Abstract: A workpiece inspection device includes an inspection chamber that is filled with an inspection gas different from atmospheric air and accommodates a workpiece, an inspection unit that inspects the workpiece accommodated in the inspection chamber, and a gas leak suppression structure that suppresses a leak of the inspection gas in the inspection chamber that occurs when the workpiece is inserted into and removed from the inspection chamber.

Abstract: A contact combustion type gas sensor includes: a substrate; a catalytic layer that includes a catalyst for accelerating a chemical reaction of a detection target gas; a temperature measuring element that detects at least an increase in a temperature of the catalytic layer; and a support member that transfers heat generated by the chemical reaction toward the temperature measuring element and includes a support leg and a support body that are connected with each other, the support leg being provided between the substrate and the catalytic layer and separating the catalytic layer from the substrate, and the support body supporting the catalytic layer.

Abstract: A catalysis combustion type gas sensor that detects an inflammable gas includes a heat-insulating portion; a heater that is formed on the heat-insulating portion; a gas reaction film that is formed on the heater on the heat-insulating portion and includes a carrier carrying a combustion catalyst for the inflammable gas; a temperature-measuring element that is formed in the vicinity of the gas reaction film on the heat-insulating portion; and a soaking portion that is formed on the heat-insulating portion and is arranged between the heat-insulating portion and the gas reaction film. The soaking portion is configured so as to decentralize heat transferred to the soaking portion in the entire soaking portion.

Abstract: A catalysis combustion type gas sensor that detects an inflammable gas includes a heat-insulating portion; a heater that is formed on the heat-insulating portion; a gas reaction film that is formed on the heater on the heat-insulating portion and includes a carrier carrying a combustion catalyst for the inflammable gas; a temperature-measuring element that is formed in the vicinity of the gas reaction film on the heat-insulating portion; and a soaking portion that is formed on the heat-insulating portion and is arranged between the heat-insulating portion and the gas reaction film. The soaking portion is configured so as to decentralize heat transferred to the soaking portion in the entire soaking portion.

Abstract: A vibration sensor for a musical instrument includes a substrate, a first electrode film that is formed on the substrate, a piezoelectric film that is formed on the first electrode film, a second electrode film that is formed on the piezoelectric film, an insulating film that is formed on the second electrode film, and a shield film that is formed on the insulating film, the shield film being made of a conductive material, electrically connected to the first electrode film and insulated from the second electrode film by the insulating film.

Abstract: One-dimensional acceleration sensor includes: a semiconductor substrate having a constant thickness; parallel second through trenches through the substrate defining a flexible beam therebetween, having width significantly smaller than thickness; four piezo resistors formed at four corner regions of the flexible beam; first through trench through the substrate, continuous with ends of the first through trenches to define a weight continuous with one end of the flexible beam, including a pair of symmetrical first portions sandwiching the flexible beam and a second portion coupling the first portions and one end of the flexible beam, and having a center of gravity at an intermediate position on a longitudinal center line of the flexible beam; and one-layer wirings formed above the flexible beam, serially connecting piezo resistors at a same edge, and leading interconnection points generally along a longitudinal direction of the flexible beam.

Abstract: A vibration sensor for a musical instrument includes a substrate, a first electrode film that is formed on the substrate, a piezoelectric film that is formed on the first electrode film, a second electrode film that is formed on the piezoelectric film, an insulating film that is formed on the second electrode film, and a shield film that is formed on the insulating film, the shield film being made of a conductive material, electrically connected to the first electrode film and insulated from the second electrode film by the insulating film.

Abstract: One-dimensional acceleration sensor includes: a semiconductor substrate having a constant thickness; parallel second through trenches through the substrate defining a flexible beam therebetween, having width significantly smaller than thickness; four piezo resistors formed at four corner regions of the flexible beam; first through trench through the substrate, continuous with ends of the first through trenches to define a weight continuous with one end of the flexible beam, including a pair of symmetrical first portions sandwiching the flexible beam and a second portion coupling the first portions and one end of the flexible beam, and having a center of gravity at an intermediate position on a longitudinal center line of the flexible beam; and one-layer wirings formed above the flexible beam, serially connecting piezo resistors at a same edge, and leading interconnection points generally along a longitudinal direction of the flexible beam.

Abstract: A fine mold comprises a regeneration target film forming a convex part of a formation surface, and a light shielding unit that is configured deeper than a bottom of the formation surface and that regenerates the regeneration target film. A manufacturing cost of a product having a three-dimensional structure can be reduced.

Abstract: An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.

Abstract: A fine mold comprises a regeneration target film forming a convex part of a formation surface, and a light shielding unit that is configured deeper than a bottom of the formation surface and that regenerates the regeneration target film. A manufacturing cost of a product having a three-dimensional structure can be reduced.

