Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).

Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).

Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less.

Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).

Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.

Abstract: A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol resin having a hydrocarbon group with small polarity between phenol nuclei represented by the following general formula (I): wherein R1's may be the same or different from each other and each represent an alkyl group having 1 to 10 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group; Z's may be the same or different from each other and each represent a divalent hydrocarbon group having 1 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded, at least one Z in one molecule is a divalent hydrocarbon group having 5 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded; n is a number of 0 to 8

Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation.

Abstract: A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol resin having a hydrocarbon group with small polarity between phenol nuclei represented by the following general formula (I): wherein R1's may be the same or different from each other and each represent an alkyl group having 1 to 10 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group; Z's may be the same or different from each other and each represent a divalent hydrocarbon group having 1 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded, at least one Z in one molecule is a divalent hydrocarbon group having 5 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded; n is a number of 0 to 8

Abstract: The present provides an epoxy resin composition for semiconductor encapsulation, which has a low melt viscosity, is excellent in storage stability and moldability, and gives a cured product having excellent solder crack resistance. Said epoxy resin composition comprises, as essential components: (a) as an epoxy resin, a biphenol type epoxy resin represented by general formula (I) (where R1-R8 represent hydrogen, an alkyl group, a phenyl group, an aralkyl group, or an alkoxyl group, and n is 0-5); (b) as a phenol type hardener, a thiodiphenol compound represented by general formula (II) and a polyhydric phenol compound having a structure other than the thiodiphenol compound (where X represents an alkyl group, a phenyl group, an aralkyl group, or an alkoxyl group, and m is 0-3); (c) an inorganic filler, and (d) a curing accelerator.

Abstract: An epoxy resin composition comprising (a) an epoxy resin comprising a mixture of the following components: (1) about 50-95 parts by weight of a novolak type epoxy resin, and (2) about 5-50 parts by weight of 4,4′-biphenol type epoxy resin (b) a phenolic resin represented by the general formula (II) (where R, which may be the same or different, represents an alkyl group having 1-10 carbon atoms, a substituted or unsubstituted phenyl group, a substituted or unsubstituted aralkyl group, an alkoxyl group or a halogen atom; Z, which may be the same or different, represents a divalent hydrocarbon group having 1-15 carbon atoms, provided that at least one Z is a divalent hydrocarbon group having 5-15 carbon atoms; n is a number of 0-8 on the average value; and i, which may be the same or different, is an integer of 0-3) as an epoxy resin hardener, (c) an inorganic filler, and (d) a curing accelerator.

Abstract: An epoxy resin composition which can be crushed at an ordinary temperature and which comprises respective components described below,(a) 10 to 80 parts by weight of a 4,4'-biphenol type epoxy resin which is crystalline at an ordinary temperature,(b) 20 to 90 parts by weight of a noncrystalline epoxy resin having a softening point of 35.degree. C. to 55.degree. C.

Abstract: The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.