Patents by Inventor Atsushi Ishio

Atsushi Ishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9074096
    Abstract: The invention provides a polyphenylene sulfide resin composition including: 1 to 100 parts by weight of an olefin elastomer (B); and 0.01 to 10 parts by weight of a carboxylic acid amide wax mixture (C), relative to 100 parts by weight of a polyphenylene sulfide resin (A), wherein the carboxylic acid amide wax mixture (C) is obtained by adding 0.01 to 5 parts by weight of an antioxidant to 100 parts by weight of a carboxylic acid amide wax produced by reaction of a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: July 7, 2015
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kazuya Okubo, Atsushi Ishio, Yuki Ota
  • Patent number: 9068078
    Abstract: There is provided a polyphenylene sulfide (PPS) resin composition, comprising: 5 to 50 parts by weight of a polyamide resin (b) and 50 to 250 parts by weight of a metal hydroxide (c) relative to 100 parts by weight of a polyphenylene sulfide resin (a), wherein the metal hydroxide is dispersed in the composition at an average secondary particle diameter equal to or less than 5 ?m. The PPS resin composition may provide excellent tracking resistance without significantly damaging various intrinsic properties of a PPS resin, such as excellent mechanical strength and low gas generation.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: June 30, 2015
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Hiroyuki Isago, Kei Saitoh, Hideki Matsumoto, Yoshiomi Horiguchi, Atsushi Ishio
  • Publication number: 20140256864
    Abstract: There is provided a polyphenylene sulfide (PPS) resin composition, comprising: 5 to 50 parts by weight of a polyamide resin (b) and 50 to 250 parts by weight of a metal hydroxide (c) relative to 100 parts by weight of a polyphenylene sulfide resin (a), wherein the metal hydroxide is dispersed in the composition at an average secondary particle diameter equal to or less than 5 ?m. The PPS resin composition may provide excellent tracking resistance without significantly damaging various intrinsic properties of a PPS resin, such as excellent mechanical strength and low gas generation.
    Type: Application
    Filed: September 27, 2012
    Publication date: September 11, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Hiroyuki Isago, Kei Saitoh, Hideki Matsumoto, Yoshiomi Horiguchi, Atsushi Ishio
  • Publication number: 20140100306
    Abstract: The invention provides a polyphenylene sulfide resin composition including: 1 to 100 parts by weight of an olefin elastomer (B); and 0.01 to 10 parts by weight of a carboxylic acid amide wax mixture (C), relative to 100 parts by weight of a polyphenylene sulfide resin (A), wherein the carboxylic acid amide wax mixture (C) is obtained by adding 0.01 to 5 parts by weight of an antioxidant to 100 parts by weight of a carboxylic acid amide wax produced by reaction of a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine.
    Type: Application
    Filed: June 22, 2012
    Publication date: April 10, 2014
    Applicant: Toray Industries, Inc.
    Inventors: Kazuya Okubo, Atsushi Ishio, Yuki Ota
  • Patent number: 8221862
    Abstract: A polyphenylene sulfide resin composition including 100 parts by weight of a resin composition that consists of 99 to 60 wt % of a polyphenylene sulfide resin (a), and 1 to 40 wt % of at least one type of noncrystalline resin (b) selected from the group consisting of polyetherimide resin and polyether sulfone resin and 0.1 to 10 parts by weight of a compound (c) containing at least one group selected from epoxy group, amino group and isocyanate group, wherein the non-crystalline resin (b) forms an island phase and the number-average dispersed particle size of the noncrystalline resin (b) is 1,000 nm or less.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: July 17, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Kei Saitoh, Naoya Nakamura, Atsushi Ishio
  • Patent number: 8153732
    Abstract: A biaxially oriented polyphenylene sulfide film contains polyphenylene sulfide and polyether imide, wherein the contents of the polyphenylene sulfide and the polyether imide are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount of the polyphenylene sulfide and the polyether imide is taken as 100 parts by weight, and further contains a compound having one or more groups selected from an epoxy group, an amino group and an isocyanate group as a compatibilizing agent in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the polyphenylene sulfide and polyether imide in total, and the polyether imide forms a dispersed phase with an average particle diameter of 10 to 500 nm and the biaxially oriented polyphenylene sulfide film exhibits a tensile elongation at break of 110 to 250% in both the longitudinal direction and width direction.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: April 10, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Takuji Higashioji, Tetsuya Machida, Masatoshi Ohkura, Yasuyuki Imanishi, Atsushi Ishio, Megumi Yamada
  • Patent number: 8076423
    Abstract: A process for producing a polyphenylene sulfide resin composition includes melt-kneading about 99 to about 60 wt % of a polyphenylene sulfide resin (a) and about 1 to about 40 wt % of a polyamide resin (b), and about 0.1 to 10 parts by weight of a compatibilizing agent (c) per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), using a double screw extruder with two or more kneading portions at a temperature of the range from a melting peak temperature of the polyphenylene sulfide resin+10° C. to a melting peak temperature of the polyphenylene sulfide resin+70° C., wherein the polyamide resin (b) is excluded nylon 46 and has a relative viscosity of 1.5 or more measuring in concentrated sulfuric acid at a concentration of 1% and at 25° C.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: December 13, 2011
    Assignee: Toray Industries, Inc.
