Patents by Inventor Atsuo Kimura
Atsuo Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240067285Abstract: A battery frame is fixed to a chassis and a battery pack is assembled to the battery frame. The battery frame includes a pair of crossbars and a pair of side bars. The crossbars extend in the vehicle width direction while being spaced apart in the vehicle front-rear direction, and have both ends in the vehicle width direction fixed to the side members. The side bars extend in the vehicle front-rear direction while being spaced apart in the vehicle width direction, and have front ends and rear ends detachably fixed to the crossbars.Type: ApplicationFiled: June 12, 2023Publication date: February 29, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akira ICHIKAWA, Yusuke KAMIJO, Atsuo TAKEUCHI, Makito MURAMATSU, Kayo KIMURA, Hiroshi OGIHARA, Nana TAIE
-
Publication number: 20230274956Abstract: A substrate processing apparatus according to the present invention includes: a processing tank that stores a processing liquid and accommodates a plurality of substrates; a bubble forming section that includes a plurality of bubble pipes, wherein each of the plurality of bubble pipes is divided into a tubular first discharge unit and a tubular second discharge unit that is coaxial with the first discharge unit, wherein one end on a divided side of the first discharge unit and one end on the divided side of the second discharge unit is closed and a plurality of gas discharge holes are formed on the first and second discharge units, and the plurality of bubble pipes are disposed at an interval in a horizontal direction orthogonal to the arrangement direction below the plurality of substrates to be accommodated in the processing tank; and a plurality of flow rate adjustment units that are provided corresponding to each of the first discharge units and each of the second discharge units and independently adjustType: ApplicationFiled: November 5, 2020Publication date: August 31, 2023Inventors: Atsuo KIMURA, Hirofumi SHOMORI
-
Patent number: 10615059Abstract: A substrate processing device (10) for processing a plurality of substrates disposed at predetermined intervals includes a processing bath (12) that is configured to store processing liquid, and has a side surface (13) extending along a thickness direction of the plurality of substrates, and a discharge unit (14) that is disposed in a bottom portion of the processing bath (12), and is configured to discharge processing liquid in an upward direction toward the side surface (13).Type: GrantFiled: June 13, 2016Date of Patent: April 7, 2020Assignee: J.E.T. CO., LTD.Inventors: Hirofumi Shomori, Atsuo Kimura
-
Patent number: 10186436Abstract: Provided are a substrate processing system and a substrate processing method that can obtain expected etching rate and selection ratio, and perform stable processing. A substrate (11) is soaked in processing liquid (12) stored in a processing bath (14). The processing bath (14) is sealed by cover members (21a and 21b), and the inside is pressurized by water vapor from the heated processing liquid (12). Pure water is consecutively added to the processing liquid (12). Internal pressure of the processing bath (14) is measured, a degree of opening of an exhaust valve (41) is increased or decreased based on the internal pressure (Pa), the internal pressure is kept at constant, a water addition amount of the pure water is increased or decreased based on the internal pressure (Pa), and the substrate (11) is processed using the processing liquid (12) at constant concentration and constant temperature.Type: GrantFiled: June 14, 2016Date of Patent: January 22, 2019Assignee: J.E.T. CO., LTD.Inventors: Hirofumi Shomori, Atsuo Kimura
-
Publication number: 20180190515Abstract: A substrate processing device (10) for processing a plurality of substrates disposed at predetermined intervals includes a processing bath (12) that is configured to store processing liquid, and has a side surface (13) extending along a thickness direction of the plurality of substrates, and a discharge unit (14) that is disposed in a bottom portion of the processing bath (12), and is configured to discharge processing liquid in an upward direction toward the side surface (13).Type: ApplicationFiled: June 13, 2016Publication date: July 5, 2018Inventors: Hirofumi SHOMORI, Atsuo KIMURA
-
Publication number: 20180174856Abstract: Provided is a substrate processing device including a processing bath (12) configured to store processing liquid, and to process a plurality of substrates (24) disposed at predetermined intervals, first and second discharge units (14b1 and 14b2) including a flow path (14a) in which the processing liquid flows in a thickness direction of the plurality of substrates (12), a plurality of openings (15) formed along the flow path, and leading end surfaces (161 and 162) closing a leading end of the flow path (14a), and a supply path (18) that is configured to supply the processing liquid to proximal ends (14bs and 14be) of the first discharge unit (14b1) and the second discharge unit (14b2), and includes a supply port (20), and a length from the supply port (20) to the leading end surface (162) of the second discharge unit (14b2) is substantially equal to a length from the supply port (20) to the leading end surface (161) of the first discharge unit (14b1).Type: ApplicationFiled: June 14, 2016Publication date: June 21, 2018Inventors: Hirofumi SHOMORI, Atsuo KIMURA
