Patents by Inventor Atsushi Deguchi

Atsushi Deguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10857784
    Abstract: Reaction liquid application S1 to an ink receiving medium, formation of a first image by ink application S2, liquid absorption S3 from the first image by a porous body of a liquid absorbing member, cleaning S4 of the porous body, and liquid collection S5 from the porous body are repeated in an inkjet printing method. When the porous body comes into contact with the first image, first chemical species in the reaction liquid contributing to increasing the ink viscosity is contained, on the ink receiving medium and in the porous body, at a higher level in terms of molar equivalent per unit area than second chemical species in the ink also contributing to increasing the ink viscosity. In the liquid collection S5, the liquid is collected so that the liquid remains in the porous body on the side to be brought into contact with the first image.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: December 8, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yoshiyuki Honda, Atsushi Sakamoto, Satoshi Masuda, Toru Yamane, Kyosuke Deguchi, Ryosuke Hirokawa, Toru Ohnishi, Akihiro Mouri, Noboru Toyama
  • Patent number: 10730285
    Abstract: On a conveyance path of a liquid absorbing member including a porous body, a liquid absorbing unit 2 that absorbs a first liquid from a first image, a recovery liquid applying unit 3 that applies a recovery liquid to the porous body absorbing the liquid and a liquid collecting unit 4 that collects a liquid component absorbed by the porous body are arranged in this order, and a cleaning unit 5 that brings a cleaning member into contact with the conveyance path of the porous body is disposed at least between the liquid absorbing unit and the recovery liquid applying unit or between the liquid collecting unit and the liquid absorbing unit.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: August 4, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Atsushi Sakamoto, Satoshi Masuda, Yoshiyuki Honda, Toru Yamane, Kyosuke Deguchi, Ryosuke Hirokawa, Toru Ohnishi, Akihiro Mouri, Noboru Toyama, Toshimori Miyakoshi, Hiroaki Motooka, Ryohei Goto
  • Publication number: 20200202948
    Abstract: According to one embodiment, a semiconductor memory device includes a bit line electrically connected to a memory cell, a first node electrically connected to the bit line, a first driver configured to increase a voltage of the first node to a first voltage, a first buffer circuit configured to store data based on the voltage of the first node, a bus electrically connected to the first buffer circuit, a first transistor electrically connected between the first node and the bus, and a second buffer circuit electrically connected to the bus. The first buffer circuit is electrically connected to an input terminal of the first driver. The first driver changes a voltage of the bus based on the data stored in the first buffer circuit.
    Type: Application
    Filed: September 5, 2019
    Publication date: June 25, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Atsushi OKUYAMA, Yoshihiko KAMATA, Hiromitsu KOMAI, Takuyo KODAMA, Yuki ISHIZAKI, Yoko DEGUCHI, Hiroyuki KAGA
  • Publication number: 20200131379
    Abstract: Provided are: a dispersant which has good dispersibility and reduces electronic resistance; and a battery having excellent characteristics, which uses this dispersant and is decreased in the ionic resistance and the reaction resistance. A dispersant contains a triazine derivative represented by general formula (1), and an amine or an inorganic base (in general formula (1), R1 is as defined in the description).
    Type: Application
    Filed: May 11, 2018
    Publication date: April 30, 2020
    Applicants: TOYO INK SC HOLDINGS CO., LTD., TOYOCOLOR CO., LTD.
    Inventors: Akio HIMIZU, Yu AOTANI, Atsushi KOSEKI, Naoki DEGUCHI, Tomoaki MASUOKA, Tomohiko HOSHINO
  • Patent number: 10569580
    Abstract: An ink jet recording apparatus including: an image forming unit that forms a first image containing a first liquid and a coloring material on a transfer body; and a liquid absorbing device including a liquid absorbing member having a porous body coming in contact with the first image to at least partially absorb the first liquid from the first image, and a cleaning member coming in contact with the porous body to clean the porous body wherein surface free energy Y1 of the transfer body, surface free energy Y2 of the porous body, surface free energy Y3 of the cleaning member, and a dispersion force component Yd of surface free energy of the first image satisfy the following Equation (1): |Yd,?Y3|<|Yd,?Y1|<|Yd,?Y2|??(1).
