Abstract: Provided is a method for manufacturing a semiconductor substrate including: preparing a semiconductor substrate having a front surface on which an epitaxial layer has been formed; and forming a fracture layer on a rear surface of the semiconductor substrate before forming elements on the epitaxial layer.

Abstract: Provided is a method for manufacturing a semiconductor substrate including: preparing a semiconductor substrate having a front surface on which an epitaxial layer has been formed; and forming a fracture layer on a rear surface of the semiconductor substrate before forming elements on the epitaxial layer.

Abstract: The present invention provides a liquid droplet ejecting head including: a pressure chamber connected to a nozzle ejecting liquid-droplets; a vibrating-plate forming one portion of the pressure chamber; a lower-electrode formed on a surface of the vibrating-plate, and exhibiting one polarity; a piezoelectric body of flexurally-deformable, formed on a surface of the lower electrode, and disposed at a position facing the pressure chamber with the vibrating-plate therebetween; and an upper-electrode formed at a surface of the piezoelectric body opposite the surface at which the lower-electrode is formed, the upper-electrode exhibiting another polarity, when viewed from a direction perpendicular to the surface of the lower-electrode, the piezoelectric body being provided further toward an inner side than a peripheral wall of the pressure chamber, and the lower-electrode being of a size such that one portion thereof overlaps with the peripheral wall of the pressure chamber, and being individuated per each piezoele

Abstract: The present invention provides a liquid droplet ejecting head including: a pressure chamber connected to a nozzle ejecting liquid-droplets; a vibrating-plate forming one portion of the pressure chamber; a lower-electrode formed on a surface of the vibrating-plate, and exhibiting one polarity; a piezoelectric body of flexurally-deformable, formed on a surface of the lower electrode, and disposed at a position facing the pressure chamber with the vibrating-plate therebetween; and an upper-electrode formed at a surface of the piezoelectric body opposite the surface at which the lower-electrode is formed, the upper-electrode exhibiting another polarity, when viewed from a direction perpendicular to the surface of the lower-electrode, the piezoelectric body being provided further toward an inner side than a peripheral wall of the pressure chamber, and the lower-electrode being of a size such that one portion thereof overlaps with the peripheral wall of the pressure chamber, and being individuated per each piezoele

Abstract: Through-holes serving as common liquid chambers 5 are formed in a flow channel substrate 1 by a wet anisotropic etching process. One opened end of each through-hole serves as a liquid inlet 4. Trenches rectangular in cross section, which are used as liquid flow channels 7, are formed in the flow channel substrate by RIE process. Each liquid flow channel 7 includes a front constriction 41 formed near its associated discharge orifice 9 and a rear constriction 42 formed near a connection portion between the channel and the common liquid chamber 5. The common liquid chamber 5 is communicatively connected to the liquid flow channel 7 in a linear fashion, and a portion of the liquid flow channel 7 between the front constriction 41 and the rear constriction 42 may be designed to be broad. Therefore, the flow channel resistance is reduced, the liquid jetting efficiency is improved, and the liquid re-supplying is performed at high speed.