Patents by Inventor Atsushi Higo

Atsushi Higo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7741393
    Abstract: Provided are an organic silicon compound of the following formula (I): (wherein, R1 to R20 represent each independently alkyl, alkoxy, aryloxy, cycloalkyl, alkylcycloalkyl, aryl, dialkylamino or the like, and the aryloxy and aryl may be substituted with a substituent selected from the group consisting of alkyl, alkoxy and alkoxyalkyl.) which can be used for suppression of coloration and thermal deterioration of an organic material in molding, and an organic material composition containing the organic silicon compound and a method of producing the organic silicon compound.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: June 22, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Taketoshi Kikuchi, Atsushi Higo, Hideaki Awa, Kunihito Miyake
  • Patent number: 7695782
    Abstract: An optical laminate comprising an anti-reflection film 1, polarizing film 2, adhesive layer 3, glass cell for liquid crystal display 4, adhesive layer 5 and polarizing film 6 laminated sequentially, wherein the ratio (B/A) of the maximum value B of the loss tangent of the adhesive layer 5 to the maximum value A of the loss tangent of the adhesive layer 3 is 1.1 or more. The maximum value of the loss tangent means the maximum value of loss modulus (E?) storage modulus (E?) (=tan ?), each measured by heating the adhesive layer in a temperature range of ?70° C. to 200° C. at a temperature rising rate of 4° C./min and a frequency of 1 Hz.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: April 13, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Ryu Takeko, Akira Kawamura, Atsushi Higo
  • Patent number: 7585570
    Abstract: To provide an adhesive comprising an acrylic resin (1), an acrylic resin (2), a silicone oligomer (3) and a crosslinking agent (4): wherein the acrylic resin (1) comprises a structural unit (a) derived from a monomer (A) and a structural unit (b) derived from a monomer (B) and has a weight-average molecular weight of 1,000,000 to 2,000,000, wherein the (A) is a (meth)acrylic ester represented by the formula (A) (wherein R1 represents hydrogen atom or methyl group, and R2 represents alkyl or aralkyl groups having 1 to 14 carbon atoms wherein hydrogen atom(s) of the R2 may be substituted with alkoxy group having 1 to 10 carbon atoms), and the (B) is at least any one of a (B-1) and a (B-2) wherein the (B-1) is a monomer comprising carboxyl group and one olefinic double bond, and the (B-2) is a monomer comprising at least one polar functional group selected from the group consisted of hydroxyl group, amide group, amino group, epoxy group, oxetanyl group, aldehyde group and isocyanate group and an olef
    Type: Grant
    Filed: April 11, 2006
    Date of Patent: September 8, 2009
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Ryu Takeko, Atsushi Higo, Akira Kawamura
  • Publication number: 20070203275
    Abstract: Provided are an organic silicon compound of the following formula (I): (wherein, R1 to R20 represent each independently alkyl, alkoxy, aryloxy, cycloalkyl, alkylcycloalkyl, aryl, dialkylamino or the like, and the aryloxy and aryl may be substituted with a substituent selected from the group consisting of alkyl, alkoxy and alkoxyalkyl.) which can be used for suppression of coloration and thermal deterioration of an organic material in molding, and an organic material composition containing the organic silicon compound and a method of producing the organic silicon compound.
    Type: Application
    Filed: March 10, 2005
    Publication date: August 30, 2007
    Inventors: Taketoshi Kikuchi, Atsushi Higo, Hideaki Awa, Kunihito Miyake
  • Publication number: 20060252863
    Abstract: To provide an adhesive comprising an acrylic resin (1), an acrylic resin (2), a silicone oligomer (3) and a crosslinking agent (4) wherein the acrylic resin (1) comprises a structural unit (a) derived from a monomer (A) and a structural unit (b) derived from a monomer (B) and has a weight-average molecular weight of 1,000,000 to 2,000,000, wherein the (A) is a (meth)acrylic ester represented by the formula (A) (wherein R1 represents hydrogen atom or methyl group, and R2 represents alkyl or aralkyl groups having 1 to 14 carbon atoms wherein hydrogen atom(s) of the R2 may be substituted with alkoxy group having 1 to 10 carbon atoms), and the (B) is at least any one of a (B-1) and a (B-2) wherein the (B-1) is a monomer comprising carboxyl group and one olefinic double bond, and the (B-2) is a monomer comprising at least one polar functional group selected from the group consisted of hydroxy group, amide group, amino group, epoxy groups oxetanyl group, aldehyde group and isocyanate group and an olefinic doub
    Type: Application
    Filed: April 11, 2006
    Publication date: November 9, 2006
    Inventors: Ryu Takeko, Atsushi Higo, Akira Kawamura
  • Publication number: 20060062938
    Abstract: An optical laminate comprising an anti-reflection film 1, polarizing film 2, adhesive layer 3, glass cell for liquid crystal display 4, adhesive layer 5 and polarizing film 6 laminated sequentially, wherein the ratio (A/B) of the maximum value A of the loss tangent of the adhesive layer 3 to the maximum value B of the loss tangent of the adhesive layer 5 is 1.1 or more. The maximum value of the loss tangent means the maximum value of loss modulus (E?)/storage modulus (E?) (=tan ?), each measured by heating the adhesive layer in a temperature range of ?70° C. to 200° C. at a temperature rising rate of 4° C./min and a frequency of 1 Hz.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 23, 2006
    Inventors: Ryu Takeko, Akira Kawamura, Atsushi Higo