Abstract: An electronic device includes a substrate, a functional element disposed on a principal plane of the substrate, a lid body, the functional element being housed in a space covered by the lid body and the substrate, the lid body including a recess at a side opposed to the functional element, an outer surface at the opposite side of the recess, a first hole section including an inclined surface and a bottom surface on the outer surface, and a second hole section piercing through the lid body between the recess and the bottom surface and having an inner wall surface, a joining section of the inclined surface and the bottom surface in the first hole section being a curved surface, the lid body containing silicon, and a sealing member that seals the first hole section communicating with the space.

Abstract: A physical quantity sensor includes a physical quantity sensor element including a lid joined to a substrate to define a housing space in the inside and a physical quantity sensor element piece housed in the housing space and a circuit element bonded to the outer surface of the lid via an adhesive material. In the lid, an electrode is provided to extend from an inner wall of a through-hole, which pierces through the lid from the housing space to a surface on the opposite side of the side of the physical quantity sensor element piece and is sealed by a sealing member, to a peripheral edge of the through-hole at the surface on the opposite side. In a sectional view, thickness of a region at the peripheral edge of the electrode is smaller at the opposite side of the side of an opening of the through-hole than the opening side.

Abstract: An electronic device includes a substrate, a functional element disposed on a principal plane of the substrate, a lid body, the functional element being housed in a space covered by the lid body and the substrate, the lid body including a recess at a side opposed to the functional element, an outer surface at the opposite side of the recess, a first hole section including an inclined surface and a bottom surface on the outer surface, and a second hole section piercing through the lid body between the recess and the bottom surface and having an inner wall surface, a joining section of the inclined surface and the bottom surface in the first hole section being a curved surface, the lid body containing silicon, and a sealing member that seals the first hole section communicating with the space.

Abstract: A physical quantity sensor includes a base unit as a support substrate, provided with a cavity that is open on one side, a movable unit which is formed on an open side of the cavity and is capable of displacing in a first direction, and spring units that are formed on the open side of the cavity and are connected to the movable unit. A length of the spring units in a second direction that is a direction, which intersects the first direction and in which the base unit overlaps the movable unit, is shorter than a length of the movable unit in the second direction and is longer than a length of the spring units in the first direction.

Abstract: A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

Abstract: A physical quantity sensor includes a physical quantity sensor element including a lid joined to a substrate to define a housing space in the inside and a physical quantity sensor element piece housed in the housing space and a circuit element bonded to the outer surface of the lid via an adhesive material. In the lid, an electrode is provided to extend from an inner wall of a through-hole, which pierces through the lid from the housing space to a surface on the opposite side of the side of the physical quantity sensor element piece and is sealed by a sealing member, to a peripheral edge of the through-hole at the surface on the opposite side. In a sectional view, thickness of a region at the peripheral edge of the electrode is smaller at the opposite side of the side of an opening of the through-hole than the opening side.

Abstract: A physical quantity sensor includes a base unit as a support substrate, provided with a cavity that is open on one side, a movable unit which is formed on an open side of the cavity and is capable of displacing in a first direction, and spring units that are formed on the open side of the cavity and are connected to the movable unit. A length of the spring units in a second direction that is a direction, which intersects the first direction and in which the base unit overlaps the movable unit, is shorter than a length of the movable unit in the second direction and is longer than a length of the spring units in the first direction.

Abstract: A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

Abstract: A physical quantity sensor includes a base substrate, a movable part placed to be displaceable with respect to the base substrate, a supporting part that supports the movable part, a dummy electrode provided on the movable part side of the base substrate and placed to face the movable part, a first conducting part provided on the base substrate side of the movable part and placed to face the dummy electrode, and a second conducting part provided on the base substrate side of the supporting part, wherein the first conducting part and the second conducting part are connected by a third conducting part.

Abstract: A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.

Abstract: An electronic device includes a package; and a functional element, in which a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.

Abstract: An electronic device includes a package including a base and a lid body, and a physical quantity sensor having an element piece housed in the package; a circuit device that is electrically connected to the electronic component; an IC; a base; and a support member that supports the physical quantity sensor and the IC and is fixed to the base. The physical quantity sensor is disposed to be spaced apart from the base. The physical quantity sensor is suspended from the base in a direction in which the physical quantity sensor is spaced apart from the base.

Abstract: A method of manufacturing an electronic device in which a second substrate (functional element) containing silicon and a third substrate (lid body) containing silicon are bonded to a first substrate containing alkali metal ions by anode bonding includes a first process of performing the anode bonding to bond the second substrate to a surface of the first substrate; a second process of removing at least a portion of the surface of the first substrate to which the third substrate is to be bonded by the anode bonding and exposing a bonding surface after the first process; and a third process of performing the anode bonding to bond the third substrate to the bonding surface of the first substrate.

Abstract: A method of manufacturing an electronic device in which a second substrate (functional element) containing silicon and a third substrate (lid body) containing silicon are bonded to a first substrate containing alkali metal ions by anode bonding includes a first process of performing the anode bonding to bond the second substrate to a surface of the first substrate; a second process of removing at least a portion of the surface of the first substrate to which the third substrate is to be bonded by the anode bonding and exposing a bonding surface after the first process; and a third process of performing the anode bonding to bond the third substrate to the bonding surface of the first substrate.

Abstract: A physical quantity sensor includes: a base; a cover; a function element provided inside a cavity formed by the base and the cover; and a protection film with which a principal surface of the base, a bonding boundary portion between the principal surface of the base and the cover, and the cover are coated continuously, wherein the protection film is an inorganic material film or an organic semiconductor film.

Abstract: A physical quantity sensor includes: an element piece including a movable weight and movable electrode portions which are provided to extend from the movable weight; fixed electrode portions which are provided in a first direction in which the element piece is displaced, with a gap d1 interposed therebetween; and fixed portions which are provided to face an end portion of the element piece, in which a recess is provided on the end portion of the movable weight in a position facing the fixed portions, a first stopper portion which extends towards the movable weight is provided on the fixed portion, and a tip end of the first stopper portion is inserted into the recess, and a gap d2 between the tip end and the movable weight is narrower than the gap d1.

Abstract: A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body, in a cross-sectional view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward the first main surface, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface, a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and the first through-hole is sealed with a sealing member.

Abstract: A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.

Abstract: A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body, in a cross-sectional view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward the first main surface, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface, a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and the first through-hole is sealed with a sealing member.

Abstract: A physical quantity sensor includes an element piece including a movable weight and movable electrode portions which are provided to extend from the movable weight; fixed electrode portions which are provided in a first direction in which the element piece is displaced, with a gap d1 interposed therebetween; and fixed portions which are provided to face an end portion of the element piece, in which a recess is provided on the end portion of the movable weight in a position facing the fixed portions, a first stopper portion which extends towards the movable weight is provided on the fixed portion, and a tip end of the first stopper portion is inserted into the recess, and a gap d2 between the tip end and the movable weight is narrower than the gap d1.