Abstract: A doped film forming method comprising, the steps of preparing gas source for supplying a film forming gas into the process tube, gas source for supplying doping gases, in which a dope is included, into the process tube, a dry pump for exhausting the process tube, and an apparatus for burning a not-reacted element in waste gas, arranging a plurality of substrates in the process tube in such a way that they are separated from their adjacent ones by a certain interval, exhausting the process tube to keep it reduced in pressure, heating the substrates in the process tube to a temperature range of 500.degree.-600.degree. C., controlling amounts of the doping and film forming gases, while exhausting the process tube, at the ratio of the amount of the film forming gas to the amount of the doping gases being in the range of 1 to 1.625.times.10.sup.-3 to 2.125.times.10.sup.-3, and causing the doping and film forming gases to be reacted with the substrates.

Abstract: A film-forming apparatus for forming an impurity-doped film on an object such as a semiconductor wafer has an elongated reaction tube located such that its longitudinal direction is identical to the vertical direction, and having an object arrangement region in which a plurality of objects or semiconductor wafers to be processed can be arranged at intervals in the vertical direction. A film-forming gas is introduced into the reaction tube through a film-forming gas introduction pipe.

Abstract: A bumper main body has a pair of recesses into each of which a blank cap is disposed and fixedly and releasably held at its clipping portions by a first arm of a U-shaped leaf nut mounted on each of projections. The blank caps each have an outer surface flush with an outer surface of the bumper main body and a blind hole aligned with one of internally threaded flanged holes of the U-shaped leaf nut. The blind hole has a thin-walled closed end which is removed when a fastening bolt is screwed through the blind hole into one of the flanged holes to fasten a license plate to the bumper main body. The blind hole is alignable with the other of the flanged holes when the clipping portions are reversely attached to the leaf nut.