Patents by Inventor Atsuhito Noda

Atsuhito Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110036615
    Abstract: A transmission line is made from FFC and has an elongated support base with opposing top and bottom sides. The support base has a plurality of conductive traces arranged on both of its side with the traces on one of the support base sides being arranged in pairs of signal traces, and specifically pairs of differential signal traces. The traces which are arranged on the other side of the support base include ground traces, each of which preferably has a width that is greater than the combined width of two signal traces that make up a signal pair. Each of the ground traces are aligned with a pair of signal traces.
    Type: Application
    Filed: December 1, 2005
    Publication date: February 17, 2011
    Applicant: Molex Incorporated
    Inventors: Atsuhito Noda, Toshihiro Niitsu
  • Patent number: 7833043
    Abstract: A socket connector configured such that elongated guide holes are formed in the housing so as to receive guide members of a device to be connected, and a slide member is attached to the housing to be slidable in the longitudinal direction of the elongated guide holes so as to restrict the guide members to their initial positions. The socket enables direct placement of the device on the housing, can shorten the projection length of projection terminals of the device, can facilitate positioning of the device to thereby enhance the easiness of attachment operation, can prevent bending of the projection terminals, can cope with an increase in density of the projection terminals, and has a simple structure.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: November 16, 2010
    Assignee: Molex Incorporated
    Inventors: Shigeyuki Hoshikawa, Atsuhito Noda
  • Publication number: 20100009563
    Abstract: A socket connector configured such that elongated guide holes are formed in the housing so as to receive guide members of a device to be connected, and a slide member is attached to the housing to be slidable in the longitudinal direction of the elongated guide holes so as to restrict the guide members to their initial positions. The socket enables direct placement of the device on the housing, can shorten the projection length of projection terminals of the device, can facilitate positioning of the device to thereby enhance the easiness of attachment operation, can prevent bending of the projection terminals, can cope with an increase in density of the projection terminals, and has a simple structure.
    Type: Application
    Filed: August 2, 2006
    Publication date: January 14, 2010
    Applicant: MOLEX INCORPORATED
    Inventors: Yoshifumi Hoshikawa, Atsuhito Noda
  • Patent number: 7284991
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: October 23, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa, Hiroshi Ikeda
  • Patent number: 7273380
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: September 25, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Patent number: 7229291
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: June 12, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Publication number: 20070123067
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Application
    Filed: January 25, 2007
    Publication date: May 31, 2007
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Patent number: 7189079
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: March 13, 2007
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Patent number: 7153162
    Abstract: A plug connector is provided with a housing into which the receptacle connector is to be inserted, and a plurality of pin terminals arranged in the housing. The receptacle connector is provided with a plurality of contacts having contact members to be brought into contact with the pin terminals, and a housing holding the contacts. In the plug connector, a plurality of vertical shield plates are provided between the pin terminals. In the receptacle connector, a plurality of horizontal shield plates are provided so as to intersect the vertical shield plates in a cross-like manner. Provided in the housing and the horizontal shield plates of the receptacle connector are slits for allowing insertion of the vertical shield plates. The housing of the plug connector is provided with terminal unit mounting passage for the unit terminals and vertical shield mounting passage for the vertical shield plates.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: December 26, 2006
    Assignee: Molex Incorporated
    Inventors: Akinori Mizumura, Atsuhito Noda
  • Publication number: 20060030169
    Abstract: A sheet type connector has an insulation sheet and a plurality of conductive contacts provided on the sheet in an array of “M” rows and “N” columns. A plurality of conductive contacts are successively stamped and formed in a metal sheet and are disposed on a belt-like insulation sheet in an array of “m” rows and “n” columns to produce an intermediate sheet, where “m” is an integer greater than “M” and “n” is an integer greater than “N”. Thereafter, said intermediate sheet is cut into such size that the conductive contacts in “M” rows by “N” columns are included.
    Type: Application
    Filed: April 8, 2005
    Publication date: February 9, 2006
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa
  • Publication number: 20050277309
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 15, 2005
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa, Hiroshi Ikeda
  • Publication number: 20050266703
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 1, 2005
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Publication number: 20050266702
    Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 1, 2005
    Inventors: Atsuhito Noda, Yasuhiro Ichijo, Shigeyuki Hoshikawa
  • Publication number: 20050190006
    Abstract: An improved signal transmission line whose degree of freedom in designing its signal line pattern and line width and in adjusting its characteristic impedance is significantly increased. The transmission line. The signal transmission line includes an insulating substrate whose one surface has at least one signal line longitudinally extending from one to the other end of the insulating substrate; and two net-like conductive layers laid on the opposite surfaces of the insulating substrate, the spaces for each of the net-like conductive layers being formed at random.
