Abstract: In an electronic apparatus having a liquid cooling system, and enabling to obtain the optical cooling characteristic or capacitor with an aid of a radiator, which can be disposed or located fitting to a narrow space within a housing thereof, wherein a CPU 200 in deed of cooling thereof is installed within the housing 100, and the liquid cooling system for cooling the CPU comprises a cooling jacket 50 and a radiator therein, and wherein the radiator has a pair of headers 62 and 62, being constructed with disposing a large number of metal thin tubes 61, 61 . . . therebetween, aligning in parallel to each other, and can be change in an outer configuration thereof, easily and freely, and therefore it can be positioned even in the narrow space. Further, a cooling fan 64 or 66 for cooling the radiator 60 compulsively may be disposed therein, and in that case; it is also possible to maintain a position for setting up a motor 65 or 67 for rotationally driving the fan, including therein.

Abstract: For providing an electronic apparatus, having a cooling system therein, for enabling cooling operation of a CPU 200, which is mounted within a housing 100 of the apparatus and needs cooling thereof, the cooling system for cooling the CPU has a cooling jacket 50, a radiator 60, and a circulation pump 70, wherein the cooling jacket comprises a base-plate portion 51, being made of a material superior in heat transfer, such as, copper or the like, and formed with a flow inlet 54 and a flow outlet 55 for the liquid coolant, as well as, a flow passage formed in “U” or “I” shape within an inside thereof, and a cover portion 52, and in a portion of the flow passage of the “U” or “I” shape is disposed a coolant division portion 56 or/and 57, being made up by combining a plural number of pieces of fine tubes in a bundle, each of which is also made of a material superior in the heat transfer, such as copper or the like, through brazing.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: In a semiconductor integrated circuit device and a semiconductor integrated circuit chip, being provided for achieving small-sizing and light-weight of the entire cooling structure thereof, without lowering the permissible temperature for an integrated circuit package, a circuit forming layer 2, on which are formed a large number of circuits, is formed on one side surface of a plate-like semiconductor chip 101, and on the other side surface opposing to that forming the circuits thereon, a heat transfer layer 15 is connected with in one body. This heat transfer layer 15 is made of a material similar to that of the semiconductor chip, and within an inside thereof are formed passage ducts 3 to build up a closed flow passage. Within this closed flow passage is enclosed an operating fluid 4, such as, a water or the like, and is provided a resistor film 5 for building up a driving means of the operating fluid, in contact with the operating fluid.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

Abstract: It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which a heating region is built in the multilayered wiring substrate of the semiconductor package or module on the side near to the input/output pins, the semiconductor package or module and the cooler mounted on the package or module are placed in a moisture proof case, a heat insulating material is filled in the gaps between the moisture proof case, semiconductor package or module and cooler, and a heater is provided on the outer periphery of the heat insulating material.

Abstract: Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module.

Abstract: The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Abstract: A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.