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: February 25, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kyosuke Deguchi, Toru Yamane, Atsushi Sakamoto, Satoshi Masuda, Yoshiyuki Honda, Ryosuke Hirokawa, Akihiro Mouri, Toru Ohnishi, Noboru Toyama
  • Patent number: 10556448
    Abstract: When a porous body is repeatedly used to perform treatment of absorbing and removing an aqueous liquid component on an image which is formed using a reaction liquid and an ink and contains the aqueous liquid component and a coloring material, recovery treatment for applying a recovery liquid to the porous body is performed, the recovery liquid having a viscosity lower than a viscosity of the reaction liquid and the ink.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: February 11, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toru Ohnishi, Toru Yamane, Kyosuke Deguchi, Ryosuke Hirokawa, Akihiro Mouri, Noboru Toyama, Atsushi Sakamoto, Susumu Hirosawa, Toshimori Miyakoshi, Hiroaki Motooka, Ryohei Goto
  • Patent number: 10543679
    Abstract: A liquid holding amount of a porous body of a liquid absorbing member for removing at least a portion of an aqueous liquid component from an image obtained by ink jet printing is controlled so as to reduce damage to the porous body while maintaining performance of removing attached matters from the porous body by using a cleaning member which abuts on the porous body and has an adhesive force.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: January 28, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Masuda, Toru Yamane, Kyosuke Deguchi, Ryosuke Hirokawa, Toru Ohnishi, Akihiro Mouri, Noboru Toyama, Atsushi Sakamoto, Yoshiyuki Honda, Taku Higashiyama, Susumu Hirosawa
  • Publication number: 20200020987
    Abstract: A nonaqueous electrolyte solution according to one embodiment of the present disclosure contains a lithium salt and a nonaqueous solvent; the nonaqueous solvent contains fluoroethylene carbonate and a chain carboxylic acid ester having a dielectric constant of 6.0 or more; the lithium salt contains LiPO2F2 and LiSO3F; and the respective concentrations of LiPO2F2 and LiSO3F in the non-aqueous solvent are 0.15 mol/L or more.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Naoya Morisawa, Kazuhiro Iida, Masaki Deguchi, Atsushi Fukui
  • Patent number: 9113562
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: August 18, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Patent number: 8986181
    Abstract: Provided is a module for automatic tool exchange device of novel structure wherein electric signals can be transmitted with high reliability while preventing transmission efficiency from deteriorating between a first coupling member and a second coupling member. An electromagnetic shielding member is arranged on an outer circumference of a core member except for a transmission surface, a gap member having electromagnetic shielding effect lower than that of the electromagnetic shielding member is interposed between the core member and the electromagnetic shielding member, and a first module and a second module are provided, respectively, with coil units equipped with coil heads which are constituted to include a coil member, the core member and the gap member.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: March 24, 2015
    Assignees: Mie Electronics Co., Ltd., Honda Motor Co., Ltd.
    Inventors: Shuhei Takazakura, Atsushi Deguchi, Shinya Sasaki, Toshikazu Mukai, Tomimasa Yamashita, Shinji Yahiro, Atsushi Miyabe, Keisuke Ayabe, Takashi Fujimura
  • Publication number: 20120180313
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Application
    Filed: March 22, 2012
    Publication date: July 19, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Hideo MIZUTANI, Toshiyuki MATSUI, Atsushi DEGUCHI
  • Patent number: 8161637
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: April 24, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Publication number: 20110256995
    Abstract: Provided is a module for automatic tool exchange device of novel structure wherein electric signals can be transmitted with high reliability while preventing transmission efficiency from deteriorating between a first coupling member and a second coupling member. An electromagnetic shielding member is arranged on an outer circumference of a core member except for a transmission surface, a gap member having electromagnetic shielding effect lower than that of the electromagnetic shielding member is interposed between the core member and the electromagnetic shielding member, and a first module and a second module are provided, respectively, with coil units equipped with coil heads which are constituted to include a coil member, the member and the gap member.
    Type: Application
    Filed: July 23, 2009
    Publication date: October 20, 2011
    Applicants: HONDA MOTOR CO., LTD., MIE ELECTRONICS CO., LTD.
    Inventors: Shuhei Takazakura, Atsushi Deguchi, Shinya Sasaki, Toshikazu Mukai, Tomimasa Yamashita, Shinji Yahiro, Atsushi Miyabe, Keisuke Ayabe, Takashi Fujimura
  • Publication number: 20110016709
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Application
    Filed: April 30, 2010
    Publication date: January 27, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Patent number: D305776
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: January 30, 1990
    Assignee: Yoshinaga Prince Company Limited
    Inventors: Suk J. Kim, Atsushi Deguchi, Sadao Yoshinaga
  • Patent number: D305910
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: February 6, 1990
    Assignee: Yoshinaga Prince Company Limited
    Inventors: Suk J. Kim, Atsushi Deguchi, Sadao Yoshinaga
  • Patent number: D306457
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: March 6, 1990
    Assignee: Yoshinaga Prince Company Limited
    Inventors: Suk J. Kim, Atsushi Deguchi, Sadao Yoshinaga
  • Patent number: D308226
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: May 29, 1990
    Assignee: Yoshinaga Prince Company Limited
    Inventors: Suk J. Kim, Atsushi Deguchi, Sadao Yoshinaga
  • Patent number: D308888
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: June 26, 1990
    Assignee: Yoshinaga Prince Company Limited
    Inventors: Suk J. Kim, Atsushi Deguchi, Sadao Yoshinaga
  • Patent number: D313041
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: December 18, 1990
    Assignee: Yoshinaga Prince Company Limited
    Inventors: Suk J. Kim, Atsushi Deguchi, Sadao Yoshinaga