    Type: Application
    Filed: February 28, 2005
    Publication date: September 1, 2005
    Inventors: Atsuhito Noda, Teruhito Suzuki, Toshihiro Niitsu
  • Patent number: 6827586
    Abstract: A connector for mounting to a circuit board, includes a housing and a plurality of terminals arranged side by side at the predetermined pitch. Each terminal includes a flat base portion, a pair of contact members formed from a continuous folded-back portion that is folded back to one side of the flat base portion, and a carrier coupling section that is bent at substantially right angle to the opposite side of the flat base portion. The housing holds the terminals by an over-molding of the housing around the flat base portions of the terminals to form a generally flat plate-like housing. The pair of contact members of the terminal extends toward one surface of the dielectric housing and the carrier coupling section extends toward the other surface of the housing.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: December 7, 2004
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Yoshihiro Tetsuka
  • Publication number: 20040235321
    Abstract: The plug connector 20 is provided with a housing 22 into which the receptacle connector 10 is to be inserted, and a plurality of pin terminals 23 arranged in the housing. The receptacle connector 10 is provided with a plurality of contacts 12 having contact members 11 to be brought into contact with the pin terminals, and a housing 13 holding the contacts. In the plug connector, a plurality of vertical shield plates 27 are provided between the pin terminals; In the receptacle connector, a plurality of horizontal shield plates 14 are provided so as to intersect the vertical shield plates 27 in a cross-like manner. Provided in the housing and the horizontal shield plates 14 of the receptacle connector are slits for allowing insertion of the vertical shield plates. The housing 22 of the plug connector is provided with terminal unit mounting passage 26a for the unit terminals and vertical shield mounting passage 26a for the vertical shield plates.
    Type: Application
    Filed: June 18, 2004
    Publication date: November 25, 2004
    Inventors: Akinori Mizumura, Atsuhito Noda
  • Patent number: 6793504
    Abstract: A low-profile receptacle connector for use in making a required electric connection between an integrated circuit package and a printed circuit board includes a terminal housing part that is sandwiched between the integrated circuit package and the printed circuit board, and the terminal housing part has terminals embedded therein. Each terminal includes a flat trunk and at least one cantilever-like contact arm integrally connected to its flat trunk. The terminals are arranged with their flat trunks parallel to the plane of the terminal housing part, and are supported by the terminal housing part by allowing the mold to overhang the opposite lateral and longitudinal edges of the trunk of each terminal.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: September 21, 2004
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Akinori Mizumura, Yoshihiro Tetsuka
  • Patent number: 6780058
    Abstract: A plug connector (10) to be actually mounted on one substrate K1 and a receptacle connector (20) to be actually mounted on the other substrate K2 are provided. The receptacle connector is provided with a housing (22) into which the plug connector is to be inserted ad a plurality of pin terminals (23) arranged in an array to the housing. The plug connector is provided with a plurality of contacts (12) having contact pieces (11) in electrical contact with the respective pin terminals and a housing (13) for holding the respective contacts. A plurality of vertical shield plates (27) are provided between the respective pin terminals in the receptacle connector. A plurality of horizontal shield plate (14) are provided to intersect with the vertical shield plates (27) in a cruciform manner within said plug connector. Slits for advancing the vertical shield plates are formed in the housing of the plug connector and the horizontal shield plate (14).
    Type: Grant
    Filed: April 17, 2003
    Date of Patent: August 24, 2004
    Assignee: Molex Incorporated
    Inventors: Akinori Mizumura, Atsuhito Noda, Yoshihiro Tetsuka
  • Patent number: 6776620
    Abstract: A right-angle coaxial connector is provided, which can eliminate a possibility of the electric short circuit, which is excellent in mass production applicability, and which can be manufactured with low cost. The right-angle coaxial connector includes a coaxial plug 10 provided at an end of a cable 1, and a coaxial receptacle 20 electrically connected to the coaxial plug by inserting the coaxial plug therein. The coaxial plug 10 includes a plug main body 11 made of an insulative resin, and a plurality of pin type terminals protruded from a surface of the plug main body. The pin type terminals are divided into one signal terminal 12 and a plurality of ground terminals 13 disposed around the signal terminal. The ground terminals 13 are preferably arranged such that distances between adjacent ground terminals are set to be equal to one another.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: August 17, 2004
    Assignee: Molex Incorporated
    Inventor: Atsuhito Noda
  • Patent number: 6722928
    Abstract: An improved press-fit pin having an elastically deformable area 6 to be press-fitted in a selected through hole in a printed circuit board, the elastically deformable area 6 comprising two parallel, opposite beams 8 connected by an connecting deformable bridge 9, thereby permitting the outer corners 8a of each beam 8 to engage the inner wall of the plated through hole while permitting the connecting deformable bridge 9 to be deformed. The connecting deformable bridge 9 comprises, in cross-section, an connecting flat section 10 extending perpendicular to the opposite beams 8, and two oblique sections 11 extending outward from the opposite ends of the upper flat 10a of the connecting flat section 10 to be contiguous to the opposite beams 8. The press-fit pin has a connecting flat section in its pressure-deformable area in place of the “V”-shaped area of a conventional press-fit pin, thus eliminating the necessity of forming acute angles in the die-and-punch.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: April 20, 2004
    Assignee: Molex Incorporated
    Inventors: Atsuhito Noda, Shigeyuki Hoshikawa