Patents by Inventor Atsushi Hiratsuka

Atsushi Hiratsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heater, reflow apparatus, and solder bump forming method and apparatus
    Patent number: 8042727
    Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: October 25, 2011
    Assignees: Tamura Corporation, Japan Science and Technology Agency
    Inventors: Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Masahiko Furuno, Haruhiko Ando, Atsushi Hiratsuka
  • Solder composition and method of bump formation therewith
    Publication number: 20070181218
    Abstract: A solder composition capable of in the bump formation on a substrate, simplifying the coating operation. There is provided solder composition (10) comprising a mixture of liquid substance (12) and solder particles (11), wherein the liquid substance (12) contains a flux component of organic acid whose reaction temperature for oxide film removal is in the vicinity of the melting point of the solder particles and has such a viscosity that the liquid substance flows at ordinary temperature and accumulates in the form of a layer on substrate (20). The solder particles (11) consist of a particulate agent that settles in the liquid substance (12) toward a solder base material, having a particle diameter and mixing ratio enabling uniform dispersion in the liquid substance (12).
    Type: Application
    Filed: March 17, 2005
    Publication date: August 9, 2007
    Applicants: TAMURA CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Isao Sakamoto, Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Haruhiko Ando, Masaru Shirai, Atsushi Hiratsuka
  • Heater, reflow apparatus, and solder bump forming method and apparatus
    Publication number: 20070158387
    Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.
    Type: Application
    Filed: March 29, 2005
    Publication date: July 12, 2007
    Applicants: TAMURA CORPORATION, JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Masahiko Furuno, Haruhiko Ando, Atsushi Hiratsuka