Patents by Inventor Atsushi Chono
Atsushi Chono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6929722Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit.Type: GrantFiled: September 5, 2001Date of Patent: August 16, 2005Assignee: Ebara CorporationInventors: Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura, Kenichi Suzuki, Atsushi Chono
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Patent number: 6793794Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.Type: GrantFiled: March 18, 2002Date of Patent: September 21, 2004Assignee: Ebara CorporationInventors: Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki, Atsushi Chono, Satoshi Sendai, Koji Mishima
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Publication number: 20040163947Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit.Type: ApplicationFiled: February 26, 2004Publication date: August 26, 2004Inventors: Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura, Kenichi Suzuki, Atsushi Chono
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Patent number: 6582580Abstract: An object of the present invention is to provide a substrate plating apparatus capable of performing continuous plating operations within one apparatus without the wafers becoming contaminated after the post-plating process by chemicals used in the plating process and the like. Further object is to provide a substrate plating apparatus capable of forming a plating film of uniform thickness on the plating surface of the wafer, while encouraging bubbles to escape from fine holes or grooves in the substrate surface and deterring particles from depositing on the plated surface.Type: GrantFiled: October 19, 2000Date of Patent: June 24, 2003Assignee: Ebara CorporationInventors: Akihisa Hongo, Kenichi Suzuki, Atsushi Chono
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Patent number: 6517689Abstract: The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.Type: GrantFiled: January 19, 2000Date of Patent: February 11, 2003Assignee: Ebara CorporationInventors: Akihisa Hongo, Kenichi Suzuki, Atsushi Chono, Mitsuo Tada, Akira Ogata, Satoshi Sendai, Koji Mishima
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Patent number: 6500317Abstract: The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.Type: GrantFiled: June 16, 2000Date of Patent: December 31, 2002Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Satoshi Sendai, Atsushi Chono, Mitsuo Tada, Akihisa Hongo, Yoshitaka Mukaiyama, Kenya Tomioka, Akira Ogata, Kenichi Suzuki, Naomitsu Ozawa
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Publication number: 20020139683Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.Type: ApplicationFiled: March 18, 2002Publication date: October 3, 2002Inventors: Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki, Atsushi Chono, Satoshi Sendai, Koji Mishima
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Patent number: 6379520Abstract: The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.Type: GrantFiled: July 27, 2000Date of Patent: April 30, 2002Assignee: Ebara CorporationInventors: Fumio Kuriyama, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki, Atsushi Chono
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Patent number: 6365020Abstract: The present invention is to provide a wafer plating jig for a plating apparatus having a simple construction and capable of sealing conducting pins from the plating solution completely. The wafer plating jig for gripping a wafer, comprises a main jig body (11) having a plurality of gripping mechanisms (13) and a plurality of conducting pins disposed thereon. A seal packing (20) is provided to surround each of the conducting pins. When the wafer is gripped by the gripping mechanisms (13), each end of the conducting pins individually contacts conductive film formed on the wafer and being sealed by the seal packing (20).Type: GrantFiled: July 11, 2000Date of Patent: April 2, 2002Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Kenya Tomioka, Satoshi Sendai, Atsushi Chono, Naomitsu Ozawa
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Patent number: 6365017Abstract: The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution. An insoluble anode is disposed in the plating bath opposite the substrate. The substrate plating apparatus comprises a circulating vessel or dummy vessel provided separate from the plating bath, with a soluble anode and a cathode disposed in the circulating vessel or dummy vessel. An anion exchange film or selective cation exchange film is disposed between the anode and cathode and isolates the same, wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and the generated metal ions are supplied to the plating bath.Type: GrantFiled: May 5, 2000Date of Patent: April 2, 2002Assignee: Ebara CorporationInventors: Akihisa Hongo, Naoaki Ogure, Hiroyuki Ueyama, Junitsu Yamakawa, Mizuki Nagai, Kenichi Suzuki, Atsushi Chono, Satoshi Sendai, Koji Mishima
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Publication number: 20020005359Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit.Type: ApplicationFiled: September 5, 2001Publication date: January 17, 2002Inventors: Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura, Kenichi Suzuki, Atsushi Chono
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Patent number: 6294059Abstract: A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit.Type: GrantFiled: September 17, 1998Date of Patent: September 25, 2001Assignee: Ebara CorporationInventors: Akihisa Hongo, Naoaki Ogure, Hiroaki Inoue, Norio Kimura, Fumio Kuriyama, Manabu Tsujimura, Kenichi Suzuki, Atsushi Chono
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Patent number: RE39123Abstract: The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.Type: GrantFiled: November 26, 1999Date of Patent: June 13, 2006Assignee: Ebara CorporationInventors: Fumio Kuriyama, Hiroyuki Ueyama, Junitsu Yamakawa, Kenichi Suzuki, Atsushi Chono