Abstract: A conveyance route switching mechanism and a paper sheet handling apparatus that includes the conveyance route switching mechanism include a driving source, a gate, a first gear, and an internal gear. The driving source includes a driving shaft. The gate includes a gate shaft, and a blade that is provided on the gate shaft, and switches conveyance routes of paper sheets. The first gear is provided on the gate shaft. The internal gear meshes with the first gear. According to rotation of the driving shaft, the gate shaft rotates on an axis of the gate shaft, and revolves with the driving shaft as a rotation center while the first gear meshes with the internal gear.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

Abstract: A wiring substrate includes a resin insulating layer, and a conductor layer formed on the resin insulating layer and including a seed layer and a metal film formed on the seed layer such that the conductor layer has wiring patterns including wirings. The conductor layer is formed such that each of the wirings in the wiring patterns has undercut parts on side surfaces extending to the resin insulating layer, and the wirings in the conductor layer include outer wirings formed such that each of the outer wirings has the undercut part on the side surface facing an adjacent one of the wirings is smaller than the undercut part on the side surface farther from the adjacent one of the wirings.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.

Abstract: Provided is a module for automatic tool exchange device of novel structure wherein electric signals can be transmitted with high reliability while preventing transmission efficiency from deteriorating between a first coupling member and a second coupling member. An electromagnetic shielding member is arranged on an outer circumference of a core member except for a transmission surface, a gap member having electromagnetic shielding effect lower than that of the electromagnetic shielding member is interposed between the core member and the electromagnetic shielding member, and a first module and a second module are provided, respectively, with coil units equipped with coil heads which are constituted to include a coil member, the core member and the gap member.

Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.

Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.

Abstract: Provided is a module for automatic tool exchange device of novel structure wherein electric signals can be transmitted with high reliability while preventing transmission efficiency from deteriorating between a first coupling member and a second coupling member. An electromagnetic shielding member is arranged on an outer circumference of a core member except for a transmission surface, a gap member having electromagnetic shielding effect lower than that of the electromagnetic shielding member is interposed between the core member and the electromagnetic shielding member, and a first module and a second module are provided, respectively, with coil units equipped with coil heads which are constituted to include a coil member, the member and the gap member.

Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.

Abstract: An oil-in-water emulsion of at least one polymer selected from the group consisting of(A) an ethylene/alpha-olefin random copolymer having(1) an ethylene content of 30 to 70 moles %,(2) a number average molecular weight (Mn) of 500 to 10,000, and(3) a weight average molecular weight (Mw) to number average molecular weight (Mn) ratio (Q=Mw/Mn), of 3 at most, and(4) being liquid at ordinary temperatures, and(B) a graft-modified ethylene/alpha-olefin copolymer(1') comprising said ethylene/alpha-olefin copolymer having the characteristics (1) to (4) as a trunk polymer, and(2') at least one grafted unit selected from a unit derived from an unsaturated carboxylic acid or its acid anhydride and a unit resulting from neutralization of at least a part of said unit with an alkali, and(3') being liquid or semisolid at ordinary temperatures.