Abstract: An arithmetic device and an electronic device having small power consumption is provided. An arithmetic device and an electronic device capable of high-speed operation is provided. An arithmetic device and an electronic device capable of suppressing heat generation is provided. The arithmetic device includes a first arithmetic portion and a second arithmetic portion. The first arithmetic portion includes a first CPU core and a second CPU core. The second arithmetic portion includes a first GPU core and a second GPU core. The CPU cores each have a power gating function and each include a first data retention circuit electrically connected to a flip-flop. The first GPU core includes a second data retention circuit capable of retaining an analog value and reading out the analog value as digital data of two or more bits. The second GPU core includes a third data retention circuit capable of retaining a digital value and reading out the digital value as digital data of one bit.

Abstract: A bag supply system supplies a packaging bag to a storing position where a sandwich is stored, the bag supply system which includes an opening forming device configured to form an opening at a bag opening of the packaging bag, and a bag opening device configured to grip each of a first side edge portion and a second side edge portion of the opening in an opening direction, the opening direction being a direction in which the opening is opened, and open the bag opening by widening the opening in the opening direction.

Abstract: A layered food packaging system includes: a carrier device configured to convey a sandwich in a horizontal posture in which a layering direction of the sandwich is substantially vertical; a temporary placement table configured to temporarily place the sandwich thereon in a vertical posture in which the layering direction of the sandwich is substantially horizontal; a first robot and a second robot configured to grip the sandwich that is conveyed by the carrier device, lift the sandwich from the carrier device, change the posture of the sandwich from the horizontal posture to the vertical posture, and temporarily place the sandwich on the temporary placement table; and a third robot configured to grip the sandwich that is temporarily placed on the temporary placement table, and insert the sandwich into a bag for packaging the layered food.

Abstract: A bag supply system supplies a packaging bag to a storing position where a sandwich is stored, the bag supply system which includes an opening forming device configured to form an opening at a bag opening of the packaging bag, and a bag opening device configured to grip each of a first side edge portion and a second side edge portion of the opening in an opening direction, the opening direction being a direction in which the opening is opened, and open the bag opening by widening the opening in the opening direction.

Abstract: A layered food packaging system includes: a carrier device configured to convey a sandwich in a horizontal posture in which a layering direction of the sandwich is substantially vertical; a temporary placement table configured to temporarily place the sandwich thereon in a vertical posture in which the layering direction of the sandwich is substantially horizontal; a first robot and a second robot configured to grip the sandwich that is conveyed by the carrier device, lift the sandwich from the carrier device, change the posture of the sandwich from the horizontal posture to the vertical posture, and temporarily place the sandwich on the temporary placement table; and a third robot configured to grip the sandwich that is temporarily placed on the temporary placement table, and insert the sandwich into a bag for packaging the layered food.

Abstract: A motor controller to control a motor includes a position controller, a speed controller, a first integrator, and a second integrator. The position controller is configured to generate a speed command based on a position error between a position command and a motor position. The speed controller is configured to generate a torque command to be input to the motor based on a speed error between the speed command and a motor speed. The first integrator is configured to calculate an integral value of the position error to be added to the position error. The second integrator is configured to calculate an integral value of the speed error to be added to the speed error.

Abstract: A motor controller to control a motor includes a position controller, a speed controller, a first integrator, and a second integrator. The position controller is configured to generate a speed command based on a position error between a position command and a motor position. The speed controller is configured to generate a torque command to be input to the motor based on a speed error between the speed command and a motor speed. The first integrator is configured to calculate an integral value of the position error to be added to the position error. The second integrator is configured to calculate an integral value of the speed error to be added to the speed error.

Abstract: The invention is aimed at providing a bonding structure of a copper-based bonding wire, realizing low material cost, high productivity in a continuous bonding in reverse bonding for wedge bonding on bumps, as well as excellent reliability in high-temperature heating, thermal cycle test, reflow test, HAST test or the like. The bonding structure is for connecting the bonding wire onto a ball bump formed on an electrode of a semiconductor device, the bonding wire and the ball bump respectively containing copper as a major component thereof.

