Patents by Inventor Atsuko Saito
Atsuko Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230226205Abstract: It is an object of the present invention to provide an antibody binding to CDH6 and having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody-drug conjugate and having therapeutic effects on a tumor, a method for treating a tumor using the antibody, the antibody-drug conjugate or the pharmaceutical product, and the like. The present invention provides an anti-CDH6 antibody having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody or the antibody-drug conjugate, and a method for treating a tumor.Type: ApplicationFiled: July 26, 2022Publication date: July 20, 2023Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Atsuko SAITO, Tsuyoshi HIRATA, Kensuke NAKAMURA
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Patent number: 11446386Abstract: It is an object of the present invention to provide an antibody binding to CDH6 and having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody-drug conjugate and having therapeutic effects on a tumor, a method for treating a tumor using the antibody, the antibody-drug conjugate or the pharmaceutical product, and the like. The present invention provides an anti-CDH6 antibody having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody or the antibody-drug conjugate, and a method for treating a tumor.Type: GrantFiled: May 14, 2018Date of Patent: September 20, 2022Assignee: DAIICHI SANKYO COMPANY, LIMITEDInventors: Atsuko Saito, Tsuyoshi Hirata, Kensuke Nakamura
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Publication number: 20220016257Abstract: An object of the present invention is to provide an antibody specifically binding to CDH6 and having a high internalization activity, an antibody-drug conjugate comprising the antibody and a high antitumor activity, a pharmaceutical product having the antibody-drug conjugate and having a therapeutic effect on a tumor, a method for treating a tumor using the antibody, the antibody-drug conjugate or the pharmaceutical product, and the like. According to the present invention, it is possible to provide an anti-CDH6 antibody prepared having internalization activity, an anti-CDH6 antibody-drug conjugate prepared by connecting the anti-CDH6 antibody and a novel PBD derivative and exhibiting high anti-tumor activity, a pharmaceutical product and a therapeutic method for treating tumors using these.Type: ApplicationFiled: November 13, 2019Publication date: January 20, 2022Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Atsuko SAITO, Naoya HARADA, Kozo YONEDA, Ichiro HAYAKAWA, Masaki MEGURO, Fuminao DOI
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Patent number: 11077202Abstract: It is an object of the present invention to provide an antibody binding to CDH6 and having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody-drug conjugate and having therapeutic effects on a tumor, a method for treating a tumor using the antibody, the antibody-drug conjugate or the pharmaceutical product, and the like. The present invention provides an anti-CDH6 antibody having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody or the antibody-drug conjugate, and a method for treating a tumor.Type: GrantFiled: September 2, 2020Date of Patent: August 3, 2021Assignee: DAIICHI SANKYO COMPANY, LIMITEDInventors: Atsuko Saito, Tsuyoshi Hirata, Kensuke Nakamura
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Publication number: 20200390900Abstract: It is an object of the present invention to provide an antibody binding to CDH6 and having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody-drug conjugate and having therapeutic effects on a tumor, a method for treating a tumor using the antibody, the antibody-drug conjugate or the pharmaceutical product, and the like. The present invention provides an anti-CDH6 antibody having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody or the antibody-drug conjugate, and a method for treating a tumor.Type: ApplicationFiled: September 2, 2020Publication date: December 17, 2020Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Atsuko SAITO, Tsuyoshi HIRATA, JP NAKAMURA
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Publication number: 20200171163Abstract: It is an object of the present invention to provide an antibody binding to CDH6 and having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody-drug conjugate and having therapeutic effects on a tumor, a method for treating a tumor using the antibody, the antibody-drug conjugate or the pharmaceutical product, and the like. The present invention provides an anti-CDH6 antibody having internalization activity, an antibody-drug conjugate of the antibody and a drug having antitumor activity, a pharmaceutical product comprising the antibody or the antibody-drug conjugate, and a method for treating a tumor.Type: ApplicationFiled: May 14, 2018Publication date: June 4, 2020Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Atsuko SAITO, Tsuyoshi HIRATA, Kensuke NAKAMURA
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Patent number: 9165714Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.Type: GrantFiled: May 24, 2012Date of Patent: October 20, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Atsuko Saito, Kenji Masuko, Toshinobu Fujiwara
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Patent number: 8709612Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.Type: GrantFiled: April 12, 2012Date of Patent: April 29, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Atsuko Saito, Toshinobu Fujiwara, Kenji Masuko
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Publication number: 20120314336Abstract: An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.Type: ApplicationFiled: May 24, 2012Publication date: December 13, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Atsuko SAITO, Kenji MASUKO, Toshinobu FUJIWARA
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Publication number: 20120288731Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.Type: ApplicationFiled: April 12, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Atsuko SAITO, Toshinobu FUJIWARA, Kenji MASUKO
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Publication number: 20120288724Abstract: An electronic component that prevents or minimizes whiskers or has good solder wettability includes a rectangular solid-shaped electronic component element and external electrodes of terminal electrodes provided at opposed end surfaces of the electronic component element. First plated films including Ni are provided on the surfaces of the external electrodes. Second plated films including Sn defining an outermost layer are arranged so as to cover the first plated films. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are provided at a Sn crystal grain boundary. Intermetallic compound layers including Ni3Sn4 are provided at interfaces between the first plated films and the second plated films.Type: ApplicationFiled: April 26, 2012Publication date: November 15, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Makoto OGAWA, Akihiro MOTOKI, Atsuko SAITO, Kenji MASUKO, Toshinobu FUJIWARA
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Publication number: 20010043624Abstract: An switching system for routing a call setup request received from a subscriber device to a desired network among multiple networks having two or more different routing methods, based on information included in the call setup request.Type: ApplicationFiled: February 16, 2001Publication date: November 22, 2001Inventors: Atsuko Saito, Yuji Munakata, Yutaka Obara, Kazumi Muraki