Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.

Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.

Abstract: To provide a method for improving the flavor of an alcohol-containing beverage. Provided are a method of leaving an alcohol-containing beverage at rest that includes leaving an alcohol-containing beverage at rest so that the liquid of the alcohol-containing beverage does not substantially move, and an alcohol-containing beverage with improved flavor that can be obtained by this method.

Abstract: When a temperature of a semiconductor wafer is controlled to be a target temperature by raising the temperature of the semiconductor wafer, switching is performed so that a high-temperature circulating liquid at a temperature higher than the target temperature in a high-temperature tank is supplied into an inside-stage flow channel, and respective thermoelectric elements in a plurality of zones in a stage are controlled; and then, the temperature of the semiconductor wafer matches the target temperature and a desired in-plane temperature distribution of the semiconductor wafer is provided.

Abstract: Disclosed is a piston cooling device wherein the cooling efficiency of a piston is improved by oil injected from an oil jet and supplied to a cooling passage provided in the piston, and the amount of cooling oil is reduced when an internal combustion engine is operated at maximum output. The piston cooling device is provided with a piston for an internal combustion engine, in which a circumferential passage and a cooling passage having an inlet passage and an outlet passage are provided, and an oil jet for injecting oil from an injection port to the inlet passage. The oil jet injects oil at every stroke of the piston so that a two-phase plug flow composed of gas and oil is formed in the cooling passage at least when an internal combustion engine is operated at maximum output.

Abstract: Disclosed is a piston cooling device wherein the cooling efficiency of a piston is improved by oil injected from an oil jet and supplied to a cooling passage provided in the piston, and the amount of cooling oil is reduced when an internal combustion engine is operated at maximum output. The piston cooling device is provided with a piston for an internal combustion engine, in which a circumferential passage and a cooling passage having an inlet passage and an outlet passage are provided, and an oil jet for injecting oil from an injection port to the inlet passage. The oil jet injects oil at every stroke of the piston so that a two-phase plug flow composed of gas and oil is formed in the cooling passage at least when an internal combustion engine is operated at maximum output.

Abstract: A manufacturing time of a semiconductor device is shortened by raising and dropping a base temperature of a semiconductor wafer such as silicon wafer to a target temperature at a high speed, a semiconductor device is manufactured with high qualities by making an in-plane temperature distribution of the semiconductor wafer a desired temperature distribution with high accuracy (by uniformizing an in-plane temperature and varying the in-plane temperature distribution for each region), and furthermore, an apparatus with excellent energy efficiency can be simply configured.