Patents by Inventor Atsushi Kashiwazaki
Atsushi Kashiwazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10651118Abstract: A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.Type: GrantFiled: April 16, 2019Date of Patent: May 12, 2020Assignee: DENSO CORPORATIONInventors: Kosuke Suzuki, Atsushi Kashiwazaki, Yuki Sanada, Toshihiro Nakamura, Shinya Uchibori
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Publication number: 20190244886Abstract: A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.Type: ApplicationFiled: April 16, 2019Publication date: August 8, 2019Inventors: Kosuke SUZUKI, Atsushi KASHIWAZAKI, Yuki SANADA, Toshihiro NAKAMURA, Shinya UCHIBORI
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Patent number: 9795053Abstract: An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.Type: GrantFiled: June 17, 2014Date of Patent: October 17, 2017Assignee: DENSO CORPORATIONInventors: Yuki Sanada, Atsushi Kashiwazaki
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Publication number: 20160183405Abstract: An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.Type: ApplicationFiled: June 17, 2014Publication date: June 23, 2016Inventors: Yuki SANADA, Atsushi KASHIWAZAKI
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Publication number: 20160105958Abstract: In a multi-layer substrate, a glass cloth of a build-up layer is deformed toward a land below the land. A thickness of a resin layer of the build-up layer from the glass cloth to a surface adjacent to the land is set to be smaller than a dimension from the glass cloth to a front surface of a core layer. With the above configuration, a progress or an enlargement of a crack can be suppressed from a stage in which the crack is smaller. Therefore, the progress and the enlargement of the crack can be delayed. As a result, even if the crack is generated, an insulating property between the land and an inner layer wire is ensured, and the land and the inner layer wire can be restricted from being short-circuited.Type: ApplicationFiled: April 21, 2014Publication date: April 14, 2016Inventors: Toshihiro NAKAMURA, Shinya UCHIBORI, Koji NUMAZAKI, Atsushi KASHIWAZAKI, Masaji IMADA, Eiji YABUTA
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Patent number: 8772912Abstract: An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.Type: GrantFiled: December 21, 2010Date of Patent: July 8, 2014Assignee: DENSO CORPORATIONInventors: Shotaro Miyawaki, Katsuhiko Kawashima, Atsushi Kashiwazaki, Takashi Yoshimizu
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Patent number: 8386141Abstract: A vehicle control system for an automatic transmission includes a range selector for outputting a range instruction signal representing the selected shift range and a range shifter for manually outputting a shift instruction signal, and a by-wire control part for controlling the change-over of the shift range according to the range instruction signal input from the range selector. The by-wire control part has a range control circuit, which uses the shift instruction signal input from the range shifter if the range instruction signal is abnormal while monitoring the range instruction signal input from the range selector.Type: GrantFiled: December 23, 2008Date of Patent: February 26, 2013Assignee: Denso CorporationInventors: Koutarou Tanaka, Haruki Matsuzaki, Atsushi Kashiwazaki
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Patent number: 8358514Abstract: In an electronic control device, an electrically-conductive adhesive is arranged on an outer edge portion of a first surface of a circuit board as a stress reducing portion for reducing stress of the circuit board received by a molding resin. An elastic modulus of the electrically-conductive adhesive is lower than that of the circuit board. The electrically-conductive adhesive is covered by an adhesion improving member. When peeling stress is applied to the circuit board from the molding resin, the electrically-conductive adhesive and the adhesion improving member receive the peeling stress to be deformed. Therefore, the peeling stress to the circuit board is reduced.Type: GrantFiled: October 15, 2009Date of Patent: January 22, 2013Assignee: DENSO CORPORATIONInventors: Atsushi Kashiwazaki, Yasumitsu Tanaka
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Publication number: 20110180915Abstract: An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer.Type: ApplicationFiled: December 21, 2010Publication date: July 28, 2011Applicant: DENSO CORPORATIONInventors: Shotaro MIYAWAKI, Katsuhiko KAWASHIMA, Atsushi KASHIWAZAKI, Takashi YOSHIMIZU
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Publication number: 20100097775Abstract: In an electronic control device, an electrically-conductive adhesive is arranged on an outer edge portion of a first surface of a circuit board as a stress reducing portion for reducing stress of the circuit board received by a molding resin. An elastic modulus of the electrically-conductive adhesive is lower than that of the circuit board. The electrically-conductive adhesive is covered by an adhesion improving member. When peeling stress is applied to the circuit board from the molding resin, the electrically-conductive adhesive and the adhesion improving member receive the peeling stress to be deformed. Therefore, the peeling stress to the circuit board is reduced.Type: ApplicationFiled: October 15, 2009Publication date: April 22, 2010Applicant: DENSO CORPORATIONInventors: Atsushi Kashiwazaki, Yasumitsu Tanaka
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Patent number: 7679914Abstract: An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.Type: GrantFiled: September 21, 2007Date of Patent: March 16, 2010Assignee: DENSO CORPORATIONInventor: Atsushi Kashiwazaki
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Publication number: 20090171544Abstract: A vehicle control system for an automatic transmission includes a range selector for outputting a range instruction signal representing the selected shift range and a range shifter for manually outputting a shift instruction signal, and a by-wire control part for controlling the change-over of the shift range according to the range instruction signal input from the range selector. The by-wire control part has a range control circuit, which uses the shift instruction signal input from the range shifter if the range instruction signal is abnormal while monitoring the range instruction signal input from the range selector.Type: ApplicationFiled: December 23, 2008Publication date: July 2, 2009Applicant: DENSO CORPORATIONInventors: Koutarou Tanaka, Haruki Matsuzaki, Atsushi Kashiwazaki
