Patents by Inventor Atsuo Kajima

Atsuo Kajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processing method and processing apparatus
    Patent number: 9352542
    Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: May 31, 2016
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshihiro Inao, Atsuo Kajima, Takuma Hasegawa, Koki Tamura, Shigeru Yokoi
  • PROCESSING METHOD AND PROCESSING APPARATUS
    Publication number: 20150013917
    Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.
    Type: Application
    Filed: January 11, 2013
    Publication date: January 15, 2015
    Inventors: Yoshihiro Inao, Atsuo Kajima, Takuma Hasegawa, Koki Tamura, Shigeru Yokoi