    Inventors: Atsushi Ishio, Kei Saitoh, Sadayuki Kobayashi
  • Publication number: 20110224384
    Abstract: A biaxially oriented polyphenylene sulfide film contains polyphenylene sulfide and polyether imide, wherein the contents of the polyphenylene sulfide and the polyether imide are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount of the polyphenylene sulfide and the polyether imide is taken as 100 parts by weight, and further contains a compound having one or more groups selected from an epoxy group, an amino group and an isocyanate group as a compatibilizing agent in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the polyphenylene sulfide and polyether imide in total, and the polyether imide forms a dispersed phase with an average particle diameter of 10 to 500 nm and the biaxially oriented polyphenylene sulfide film exhibits a tensile elongation at break of 110 to 250% in both the longitudinal direction and width direction.
    Type: Application
    Filed: May 17, 2011
    Publication date: September 15, 2011
    Inventors: Takuji Higashioji, Tetsuya Machida, Masatoshi Ohkura, Yasuyuki Imanishi, Atsushi Ishio, Megumi Yamada
  • Patent number: 7847055
    Abstract: A polyphenylene sulfide resin treated by thermal oxidation has a generated gas amount of 0.23 wt % or less when the resin is heated and melted in vacuum at 320° C. for 2 hours; a residual amount of 3.0 wt % or less as a residue when the resin is dissolved in an amount corresponding to 20 times the weight of the resin, of 1-chloronaphthalene at 250° C. for 5 minutes and, as the 1-chloronaphthalene solution, pressure-filtered in a still hot state by a PTFE membrane filter with a pore size of 1 ?m or less; and a melt flow rate (measured at a temperature of 315.5° C. and at a load of 5000 g according to ASTM D-1238-70) of more than 100 g/10 min to 500 g/10 min.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: December 7, 2010
    Assignee: Toray Industries, Inc.
    Inventors: Kei Saitoh, Atsushi Ishio, Takeshi Unohara
  • Publication number: 20100249342
    Abstract: A process for producing a polyphenylene sulfide resin with properties of (1) 0.3 wt % or less in the amount of the volatile gas generated when heated and melted at 320° C. in vacuum for 2 hours, (2) 0.3 wt % or less in the ash content achieved when incinerated at 550° C., (3) 4.0 wt % or less in the residue amount achieved when a solution with 1 part by weight of the polyphenylene sulfide resin dissolved in 20 parts by weight of 1-chloronaphthalene is pressure-filtered by a PTFE membrane filter with a pore size of 1 ?m at 250° C. for 5 minutes, and (4) higher than 500 g/10 min in melt flow rate (according to ASTM D-1238-70: measured at a temperature of 315.5° C. and at a load of 5000 g), by acid-treating a polyphenylene sulfide resin in an acid treatment step and subsequently treating it for thermal oxidation in a thermal oxidation step.
    Type: Application
    Filed: November 8, 2007
    Publication date: September 30, 2010
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takeshi Unohara, Yoshiki Makabe, Naoya Nakamura, Kei Saitoh, Atsushi Ishio, Masahiro Inohara
  • Publication number: 20090306309
    Abstract: A process for producing a polyphenylene sulfide resin composition includes melt-kneading about 99 to about 60 wt % of a polyphenylene sulfide resin (a) and about 1 to about 40 wt % of a polyamide resin (b), and about 0.1 to 10 parts by weight of a compatibilizing agent (c) per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), using a double screw extruder with two or more kneading portions at a temperature of the range from a melting peak temperature of the polyphenylene sulfide resin+10° C. to a melting peak temperature of the polyphenylene sulfide resin+70° C., wherein the polyamide resin (b) is excluded nylon 46 and has a relative viscosity of 1.5 or more measuring in concentrated sulfuric acid at a concentration of 1% and at 25° C.
