semiconductor device includes: a high VT part including a first transistor with first threshold voltage; a low VT part including a second transistor with second threshold voltage lower than the first voltage; a temperature detector which measures a temperature of the semiconductor device, determines whether the temperature is in a high temperature state where the temperature is higher than a predetermined temperature or a low temperature state where the temperature is lower than the predetermined temperature, and outputs a signal indicating the high temperature state or the low temperature state; and a controller which receives the signal indicating the high temperature state or the signal indicating the low temperature state, and performs control to cause the high VT part to operate based on the signal indicating the high temperature state and to cause the low VT part to operate based on the signal indicating the low temperature state.

Abstract: Disclosed herewith is a wiring substrate for releasing a heat generated by an electronic part efficiently through a heat pipe. The wiring substrate of the present invention includes a built-in heat pipe. The substrate also has amounting area. In the mounting area, an IC chip is mounted on a mounting surface. The substrate has a heat pipe formed so that its distance from the mounting area with respect to the mounting surface becomes shorter than its distance from an outside area provided outside the mounting area.

Abstract: There have been cases where the wirings are not led out when a semiconductor chip comprising a conventional macro is mounted on a package substrate. The macro-cell block is a macro-cell block formed polygonal having a plurality of sides and formed in a semiconductor chip, and is characterized by comprising a signal terminal portion, a power terminal portion, and a ground terminal portion, which are connected to the outside of a semiconductor chip, wherein the signal terminal portion is disposed along one side of the plurality of sides, and the power terminal portion is disposed along a side different from the side where the signal terminal portion is disposed, and the ground terminal portion is disposed along a side different from the side where the signal terminal portion is disposed.