Patents by Inventor Atsumi Adachi

Atsumi Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140363653
    Abstract: A structural fiber product usable as an adsorbent or the like is provided. A graft component for forming a graft chain is graft-polymerized onto a structural fiber object; the structural fiber object comprises a fiber assembly comprising at least a conjugated fiber, and an ethylene-vinyl alcohol-series copolymer exists on at least part of a surface of the fiber. The graft polymerization may be conducted, for example, by exposing a structural fiber object to radiation to generate an active species and immersing the structural fiber object in a liquid containing a graft component to bring the structural fiber object into contact with the graft component. According to the method, the graft component can be polymerized at a high degree of grafting, and a structural fiber product having an excellent adsorption characteristic is obtained.
    Type: Application
    Filed: June 7, 2012
    Publication date: December 11, 2014
    Applicants: University of Fukui, Kuraray Co., Ltd.
    Inventors: Teruo Hori, Tomoki Sakai, Hideki Hoshiro, Atsumi Adachi, Yasuro Araida, Sumito Kiyooka
  • Patent number: 8631900
    Abstract: A sound insulation floor structure comprises a floor backing member, a floor finishing layer, and an intermediate layer between the floor backing member and the floor finishing layer, the intermediate layer comprising a buffer member comprising a nonwoven structure. The nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers. For example, the sound insulation floor structure may comprise, in sequence, a floor backing member 1, a buffer layer 2, an air layer 3, a hard layer 4, and a floor finishing layer 5. In the floor structure, a support member 6 is disposed between the buffer layer 2 and the hard layer 4. The support member may occupy 10 to 70% of a floor area. The sound insulation floor structure prevents subsidence of a floor member due to walking, achieves comfortableness to walk, and has improved floor impact sound insulation.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: January 21, 2014
    Assignee: Kuraray Co., Ltd.
    Inventors: Noboru Miyake, Masahiko Takamatsu, Hideki Kanezako, Kazutoshi Hirata, Kohei Hayashi, Sumito Kiyooka, Atsumi Adachi, Masaru Koike, Satoshi Koizumi
  • Publication number: 20130025965
    Abstract: A sound insulation floor structure comprises a floor backing member, a floor finishing layer, and an intermediate layer between the floor backing member and the floor finishing layer, the intermediate layer comprising a buffer member comprising a nonwoven structure. The nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers. For example, the sound insulation floor structure may comprise, in sequence, a floor backing member 1, a buffer layer 2, an air layer 3, a hard layer 4, and a floor finishing layer 5. In the floor structure, a support member 6 is disposed between the buffer layer 2 and the hard layer 4. The support member may occupy 10 to 70% of a floor area. The sound insulation floor structure prevents subsidence of a floor member due to walking, achieves comfortableness to walk, and has improved floor impact sound insulation.
    Type: Application
    Filed: March 3, 2011
    Publication date: January 31, 2013
    Applicant: KURARAY CO., LTD.
    Inventors: Noboru Miyake, Masahiko Takamatsu, Hideki Kanezako, Kazutoshi Hirata, Kohei Hayashi, Sumito Kiyooka, Atsumi Adachi, Masaru Koike, Satoshi Koizumi