    Type: Application
    Filed: August 18, 2009
    Publication date: December 10, 2009
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi Ishio, Kei Saitoh, Sadayuki Kobayashi
  • Publication number: 20090041968
    Abstract: A polyphenylene sulfide resin composition including 100 parts by weight of a resin composition that consists of 99 to 60 wt % of a polyphenylene sulfide resin (a), and 1 to 40 wt % of at least one type of noncrystalline resin (b) selected from the group consisting of polyetherimide resin and polyether sulfone resin and 0.1 to 10 parts by weight of a compound (c) containing at least one group selected from epoxy group, amino group and isocyanate group, wherein the non-crystalline resin (b) forms an island phase and the number-average dispersed particle size of the noncrystalline resin (b) is 1,000 nm or less.
    Type: Application
    Filed: March 14, 2007
    Publication date: February 12, 2009
    Applicant: Toray Industries, Inc.
    Inventors: Kei Saitoh, Naoya Nakamura, Atsushi Ishio
  • Publication number: 20080139782
    Abstract: A polyphenylene sulfide resin treated by thermal oxidation has a generated gas amount of 0.23 wt % or less when the resin is heated and melted in vacuum at 320° C. for 2 hours; a residual amount of 3.0 wt % or less as a residue when the resin is dissolved in an amount corresponding to 20 times the weight of the resin, of 1-chloronaphthalene at 250° C. for 5 minutes and, as the 1-chloronaphthalene solution, pressure-filtered in a still hot state by a PTFE membrane filter with a pore size of 1 ?m or less; and a melt flow rate (measured at a temperature of 315.5° C. and at a load of 5000 g according to ASTM D-1238-70) of more than 100 g/10 min to 500 g/10 min.
    Type: Application
    Filed: November 22, 2005
    Publication date: June 12, 2008
    Applicant: Toray Industries, Inc.
    Inventors: Kei Saitoh, Atsushi Ishio, Takeshi Unohara
  • Publication number: 20070299219
    Abstract: A biaxially oriented polyarylene sulfide film and laminated polyarylene sulfide sheets of the film contain polyarylene sulfide and other thermoplastic resin A different from the polyarylene sulfide, wherein the contents of the polyarylene sulfide and the thermoplastic resin A are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount of the polyarylene sulfide and the thermoplastic resin A is taken as 100 parts by weight and the resin thermoplastic A forms a dispersed phase with an average particle diameter of 10 to 500 nm and the biaxially oriented polyarylene sulfide film exhibits a tensile elongation at break of 110 to 250% in at least one of the longitudinal direction and width direction and a tensile fracture elongation of 80 to 250% in the other direction.
    Type: Application
    Filed: October 4, 2005
    Publication date: December 27, 2007
    Inventors: Takuji Higashioji, Tetsuya Machida, Masatoshi Ohkura, Yasuyuki Imanishi, Atsushi Ishio, Megumi Yamada
  • Publication number: 20070265375
    Abstract: A polyphenylene sulfide resin composition including 99 to 60 wt % of a polyphenylene sulfide resin (a) and 1 to 40 wt % of a polyamide resin (b), wherein the polyphenylene sulfide resin (a) forms a sea phase while the polyamide resin (b) forms an island phase, and that the number average dispersed particle size of the polyamide resin (b) is less than 500 nm; and a polyphenylene sulfide resin composition, wherein a compound having one or more types of groups selected from epoxy group, amino group and isocyanate group is added by 0.1 to 10 parts by weight per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), as a compatibilizing agent (c).
    Type: Application
    Filed: July 8, 2005
    Publication date: November 15, 2007
    Inventors: Atsushi Ishio, Kei Saitoh, Sadayuki Kobayashi
  • Patent number: 7115704
    Abstract: This invention provides a method for producing a polyarylene sulfide, comprising the step of bringing a low-hydrated alkali metal sulfide containing respectively 0.05 to less than 0.8 mole of water and an organic amide solvent per mole of the sulfur contained in the alkali metal sulfide, into contact with a dihalogenated aromatic compound in an organic polar solvent for polymerization. This invention also provides a polyarylene sulfide obtained by the method. The problem to be solved by this invention is to provide a method for efficiently producing a polyarylene sulfide in a short time using an alkali metal sulfide small in water content and organic amide solvent content.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: October 3, 2006
    Assignee: TORAY Industries, Inc.
