Patents by Inventor Atsushi Kikkawa

Atsushi Kikkawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8536294
    Abstract: It is an object of the present invention to provide an adhesive composition which is moisture-curable, has excellent adhesive properties and resistance to moist heat, and exhibits excellent durability even when used for joining materials having different coefficients of linear expansion. The present invention provides an adhesive composition having: a reactive silicon-containing group-bearing compound (A) which includes a compound (c) formed by reacting a silane coupling agent (a) having a reactive silicon-containing group and a functional group with a compound (b) having at least one reactive group to react with the functional group and at least one aromatic ring, wherein the reactive silicon-containing group-bearing compound (A) has a number-average molecular weight per reactive silicon-containing group of 800 or less.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: September 17, 2013
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Atsushi Kikkawa, Kazushi Kimura
  • Patent number: 7968667
    Abstract: To provide adhesive compositions for optical fibers which are curable with moisture and excellent in adhesiveness and resistance to moist heat. An Adhesive composition for optical fibers containing (A) a component having a reactive silicon containing group which contains (e) a compound obtained by reacting (a) an epoxy compound having at least one epoxy group with (b) a silane coupling agent having both a reactive silicon containing group and an epoxy-reactive group, wherein the component (A) has a molecular weight of 1000 or below per reactive silicon containing group; and an adhesive composition for optical fibers containing an alkylsilyl ester and (B) a compound other than the alkylsilyl ester which has at least one reactive silicon containing group.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: June 28, 2011
    Assignees: The Yokohama Rubber Co., Ltd.
    Inventors: Seiko Mitachi, Atsushi Kikkawa, Kazushi Kimura
  • Publication number: 20080319142
    Abstract: It is an object of the present invention to provide an adhesive composition which is moisture-curable, has excellent adhesive properties and resistance to moist heat, and exhibits excellent durability even when used for joining materials having different coefficients of linear expansion. The present invention provides an adhesive composition having: a reactive silicon-containing group-bearing compound (A) which includes a compound (c) formed by reacting a silane coupling agent (a) having a reactive silicon-containing group and a functional group with a compound (b) having at least one reactive group to react with the functional group and at least one aromatic ring, wherein the reactive silicon-containing group-bearing compound (A) has a number-average molecular weight per reactive silicon-containing group of 800 or less.
    Type: Application
    Filed: August 26, 2005
    Publication date: December 25, 2008
    Applicant: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Atsushi Kikkawa, Kazushi Kimura
  • Publication number: 20080009562
    Abstract: [Problems] To provide adhesive compositions for optical fibers which are curable with moisture and excellent in adhesiveness and resistance to moist heat. [Means For Solving Problems] An Adhesive composition for optical fibers containing (A) a component having a reactive silicon containing group which contains (e) a compound obtained by reacting (a) an epoxy compound having at least one epoxy group with (b) a silane coupling agent having both a reactive silicon containing group and an epoxy-reactive group, wherein the component (A) has a molecular weight of 1000 or below per reactive silicon containing group; and an adhesive composition for optical fibers containing an alkylsilyl ester and (B) a compound other than the alkylsilyl ester which has at least one reactive silicon containing group.
    Type: Application
    Filed: August 22, 2005
    Publication date: January 10, 2008
    Applicants: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Seiko Mitachi, Atsushi Kikkawa, Kazushi Kimura
  • Patent number: 5859101
    Abstract: A rubber composition for a tire, comprising at least one compound selected from the group consisting of ascorbic acid and derivatives thereof, tocopherols, and citric acid and derivatives thereof.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: January 12, 1999
    Assignee: The Yokohama Rubber Co. Ltd.
    Inventors: Atsushi Kikkawa, Masayuki Kawazoe, Yoshiaki Sakamaki, Mitsuo Sakurai, Koichi Horie, Issey Nakakita
  • Patent number: 5005959
    Abstract: An illumination system applicable to contact or proximity exposure apparatuses provides excellently collimated light without any irradiance reduction in the peripheral area of an object to be illuminated and includes a light source, an ellipsoidal mirror positioned with respect to the light source, an optical system designed so that the entrance height of the light received in the entrance pupil thereof is substantially proportioned to the tangent of the exit angle in the exit pupil thereof, and a single Fresnel lens designed so that light passing therethrough is abated in the spherical aberration. Light exiting from the optical system is received on the front surface of the Fresnel lens, where the irradiance distribution is uniform through the surface, and the Fresnel lens transmits light received with abated spherical aberration to a mask film bearing a desired circuit pattern.
    Type: Grant
    Filed: May 24, 1989
    Date of Patent: April 9, 1991
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Shinichi Nagata, Atsushi Kikkawa, Kenji Endo
  • Patent number: 4676647
    Abstract: Apparatus and a method are disclosed for measuring the thickness of a very thin transparent film formed, for example, on a photomask or wafer for an integrated circuit. Diffracted reflected light from a film specimen is converted photoelectrically by use of a one dimensional image sensor array and then by an A/D converter having a resolution of more than 2.sup.10, which allows for discrimination into 1,000 graduations of output level. Enhanced precision in determining film thickness is obtained by utilizing this high discrimination to first determine the variations among individual elements of the one dimensional sensor array and compensating for them, as well as by using known averaging and statistical techniques to generate output for comparison to reference data from film specimens of known thickness.
    Type: Grant
    Filed: November 26, 1985
    Date of Patent: June 30, 1987
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Atsushi Kikkawa, Noriyuki Kondo
  • Patent number: 4659936
    Abstract: A line width measuring device for measuring the line width in an extremely fine pattern formed on a photo-mask or wafer employs a photo-electric converter, including a one-dimensional image sensor array, to convert a magnified image of the pattern into serial output signals storable in digitized form. Compensation and averaging of the stored image element information data are performed in known manner and the results are used to detect pattern edges and hence the line width. In one embodiment the one-dimensional image sensor array can be deviated along the array's axis within the inter-element pitch of the array to enhance the precision of line width measurement.
    Type: Grant
    Filed: November 26, 1985
    Date of Patent: April 21, 1987
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Atsushi Kikkawa, Noriyuki Kondo, Atsushi Tamada