Abstract: A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.

Abstract: A bonding structure and a copper bonding wire for semiconductor device include a ball-bonded portion formed by bonding to the aluminum electrode a ball formed on a front end of the copper bonding wire. After being heated at any temperature between 130° C. and 200° C., the ball-bonded portion exhibits a relative compound ratio R1 of 40-100%, the relative compound ratio R1 being a ratio of a thickness of a Cu—Al intermetallic compound to thicknesses of intermetallic compounds that are composed of Cu and Al and formed on a cross-sectional surface of the ball-bonded portion.

Abstract: A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.

Abstract: It is an object of the present invention to provide a bonding structure and a copper bonding wire for semiconductor that are realizable at an inexpensive material cost, superior in a long-term reliability of a bonded portion bonded to an Al electrode, and suitable for use in a vehicle-mounted LSI. A ball-bonded portion is formed by bonding to the aluminum electrode a ball formed on a front end of the copper bonding wire. After being heated at any temperature between 130° C. and 200° C., the aforementioned ball-bonded portion exhibits a relative compound ratio R1 of 40-100%, the relative compound ratio R1 being a ratio of a thickness of a Cu—Al intermetallic compound to thicknesses of intermetallic compounds that are composed of Cu and Al and formed on a cross-sectional surface of the ball-bonded portion.

Abstract: There is provided a bonding wire which does not cause a leaning failure or the like. A semiconductor mounting bonding wire has a breaking elongation of 7 to 20%, and stress at 1% elongation is greater than or equal to 90% of a tensile strength and is less than or equal to 100% thereof.

Abstract: The invention is aimed at providing a bonding structure of a copper-based bonding wire, realizing low material cost, high productivity in a continuous bonding in reverse bonding for wedge bonding on bumps, as well as excellent reliability in high-temperature heating, thermal cycle test, reflow test, HAST test or the like. The bonding structure is for connecting the bonding wire onto a ball bump formed on an electrode of a semiconductor device, the bonding wire and the ball bump respectively containing copper as a major component thereof.

Abstract: There is provided a bonding wire which does not cause a leaning failure or the like. A semiconductor mounting bonding wire has a breaking elongation of 7 to 20%, and stress at 1% elongation is greater than or equal to 90% of a tensile strength and is less than or equal to 100% thereof.

Abstract: An optical data reader having an improved servo system for maintaining an orthogonal relation between the optical axis of an irradiating light beam and the surface of a recording disc onto which the light beam is directed. The data reader includes a holding mechanism for the optical system, movable in the radial direction of the disc, and a tilt servomechanism. The tilt servomechanism includes flexible members for supporting an objective lens of the optical system of the reader so as to be rotatable and movable in a plane including the rotational axis of the disc, a detector for detecting deviation from the orthogonal, and a drive device for moving the objective lens in accordance with the detection signal.

Abstract: A dual drive system for an automatic record player of a type in which programmed music selection can be carried out. The drive system includes a mechanical first drive system for mechanically driving the pickup arm and an electromagnetic second drive system for driving the pickup arm using an electromagnetic force. Circuitry is provided for selecting between the two drive systems in accordance with the selected operational mode of the player or the position of the pickup arm.

Abstract: A drive control system for a linear motor having a stator and a sliding member capable of sliding along the stator. A position detector comprises an arrangement of light emitting elements and a detector, or the converse to produce a position signal. A comparator compares the position signal with a reference signal to produce an output drive signal for the linear motor.

Abstract: A linear-tracking pick-up arm drive assembly of an audio or video disc player, wherein the movement of the pick-up arm of the disc player is monitored by a photoelectric, photomagnetic or electrostatic pick-up device for controlling the current or voltage to be supplied to an electrically operated drive unit such as a linear motor or a rotary motor for driving the pick-up arm to move linearly with respect to a recording disc.

Abstract: An electromagnetic linear-motion device in which a field magnet unit mounted on a movable unit slidably supported on elongated guide members is movable longitudinally between and along a pair of spaced parallel stationary linear armatures so that any objectionable forces producing increased frictional forces between the movable unit and the guide members are cancelled by each other.