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Publication number: 20080074829Abstract: An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.Type: ApplicationFiled: September 21, 2007Publication date: March 27, 2008Applicant: DENSO CORPORATIONInventor: Atsushi Kashiwazaki
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Patent number: 7349227Abstract: An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible portions are folded by 180° to dispose respective rigid portions to be parallel to each other. The rigid portions, positioned at both ends of the circuit substrate, mount connectors so as to face to mutually opposed directions. Other rigid portions mount electronic components and heater components. The outermost connectors are connected to different connection objects. The casing is made of a metal material so that heat generating from the heater components can be transmitted via heat dissipation gel to the casing and efficiently released to the outside.Type: GrantFiled: April 13, 2005Date of Patent: March 25, 2008Assignee: DENSO CORPORATIONInventor: Atsushi Kashiwazaki
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Patent number: 7221058Abstract: A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically connected through a via-hole for interlayer continuity. A through-hole provided through the insulation layer of the outermost surface layer is formed. A bump is inserted in the through-hole to a bump allocating position of the semiconductor chip to be mounted in the insulation layer of the outermost surface layer. A portion of the wire in the wiring layer of the outermost surface layer is projected to the internal side of through-hole at the aperture of the through-hole.Type: GrantFiled: September 28, 2004Date of Patent: May 22, 2007Assignee: Denso CorporationInventor: Atsushi Kashiwazaki
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Patent number: 7129586Abstract: A bump is formed on a bonding pad provided on a substrate. A passivation film covering a bonding pad provided on a semiconductor chip is provided with two apertures in which bumps are formed. The bump provided on the substrate advances and enters into a clearance between these bumps provided on the semiconductor chip when the semiconductor chip is packaged with the substrate.Type: GrantFiled: June 24, 2004Date of Patent: October 31, 2006Assignee: Denso CorporationInventor: Atsushi Kashiwazaki
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Publication number: 20050239343Abstract: An electronic control device includes a circuit substrate consisting of four rigid portions and intervening flexible portions which are serially connected to each other. This circuit substrate is accommodated in a casing in such a manner that respective flexible portions are folded by 180° to dispose respective rigid portions to be parallel to each other. The rigid portions, positioned at both ends of the circuit substrate, mount connectors so as to face to mutually opposed directions. Other rigid portions mount electronic components and heater components. The outermost connectors are connected to different connection objects. The casing is made of a metal material so that heat generating from the heater components can be transmitted via heat dissipation gel to the casing and efficiently released to the outside.Type: ApplicationFiled: April 13, 2005Publication date: October 27, 2005Applicant: Denso CorporationInventor: Atsushi Kashiwazaki
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Publication number: 20050116354Abstract: A substrate for mounting a semiconductor chip is formed as a multilayer substrate by alternately laminating insulation layers and wiring layers. Wires of the wiring layers are electrically connected through a via-hole for interlayer continuity. A through-hole provided through the insulation layer of the outermost surface layer is formed. A bump is inserted in the through-hole to a bump allocating position of the semiconductor chip to be mounted in the insulation layer of the outermost surface layer. A portion of the wire in the wiring layer of the outermost surface layer is projected to the internal side of through-hole at the aperture of the through-hole.Type: ApplicationFiled: September 28, 2004Publication date: June 2, 2005Inventor: Atsushi Kashiwazaki
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Publication number: 20050104196Abstract: A semiconductor package includes interposer substrates for providing miniaturization. One side of a first interposer substrate having a through-hole is fixed to one side of a heat sink. A non-active side of a semiconductor chip is fixed on one side of the heat sink in the through-hole of the first interposer substrate. The semiconductor chip and the first interposer substrate are connected electrically by bonding wire. One side of a second interposer substrate is fixed on the active side of the semiconductor chip that is located inside of the through-hole of the first interposer substrate. The semiconductor chip and the second interposer substrate are connected electrically by bonding wire.Type: ApplicationFiled: October 28, 2004Publication date: May 19, 2005Inventor: Atsushi Kashiwazaki
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Publication number: 20040262753Abstract: A bump is formed on a bonding pad provided on a substrate. A passivation film covering a bonding pad provided on a semiconductor chip is provided with two apertures in which bumps are formed. The bump provided on the substrate advances and enters into a clearance between these bumps provided on the semiconductor chip when the semiconductor chip is packaged with the substrate.Type: ApplicationFiled: June 24, 2004Publication date: December 30, 2004Applicant: DENSO CORPORATIONInventor: Atsushi Kashiwazaki