Patents by Inventor Atsuo Kurokawa

Atsuo Kurokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit, mobile module, and message communication method
    Patent number: 7365642
    Abstract: A semiconductor integrated circuit including a contact-type communication unit for acquiring a contact-type message in a contact communication from an external apparatus, a contactless-type communication unit for acquiring a contactless-type message in a contactless communication, a contact-type message processor for processing the contact-type message, a contactless-type message processor for processing the contactless-type message, and a message relay unit for acquiring the contact-type message from the contact-type communication unit to supply the contact-type message to the contact-type message processor and acquiring the contactless-type message from the contactless-type communication unit to supply the contactless-type message to the contactless-type message processor.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: April 29, 2008
    Assignee: Sony Corporation
    Inventors: Yo Tabayashi, Atsushi Funakiri, Kanahiro Shirota, Atsuo Kurokawa
  • Semiconductor integrated circuit, mobile module, and message communication method
    Publication number: 20050191968
    Abstract: A semiconductor integrated circuit including a contact-type communication unit for acquiring a contact-type message in a contact communication from an external apparatus, a contactless-type communication unit for acquiring a contactless-type message in a contactless communication, a contact-type message processor for processing the contact-type message, a contactless-type message processor for processing the contactless-type message, and a message relay unit for acquiring the contact-type message from the contact-type communication unit to supply the contact-type message to the contact-type message processor, and for acquiring the contactless-type message from the contactless-type communication unit to supply the contactless-type message to the contactless-type message processor.
    Type: Application
    Filed: February 8, 2005
    Publication date: September 1, 2005
    Applicant: Sony Corporation
    Inventors: Yo Tabayashi, Atsushi Funakiri, Kanahiro Shirota, Atsuo Kurokawa
  • Method of forming a via hole filled with a conducting material, and separater from a gate structure by an insulating material
    Patent number: 5985745
    Abstract: A semiconductor device fabricating method is capable of securing an increased margin for absorbing an error in aligning a viahole with an underlying wiring layer when forming a viahole in a layer insulating film to connect an upper wiring layer overlying the layer insulating film and a lower wiring layer underlying the layer insulating film to enable the miniaturization of a pattern and the miniaturization of the semiconductor device. The semiconductor device fabricating method forms a first Si.sub.3 N.sub.4 film between a first wiring layer and a second wiring layer, and a second layer insulating film, a third layer insulating film and a fourth layer insulating film all of SiO.sub.2 over the second wiring layer. When forming a third viahole through the layer insulating films so as to reach the second wiring layer, the layer insulating films are etched in a high SiO.sub.2 /Si.sub.3 N.sub.4 selectivity of about twenty.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: November 16, 1999
    Assignee: Sony Corporation
    Inventor: Atsuo Kurokawa