Patents by Inventor Atsushi Asami

Atsushi Asami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6855759
    Abstract: Fine silica particles surface-treated with a silane and having primary particles having a particle diameter of from 0.01 to 5 ?m, which fine silica particles fulfill the following conditions (i) and (ii), a process for their production and an organic resin composition containing such particles as a component are provided. (i) When an organic compound which is liquid at room temperature and has a dielectric constant of from 1 to 40 F/m and fine silica particles are mixed in a weight ratio of 5:1 and shaked, the fine silica particles disperse uniformly in the organic compound, and (ii) the quantity of primary particles remaining as primary particles when methanol is evaporated under heating by means of an evaporator from a dispersion prepared by dispersing the fine silica particles in methanol and thereafter the particles are held at a temperature of 100° C. for 2 hours, is in a percentage of at least 20% based on the quantity of primary particles originally present.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: February 15, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Muneo Kudo, Shoji Ichinohe, Atsushi Asami, Mitsuo Asai, Kazuyuki Matsumura, Masaki Tanaka
  • Publication number: 20030134950
    Abstract: Fine silica particles surface-treated with a silane and having primary particles having a particle diameter of from 0.01 to 5 &mgr;m, which fine silica particles fulfill the following conditions (i) and (ii), a process for their production and an organic resin composition containing such particles as a component are provided. (i) When an organic compound which is liquid at room temperature and has a dielectric constant of from 1 to 40 F/m and fine silica particles are mixed in a weight ratio of 5:1 and shaked, the fine silica particles disperse uniformly in the organic compound, and (ii) the quantity of primary particles remaining as primary particles when methanol is evaporated under heating by means of an evaporator from a dispersion prepared by dispersing the fine silica particles in methanol and thereafter the particles are held at a temperature of 100° C. for 2 hours, is in a percentage of at least 20% based on the quantity of primary particles originally present.
    Type: Application
    Filed: October 31, 2002
    Publication date: July 17, 2003
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Muneo Kudo, Shoji Ichinohe, Atsushi Asami, Mitsuo Asai, Kazuyuki Matsumura, Masaki Tanaka
  • Patent number: 6521290
    Abstract: Fine silica particles surface-treated with a silane and having primary particles having a particle diameter of from 0.01 to 5 &mgr;m, which fine silica particles fulfill the following conditions (i) and (ii), a process for their production and an organic resin composition containing such particles as a component are provided. (i) When an organic compound which is liquid at room temperature and has a dielectric constant of from 1 to 40 F/m and fine silica particles are mixed in a weight ratio of 5:1 and shaked, the fine silica particles disperse uniformly in the organic compound, and (ii) the quantity of primary particles remaining as primary particles when methanol is evaporated under heating by means of an evaporator from a dispersion prepared by dispersing the fine silica particles in methanol and thereafter the particles are held at a temperature of 100° C. for 2 hours, is in a percentage of at least 20% based on the quantity of primary particles originally present.
    Type: Grant
    Filed: May 17, 1999
    Date of Patent: February 18, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Muneo Kudo, Shoji Ichinohe, Atsushi Asami, Mitsuo Asai, Kazuyuki Matsumura, Masaki Tanaka