    Inventors: Shunsuke Horiuchi, Atsushi Ishio, Kei Saitoh
  • Patent number: 6960628
    Abstract: The present invention is a polyphenylene sulfide resin composition comprising (a) a polyphenylene sulfide resin and (b) an olefin-based resin, and satisfying the following conditions (i) through (v): (i) The mixing ratio of the polyphenylene sulfide resin (a) and the olefin-based resin (b) is such that the amount of the polyphenylene sulfide resin (a) is in a range from 95 to 60 wt %, while the amount of the olefin-based resin (b) is in a range from 5 to 40 wt %, with the total weight of both the ingredients as 100 wt %; (hi) said olefin-based resin (b) comprising two copolymer: (b-1) an epoxy group-containing olefin copolymer and (b-2) an ethylene/(?-olefin copolymer obtained by copolymerizing ethylene and an ?-olefin having 3 to 20 carbon atoms; (iii) as the morphology observed by an electron microscope, said polyphenylene sulfide resin (a) forms a continuous phase, and said olefin-based resin (b) forms a dispersion phase and has a core-shell structure having said ethylene/?-olefin copolymer (b-2) acting as
    Type: Grant
    Filed: December 24, 2003
    Date of Patent: November 1, 2005
    Assignee: Toray Industries, Inc.
    Inventors: Hideo Matsuoka, Masaru Tateyama, Yoshihiro Yamami, Kei Saito, Atsushi Ishio
  • Publication number: 20050043505
    Abstract: This invention provides a method for producing a polyarylene sulfide, comprising the step of bringing a low-hydrated alkali metal sulfide containing respectively 0.05 to less than 0.8 mole of water and an organic amide solvent per mole of the sulfur contained in the alkali metal sulfide, into contact with a dihalogenated aromatic compound in an organic polar solvent for polymerization. This invention also provides a polyarylene sulfide obtained by the method. The problem to be solved by this invention is to provide a method for efficiently producing a polyarylene sulfide in a short time using an alkali metal sulfide small in water content and organic amide solvent content.
    Type: Application
    Filed: July 23, 2004
    Publication date: February 24, 2005
    Inventors: Shunsuke Horiuchi, Atsushi Ishio, Kei Saitoh
  • Publication number: 20040143069
    Abstract: The present invention is a polyphenylene sulfide resin composition comprising (a) a polyphenylene sulfide resin and (b) an olefin-based resin, and satisfying the following conditions (i) through (v): (i) The mixing ratio of the polyphenylene sulfide resin (a) and the olefin-based resin (b) is such that the amount of the polyphenylene sulfide resin (a) is in a range from 95 to 60 wt %, while the amount of the olefin-based resin (b) is in a range from 5 to 40 wt %, with the total weight of both the ingredients as 100 wt %; (ii) said olefin-based resin (b) comprising two copolymers: (b-1) an epoxy group-containing olefin copolymer and (b-2) an ethylene/(&agr;-olefin copolymer obtained by copolymerizing ethylene and an &agr;-olefin having 3 to 20 carbon atoms; (iii) as the morphology observed by an electron microscope, said polyphenylene sulfide resin (a) forms a continuous phase, and said olefin-based resin (b) forms a dispersion phase and has a core-shell structure having said ethylene/&agr;-olefin copolymer (b
    Type: Application
    Filed: December 24, 2003
    Publication date: July 22, 2004
    Inventors: Hideo Matsuoka, Masaru Tateyama, Yoshihiro Yamami, Kei Saito, Atsushi Ishio
  • Patent number: 6723400
    Abstract: An electroconductive, multilayered hollow molding comprising at least two thermoplastic resin layers, in which at least one layer is a layer of (a) a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin; one layer is a layer of (b) a thermoplastic resin composition consisting essentially of a thermoplastic resin other than a polyphenylene sulfide resin; and at least one of the layers is a layer of an electroconductive, thermoplastic resin composition comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: April 20, 2004
    Assignee: Toray Industries, Inc.
    Inventors: Atsushi Ishio, Norio Shimasaki, Masaru Tateyama, Kazuhiko Kobayashi