Patents by Inventor Atsuko Kimura

Atsuko Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7759406
    Abstract: The present invention provides a process for producing a polysilsesquioxane graft polymer (1) which includes applying ionizing radiation or heat to a mixture including a polysilsesquioxane compound (2) and a vinyl compound (3), a polysilsesquioxane compound including an iniferter group, and a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet using the polymer. According to the present invention, a process for producing a polysilsesquioxane graft polymer which may be used as a pressure-sensitive adhesive exhibiting excellent heat resistance and cohesive force, and the like are provided. In the formula, A represents a linking group, R1 represents a hydrocarbon group which may have a substituent, R2 represents a hydrogen atom or the like, R3 represents a polar group or the like, R4 represents a hydrogen atom or the like, k1 to k3 represent arbitrary positive integers, 1 to n represent zero or an arbitrary positive integer (excluding the case where “m=n=0”), and Q represents an iniferter group.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: July 20, 2010
    Assignee: Lintec Corporation
    Inventors: Taketo Kumon, Toshifumi Kageyama, Atsuko Kimura, Toshio Sugizaki, Osamu Moriya
  • Publication number: 20080051487
    Abstract: The present invention provides a process for producing a polysilsesquioxane graft polymer (1) which includes applying ionizing radiation or heat to a mixture including a polysilsesquioxane compound (2) and a vinyl compound (3), a polysilsesquioxane compound including an iniferter group, and a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet using the polymer. According to the present invention, a process for producing a polysilsesquioxane graft polymer which may be used as a pressure-sensitive adhesive exhibiting excellent heat resistance and cohesive force, and the like are provided. In the formula, A represents a linking group, R1 represents a hydrocarbon group which may have a substituent, R2 represents a hydrogen atom or the like, R3 represents a polar group or the like, R4 represents a hydrogen atom or the like, k1 to k3 represent arbitrary positive integers, 1 to n represent zero or an arbitrary positive integer (excluding the case where “m=n=0”), and Q represents an iniferter group.
    Type: Application
    Filed: September 22, 2004
    Publication date: February 28, 2008
    Applicant: Lintec Corporation
    Inventors: Taketo Kumon, Toshifumi Kageyama, Atsuko Kimura, Toshio Sugizaki, Osamu Moriya