Abstract: A work processing apparatus performs processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate. The processing head includes a plasma electrode that generates plasma and radiates the plasma to the surface to be processed of the work. In the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode.

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.

Abstract: The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.

Abstract: The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper polishing plate and sandwiched between the polishing plates. Circular motion of the carriers, without revolving, are performed independently. Centers of gravity of the work pieces, which are held by the carriers, are simultaneously moved close to a center of gravity of the upper polishing plate and simultaneously moved away therefrom, and moving distances of the centers of gravity of the work pieces are equal.

Abstract: Method for abrading a work piece with a fixed load including a first abrading process in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted in order to apply first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate and a second abrading process in which the pressure of the cylinder chamber is readjusted in order to to apply second pressure which is higher than the first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.

Abstract: The method of the present invention is capable of abrading a work piece with fixed load. The method comprises: a first abrading process, in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted so as to apply first pressure to the work piece via the upper abrasive plate without applying full weight of the upper abrasive plate; and a second abrading process, in which the pressure of the cylinder chamber is readjusted so as to apply second pressure, which is higher than the first pressure, to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.

Abstract: The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

Abstract: The abrasive machine of the present invention is capable of smoothly adjust the pressing force of an upper plate. The abrasive machine includes a plate supporting mechanism, which supports the upper polishing plate and is capable of adjusting a pressing force. The plate supporting mechanism comprises: a base frame; a cylinder unit being provided to an upper part of the base frame,; a rotary plate being rotatably attached to a lower end of a piston rod of the cylinder unit; a plurality of connecting rods being pierced through the rotary plate, lower ends of the connecting rods being connected to the upper plate so as to rotate the upper plate together with the rotary plate; and a plurality of elastic members being provided between the stopper sections of the connecting rods and the rotary plate, whereby the pressing force of the upper plate is adjusted by adjusting a lifting force of the cylinder unit, which suspends the upper plate.

Abstract: The abrasive machine of the present invention is capable of smoothly adjust the pressing force of an upper plate. The abrasive machine includes a plate supporting mechanism, which supports the upper polishing plate and is capable of adjusting a pressing force. The plate supporting mechanism comprises: a base frame; a cylinder unit being provided to an upper part of the base frame, ; a rotary plate being rotatably attached to a lower end of a piston rod of the cylinder unit; a plurality of connecting rods being pierced through the rotary plate, lower ends of the connecting rods being connected to the upper plate so as to rotate the upper plate together with the rotary plate; and a plurality of elastic members being provided between the stopper sections of the connecting rods and the rotary plate, whereby the pressing force of the upper plate is adjusted by adjusting a lifting force of the cylinder unit, which suspends the upper plate.

Abstract: The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.