Abstract: Trench separating mass body and support is defined in support substrate, and flexible beam cross is defined in semiconductor layer, in SOI. The semiconductor layer and intermediate insulator of the SOI are etched in crossed region of the flexible beam cross and in a looped region above the support body. Connector layer is buried in the etched recesses. The semiconductor layer is patterned into the flexible beam cross above the mass body. The trench is etched in the support substrate exposing the intermediate insulator, which is then etched to form a gap between the mass body and flexible beam cross. The connector layer in the crossed region couples the mass body and flexible beam cross, and the connector layer outside the flexible beam cross couples the flexible beam cross and support body. Stopper is formed by extending the connector layer, or leaving the semiconductor layer, above the mass body corners.

Abstract: A fine mold comprises a regeneration target film forming a convex part of a formation surface, and a light shielding unit that is configured deeper than a bottom of the formation surface and that regenerates the regeneration target film. A manufacturing cost of a product having a three-dimensional structure can be reduced.

Abstract: A fine mold comprises a regeneration target film forming a convex part of a formation surface, and a light shielding unit that is configured deeper than a bottom of the formation surface and that regenerates the regeneration target film. A manufacturing cost of a product having a three-dimensional structure can be reduced.

Abstract: Provided that an x-axis, a y-axis and a z-axis are three axes of a rectangular coordinate system, a micro electro mechanical systems element comprises a support section whose length in the y-direction is shorter than a length in the x-direction, parallel arranged two film-like beam sections whose length in the y-direction is shorter than a length in the x-direction, a weight section, whose length in the y-direction is shorter than a length in the x-direction, spanning centers of the two beam sections and comprising a connecting part spanning the two beam sections, two projection parts projecting to opposite directions from the connecting part in a space between the two beam sections, and a plurality of distortion detectors which are placed on each beam section and detect distortion corresponding to deformation of the beam sections to measure xyz components of a vector corresponding to force acting on the weight section.

Abstract: A conventional inspection probe has posed such problems that, when a pitch is as fine as up to 40 ?m, a positional accuracy is difficult to ensure depending on constituting materials and a production method, pin breaking occurs when fine-diameter pins contact, a good contact cannot be obtained due to an insufficient contact, an durability is insufficient. An inspection probe having a probe structure comprising an elastic probe pin, a wiring layer carrying substrate, a backup plate to install a substrate thereon, an inspection substrate and a flexible substrate, characterized in that a good-contact material layer according to the electrode material of a semiconductor device is formed at the tip end of a probe pin and a wiring layer has a structure formed of a low-resistance metal layer, with the good-contact material layer being separated from the low-resistance metal layer. Such a structure can provide very high contact reliability and mechanical durability at a pitch as very fine as up to 40 ?m.

Abstract: An electronic component includes a substrate, an interconnection element, and a connector. The interconnection element has conductivity. The interconnection element is present over the substrate. The connector is present on the interconnection element. The connector may further include, but is not limited to, a base, at least one stopper, and at least one sloped guiding surface. The base projects from the interconnection element in a first direction that is vertical to the surface of the substrate. At least one stopper projects from the base in a second direction that is parallel to the surface of the substrate. The one stopper has a stopper surface.

Abstract: A motion sensor may include, but is not limited to, a substrate, a beam, a weight, a piezoelectric film, and a first electrode. The beam is supported by the substrate. The beam is elastically deformable. The weight is attached to the beam. The piezoelectric film follows and extends along at least a part of the beam. The piezoelectric film may include, but is not limited to, an organic piezoelectric film. The first electrode is disposed on the piezoelectric film.

Abstract: A fine mold comprises a regeneration target film forming a convex part of a formation surface, and a light shielding unit that is configured deeper than a bottom of the formation surface and that regenerates the regeneration target film. A manufacturing cost of a product having a three-dimensional structure can be reduced.

Abstract: A conventional inspection probe has posed such problems that, when a pitch is as fine as up to 40 ?m, a positional accuracy is difficult to ensure depending on constituting materials and a production method, pin breaking occurs when fine-diameter pins contact, a good contact cannot be obtained due to an insufficient contact, an durability is insufficient. An inspection probe having a probe structure comprising an elastic probe pin, a wiring layer carrying substrate, a backup plate to install a substrate thereon, an inspection substrate and a flexible substrate, characterized in that a good-contact material layer according to the electrode material of a semiconductor device is formed at the tip end of a probe pin and a wiring layer has a structure formed of a low-resistance metal layer, with the good-contact material layer being separated from the low-resistance metal layer. Such a structure can provide very high contact reliability and mechanical durability at a pitch as very fine as up to 40 ?m.