Patents by Inventor Atsuo Wada

Atsuo Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5347140
    Abstract: A resonant electron transfer device includes a plurality of units each of which has of at least one one-dimensional quantum wire having a quantum well elongated in a direction, a zero-dimensional quantum dot having a base quantization level higher than that of the one-dimensional quantum wire an electrode for controlling respective internal levels of the quantum wire and dot wherein the quantum wire and dot forming one unit is connected via a potential barrier capable of exhibiting a tunnel effect therebetween.
    Type: Grant
    Filed: August 27, 1992
    Date of Patent: September 13, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshihiko Hirai, Kiyoshi Morimoto, Yasuaki Terui, Atsuo Wada, Kenji Okada, Juro Yasui, Masaaki Niwa
  • Patent number: 5296719
    Abstract: A quantum wire is formed at the top of triangular protrusion of silicon substrate. A quantum wire is isolated from the substrate by silicon oxide layers. A quantum wire is isolated from the substrate by impurity layers of a conduction type different from that of the substrate. An insulator film and a gate electrode are formed at the edge of triangular protrusion of a silicon substrate, and a quantum wire is induced by applying a voltage to the gate electrode. A quantum wire structure is fabricated by forming saw-tooth-like protrusions having (111) side planes by performing anisotropic crystalline etching and by oxidizing the silicon substrate with use of the oxide protection film to remain only around the top of the protrusions unoxidized. In another method, an oxide film is formed except around the top of the protrusions whereby a quantum wire is formed at the unoxidized region. In a different method, impurity layers are formed except around the top of the protrusions by ion implantation.
    Type: Grant
    Filed: July 20, 1992
    Date of Patent: March 22, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshihiko Hirai, Juro Yasui, Yasuaki Terui, Kiyoshi Morimoto, Atsuo Wada, Kenji Okada, Shin Hashimoto, Shinji Odanaka, Masaaki Niwa, Kaoru Inoue
  • Patent number: 5244828
    Abstract: The method of fabricating a quantum device of the invention includes the steps of: forming a quantum dot having side faces on a first insulating layer; forming a second insulating layer which can function as a tunnel film, on at least the side faces of the quantum dot; depositing a non-crystal semiconductor layer on the first insulating layer so as to cover the quantum dot; removing at least a portion of the non-crystal semiconductor layer which is positioned above the quantum dot; single-crystallizing a predetermined portion of the non-crystal semiconductor layer which is in contact with the second insulating layer; and forming a quantum wire which includes the single-crystallized semiconductor portion and the quantum dot, on the first insulating layer.
    Type: Grant
    Filed: August 25, 1992
    Date of Patent: September 14, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Okada, Yasuaki Terui, Juro Yasui, Yoshihiko Hirai, Masaaki Niwa, Atsuo Wada, Kiyoshi Morimoto