Patents by Inventor Atsushi Kinpara

Atsushi Kinpara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10211564
    Abstract: A connector-mounting structure includes a case and a connector mounted on the case. The connector has a connector housing, a terminal, a waterproof elastic member, and a connector holding plate fixed to an inner surface of the case. An outer size of the connector housing is larger than a hole size of a through-hole of the case. The waterproof elastic member has a sealing portion. A size of a recess of the connector holding plate is larger than an outer size of a flange portion of the connector housing. A hole size of a housing insertion hole of the connector holding plate is larger than an outer circumferential size of a main body of the connector housing. An outer circumferential size of the insertion portion is smaller than the hole size of the through-hole.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: February 19, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Yuki Miyazawa, Atsushi Kinpara
  • Publication number: 20180351284
    Abstract: A connector-mounting structure includes a case and a connector mounted on the case. The connector has a connector housing, a terminal, a waterproof elastic member, and a connector holding plate fixed to an inner surface of the case. An outer size of the connector housing is larger than a hole size of a through-hole of the case. The waterproof elastic member has a sealing portion. A size of a recess of the connector holding plate is larger than an outer size of a flange portion of the connector housing. A hole size of a housing insertion hole of the connector holding plate is larger than an outer circumferential size of a main body of the connector housing. An outer circumferential size of the insertion portion is smaller than the hole size of the through-hole.
    Type: Application
    Filed: May 22, 2018
    Publication date: December 6, 2018
    Inventors: Yuki Miyazawa, Atsushi Kinpara