-
Publication number: 20180158700Abstract: Provided are a substrate processing system and a substrate processing method that can obtain expected etching rate and selection ratio, and perform stable processing. A substrate (11) is soaked in processing liquid (12) stored in a processing bath (14). The processing bath (14) is sealed by cover members (21a and 21b), and the inside is pressurized by water vapor from the heated processing liquid (12). Pure water is consecutively added to the processing liquid (12). Internal pressure of the processing bath (14) is measured, a degree of opening of an exhaust valve (41) is increased or decreased based on the internal pressure (Pa), the internal pressure is kept at constant, a water addition amount of the pure water is increased or decreased based on the internal pressure (Pa), and the substrate (11) is processed using the processing liquid (12) at constant concentration and constant temperature.Type: ApplicationFiled: June 14, 2016Publication date: June 7, 2018Inventors: Hirofumi SHOMORI, Atsuo KIMURA
-
Patent number: 5777713Abstract: A liquid crystal display is disclosed having a substrate on which a pixel array region is formed. The pixel array region includes display electrodes. The display further includes a transparent counter substrate over which a transparent electrode is formed. The transparent electrode faces the pixel array on opposite side of the display electrodes. Spacers are formed on the outside region of the pixel array. Alternatively, the spacers are formed in light shielding regions of the pixel array in a width smaller than the width of the light shielding regions. The spacers are formed of a photo sensitive material having adhesive properties. The spacers bond the substrate to the transparent counter substrate and maintain a prescribed cell gap.Type: GrantFiled: June 17, 1996Date of Patent: July 7, 1998Assignee: International Business Machines CorporationInventor: Atsuo Kimura
-
Patent number: 5737052Abstract: A liquid crystal display is provided which reduces the substrate cost and shortens the wiring length to drive elements thereby decreasing wiring resistance and load on the drive power supply. A pixel array board is also provided, as well as a manufacturing process and a method for forming an image with the pixel array board. A silicon substrate 1 is used as an LCD pixel array. A through hole is formed in the silicon substrate 1 by means of anisotropic etching or the like. Formed in the through hole are an insulating layer 5 and a wiring conductor layer (for example, Cr--Cu--Au layer) 8 with a predetermined pattern. The wiring conductor layer 8 is bonded to a conductor layer (for example, Cr--Cu--Au layer) 8' of a drive element 10 through a solder layer 9, or by means of thermo-compression bonding between the Cr--Cu--Au layer 8 and the Cr--Cu--Au layer 8' to connect the LCD pixel array on the surface of silicon substrate 1 to the drive element 10 and the like on the bottom of silicon substrate 1.Type: GrantFiled: December 7, 1995Date of Patent: April 7, 1998Assignee: International Business Machines CorporationInventor: Atsuo Kimura
-
Patent number: 5723347Abstract: This discloses a probe structure which does not rely on cantilevered wire and which has controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, on a film stretched across a respective plurality of cavities established in a substrate. The cavities and the contact electrodes are aligned to one another and both positionally match selected I/O pads existing on a semi-conductor chip to be probed.Also disclosed is a probe utilizing a cantilevered, metalized oxide tongue extending across a cavity.Type: GrantFiled: October 24, 1996Date of Patent: March 3, 1998Assignee: International Business Machines Corp.Inventors: Toshiki Hirano, Atsuo Kimura, Shinichiro Mori
-
Patent number: 5625298Abstract: This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, on a film stretched across a respective plurality of cavities established in a substrate. The cavities and the contact electrodes are aligned to one another and both positionally match selected I/O pads existing on a semi-conductor chip to be probed.Also disclosed is a probe utilizing a cantilevered, metalized oxide tongue extending across a cavity.Type: GrantFiled: October 12, 1994Date of Patent: April 29, 1997Assignee: International Business Machines Corp.Inventors: Toshiki Hirano, Atsuo Kimura, Shinichiro Mori