Patents by Inventor Atsushi KAWADE

Atsushi KAWADE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module bonding structure and bonding method
    Patent number: 11145589
    Abstract: A semiconductor module bonding structure includes: a semiconductor module including a semiconductor element and a positive terminal which is a plate-shaped power terminal electrically connected to the semiconductor element; and a main P bus bar which is a bus bar including a plate-shaped bonding part bonded to the positive terminal of the semiconductor module. The positive terminal of the semiconductor module which is one of the positive terminal and the bonding part of the main P bus bar that has a relatively small thickness is configures to be wider than the bonding part which is the other having a relatively large thickness, and the positive terminal and the bonding part are bonded together by fusion welding in the state of being arranged so that the respective thickness directions of the positive terminal and the bonding part are orthogonal to each other.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: October 12, 2021
    Assignee: DENSO CORPORATION
    Inventors: Naohisa Harada, Hiroshi Kondo, Kyosuke Ishikawa, Atsushi Kawade
  • SEMICONDUCTOR MODULE BONDING STRUCTURE AND BONDING METHOD
    Publication number: 20200203269
    Abstract: A semiconductor module bonding structure includes: a semiconductor module including a semiconductor element and a positive terminal which is a plate-shaped power terminal electrically connected to the semiconductor element; and a main P bus bar which is a bus bar including a plate-shaped bonding part bonded to the positive terminal of the semiconductor module. The positive terminal of the semiconductor module which is one of the positive terminal and the bonding part of the main P bus bar that has a relatively small thickness is configures to be wider than the bonding part which is the other having a relatively large thickness, and the positive terminal and the bonding part are bonded together by fusion welding in the state of being arranged so that the respective thickness directions of the positive terminal and the bonding part are orthogonal to each other.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 25, 2020
    Applicant: DENSO CORPORATION
    Inventors: Naohisa HARADA, Hiroshi KONDO, Kyosuke ISHIKAWA, Atsushi KAWADE