Abstract: A battery module includes: a plurality of battery cells each including a metal layer and a heat seal layer, the plurality of battery cells having a laminate film in which an electrode body is accommodated and a heat seal layer in a peripheral edge portion is joined; a case in which the battery cells are accommodated in a state of being laminated in a thickness direction; and a heat conductive member provided on an inner wall of the case so as to be in contact with the metal layer exposed from the peripheral edge portion and configured to dissipate heat from the battery cells.

Abstract: A battery module comprising: a plurality of battery cells; and a container containing the battery cells, wherein the container includes a housing containing the battery cells; and a plate-shaped member thermally connected to the housing and partitioning a space in which the battery cells of the housing are accommodated into a plurality of spaces, wherein the plate-shaped member includes a thermally conductive elastic body and a thermally conductive plate disposed on one or both sides of the thermally conductive elastic body.

Abstract: A case constituting an outer shape of a second cooler disposed between the battery cells and containing a second fluid having a lower thermal conductivity than the first fluid therein is constituted by a buffer member capable of expanding and contracting in accordance with a flow rate of the second fluid in the case, and the control unit increases a flow rate of the second fluid to be supplied to the second cooler when the temperature of the battery cell is equal to or higher than a predetermined threshold value than when the temperature of the battery cell is lower than the threshold value.

Abstract: A battery module includes a battery cell and a heat dissipation member that is in contact with a battery cell case. The battery cell includes an electrode body including plural layered structures layered one on another, each including a positive electrode, a negative electrode, and a separator disposed between the positive electrode and the negative electrode, and the battery cell case that hermetically encloses the electrode body inside the battery cell case. The battery cell case includes at least a metal layer and a fusion resin layer disposed at the inner face side of the metal layer and has an exposed portion, at which the metal layer is exposed, at at least part of the outer face of the battery cell case. The heat dissipation member is in contact with the exposed portion.

Abstract: A battery cell includes: an electrode body including plural layered structures, each including a positive electrode, a negative electrode, and a separator disposed between the positive electrode and the negative electrode; and a battery cell case that hermetically encloses the electrode body inside the battery cell case. At least one of the current collector in the positive electrode or the current collector in the negative electrode has, on a peripheral portion of a surface thereof, an uncoated portion at which the mix is not coated. A current collector of which the distance from the surface of the battery cell case is the greatest among current collectors each having an uncoated portion has a first uncoated portion, and the first uncoated portion extends to the outside of the battery cell case, thereby forming a first exposed portion.

Abstract: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed.

Abstract: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed.