Patents by Inventor Atsushi KAKUDA

Atsushi KAKUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11879080
    Abstract: Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/?-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: January 23, 2024
    Assignee: HENKEL AG & CO. KGaA
    Inventors: Atsushi Kakuda, Naohiro Maeda
  • Patent number: 11326079
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a phosphate; and (C) at least one neutralizing agent selected from ammonia and an amine compound having at least one hydroxyl group. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient and peeling strength and scarcely causes metal to rust. The aqueous bonding composition can be usefully used to produce a wood-based material.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: May 10, 2022
    Assignee: Henkel AG & CO. KGaA
    Inventors: Atsushi Kakuda, Yoshio Yoshida
  • Patent number: 10947426
    Abstract: Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: March 16, 2021
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Atsushi Kakuda, Yoshio Yoshida
  • Publication number: 20200123418
    Abstract: Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/?-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Atsushi KAKUDA, Naohiro Maeda
  • Publication number: 20180155584
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a phosphate; and (C) at least one neutralizing agent selected from ammonia and an amine compound having at least one hydroxyl group. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient and peeling strength and scarcely causes metal to rust. The aqueous bonding composition can be usefully used to produce a wood-based material.
    Type: Application
    Filed: January 30, 2018
    Publication date: June 7, 2018
    Inventors: Atsushi KAKUDA, Yashio Yoshida
  • Publication number: 20180155583
    Abstract: Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.
    Type: Application
    Filed: January 30, 2018
    Publication date: June 7, 2018
    Inventors: Atsushi KAKUDA, Yoshio YOSHIDA
  • Publication number: 20170253776
    Abstract: An object of the present invention is to provide a pressure-sensitive adhesive having excellent adhesive property, facilitating secondary processing of an adhesive product and providing an adhesive product with excellent holding strength to a substrate and adhesion property to a curved surface. The present invention relates to a water-based composition comprising: (A) an aqueous resin emulsion comprising a polymer having a glass transition temperature of ?65 to ?40° C. and (B) an aqueous resin emulsion comprising a polymer having a glass transition temperature of 20° C. or more, wherein the aqueous resin emulsion has a minimum film-forming temperature of 40° C. or more.
    Type: Application
    Filed: May 24, 2017
    Publication date: September 7, 2017
    Inventors: Atsushi KAKUDA, Yoshio Yoshida