Patents by Inventor Atsushi Hikosaka
Atsushi Hikosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11974220Abstract: A network node is a first network node in a VPLMN (Visited Public land mobile network), the network node including a receiving unit configured to receive information relating to network selection, from a second network node in an HPLMN (Home Public land mobile network); a transmitting unit configured to transmit the information relating to network selection, to a user equipment; and a control unit configured to transmit, to the second network node, a response indicating that the user equipment was unable to receive the information relating to network selection, when a response, with respect to the information relating to network selection transmitted to the user equipment, is not received from the user equipment.Type: GrantFiled: January 8, 2020Date of Patent: April 30, 2024Assignee: NTT DOCOMO, INC.Inventors: Hiroshi Ishikawa, Shinya Takeda, Maoki Hikosaka, Atsushi Minokuchi, Kenichiro Aoyagi, Ban Al-Bakri
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Patent number: 11956714Abstract: A user equipment includes a receiving unit configured to receive, from a network node in a VPLMN (Visited Public land mobile network), information indicating a PLMN to be prioritized and information indicating a trigger of PLMN selection; and a control unit configured to execute the PLMN selection, based on the information indicating the PLMN to be prioritized and the information indicating the trigger of the PLMN selection.Type: GrantFiled: January 8, 2020Date of Patent: April 9, 2024Assignee: NTT DOCOMO, INC.Inventors: Shinya Takeda, Hiroshi Ishikawa, Maoki Hikosaka, Kenichiro Aoyagi, Atsushi Minokuchi, Ban Al-Bakri
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Patent number: 8247308Abstract: It is an object of the preset invention to increase adhesiveness of a semiconductor layer and a base substrate and to reduce defective bonding. An oxide film is formed on a semiconductor substrate and the semiconductor substrate is irradiated with accelerated ions through the oxide film, whereby an embrittled region is formed at a predetermined depth from a surface of the semiconductor substrate. Plasma treatment is performed on the oxide film on the semiconductor substrate and the base substrate by applying a bias voltage, the surface of the semiconductor substrate and a surface of the base substrate are disposed opposite to each other, a surface of the oxide film is bonded to the surface of the base substrate, heat treatment is performed after the surface of the oxide film is bonded to the surface of the base substrate, and separation is caused along the embrittled region, whereby a semiconductor layer is formed over the base substrate with the oxide film interposed therebetween.Type: GrantFiled: July 17, 2009Date of Patent: August 21, 2012Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Akihiro Ishizuka, Shinya Sasagawa, Motomu Kurata, Atsushi Hikosaka, Taiga Muraoka, Hitoshi Nakayama
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Publication number: 20100047997Abstract: It is an object of the preset invention to increase adhesiveness of a semiconductor layer and a base substrate and to reduce defective bonding. An oxide film is formed on a semiconductor substrate and the semiconductor substrate is irradiated with accelerated ions through the oxide film, whereby an embrittled region is formed at a predetermined depth from a surface of the semiconductor substrate. Plasma treatment is performed on the oxide film on the semiconductor substrate and the base substrate by applying a bias voltage, the surface of the semiconductor substrate and a surface of the base substrate are disposed opposite to each other, a surface of the oxide film is bonded to the surface of the base substrate, heat treatment is performed after the surface of the oxide film is bonded to the surface of the base substrate, and separation is caused along the embrittled region, whereby a semiconductor layer is formed over the base substrate with the oxide film interposed therebetween.Type: ApplicationFiled: July 17, 2009Publication date: February 25, 2010Inventors: Akihiro ISHIZUKA, Shinya SASAGAWA, Motomu KURATA, Atsushi HIKOSAKA, Taiga MURAOKA, Hitoshi NAKAYAMA
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Patent number: 5852898Abstract: An extruded weather strip having a tubular configuration and adapted to be bonded to a body wall along a roof side of a vehicle body, which defines a door opening thereof, with a double-sided adhesive tape. The weather strip includes a bottom portion adapted to be bonded to the body wall with the double-sided adhesive tape, and a seal wall including sides that are connected to both side ends of the bottom portion. The weather strip further includes first and second internal bridge members which interconnect the bottom portion and the seal wall. One end of the first bridge is connected to the seal wall at a position inside of where a door window pane will push on that seal wall while the other end is connected to an outer side end of the bottom portion. One end of the second bridge is connected to the seal wall in a position similar to the first bridge while the other end is connected to an inner side end of the bottom portion.Type: GrantFiled: March 14, 1997Date of Patent: December 29, 1998Assignee: Toyoda Gosei Co., Ltd.Inventors: Atsushi Hikosaka, Masahiro Nozaki
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Patent number: 5791722Abstract: A structure attaches weather stripping to the body along the side of a roof of a vehicle body, and is especially useful around a door opening thereof. A molding that extends along the side of a roof for covering an outside surface of the weather strip is attached to the vehicle by securing a base portion of the molding to an outer part of the body wall defining the door opening. The weather strip has a bottom portion and a sealing portion. An outer part of the bottom portion is bonded to the base portion of the molding with a first double-sided adhesive tape, while an inner part of the bottom portion is bonded to the body wall defining the door opening with a second double-sided adhesive tape which is made of a material having a density below that of a material forming the first double-sided adhesive tape.Type: GrantFiled: August 9, 1996Date of Patent: August 11, 1998Assignee: Yoyada Gosei Co., Ltd.Inventors: Masahiro Nozaki, Atsushi Hikosaka
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Patent number: 5556672Abstract: A weather strip attaching structure with which a weather strip can be readily attached to a retainer without use of a roller jig or the like. In the structure according to the present invention for attaching a weather strip 50 to a retainer 70 provided along a door opening 10 of a vehicle body, the weather strip 50 includes a hollow sealing portion 56 for being sealingly abutted against the edge portion of a door glass plate 40, and an attaching base portion 52 having engaging protrusions 54a and 54b, which are meant to engage with engaging recesses 74 and 76 of the retainer 70. The hollow sealing portion 56 has at least one inclined side wall 57. The retainer 70 comprises a bottom 72 which is mounted on the vehicle body, the engaging recesses 74 and 76 formed at opposite ends of the bottom 72, and an inclined supporting portion 78 provided above the engaging recess 76, for supporting the inclined side wall 57 of the hollow sealing portion 56 of the weather strip.Type: GrantFiled: January 11, 1995Date of Patent: September 17, 1996Assignee: Toyoda Gosei Co., Ltd.Inventors: Keiji Akachi, Atsushi Hikosaka
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Patent number: 5527583Abstract: A structure for attachment of a weather strip to an opening of a vehicle body, which is opened and closed by a closing member. A base portion of the weather strip is bonded with two double-sided adhesive tapes to the vehicle body in the longitudinal direction thereof. The outer double-sided adhesive tape has thickness greater than that of the inner double-sided adhesive tape, and the material of the outer double-sided adhesive tape is softer than that of the inner double-sided adhesive tape.Type: GrantFiled: December 16, 1994Date of Patent: June 18, 1996Assignee: Toyoda Gosei Co., Ltd.Inventors: Masahiro Nozaki, Atsushi Hikosaka