Patents by Inventor Atsuki Nogami

Atsuki Nogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130098665
    Abstract: The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a second metal layer that is adjacent to the first metal layer and contains second metallic crystal grains, with the first metal layer and the second metal layer being laminated along a direction perpendicular to the main surface of the insulating substrate, and the average grain size of the first metallic crystal grains is smaller than the average grain size of the second metallic crystal grains.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 25, 2013
    Inventors: Yuu Ishii, Atsuki Nogami, Yusuke Nakatani