Patents by Inventor Atsuki SAKAMOTO

Atsuki SAKAMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic circuit device and heat sink structure for the same
    Patent number: 9980377
    Abstract: An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: May 22, 2018
    Assignee: TDK Corporation
    Inventors: Atsuki Sakamoto, Mitsuru Watanabe
  • ELECTRONIC CIRCUIT DEVICE AND HEAT SINK STRUCTURE FOR THE SAME
    Publication number: 20170042066
    Abstract: An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 9, 2017
    Inventors: Atsuki SAKAMOTO, Mitsuru WATANABE