Patents by Inventor Atsushi Kishimoto

Atsushi Kishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11936210
    Abstract: A power transmission apparatus includes a controller that controls a power transmitter that performs wireless power transmission. The controller is configured to: cause the processor to: cause the power transmitter to emit a first power transmission beam for which a first power is set; acquire feedback information on a result of reception of the first power transmission beam in a power reception apparatus; identify a power receiving capability in the power reception apparatus; and determine, with reference to the power receiving capability and the reception result, a second power which is usable in wireless power supply for the power reception apparatus and which is larger than the first power. The power receiving capability includes a maximum value of an input power range of the power reception apparatus. The wireless power transmission uses an electromagnetic wave having a frequency equal to or higher than that of a microwave.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Space Power Technologies Inc.
    Inventors: Nobuyuki Takabayashi, Atsushi Kishimoto, Minoru Furukawa, Takuji Morita, Yuji Takeda
  • Patent number: 11864313
    Abstract: A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: January 2, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Kishimoto, Masatoshi Kakue, Shuichi Kawata, Hiroshi Nishikawa
  • Publication number: 20230119903
    Abstract: A multilayer circuit board includes a resin body, signal wires, ground conductors, and a via conductor. The resin body includes resin layers made from thermoplastic resin. The signal wires and the ground conductors are each on or inside the resin body. The via conductor connects corresponding ones of the signal wires to each other or corresponding ones of the ground conductors to each other. The ground conductors include a counter ground conductor on or inside the resin body, facing a signal wire in a stacking direction in which the resin layers are stacked, and overlapping the signal wire in plan view in the stacking direction. The counter ground conductor is made of a graphite sheet including main surfaces and end surfaces covered with a conductor layer. The graphite sheet extends over rigid and flexible portions in plan view in the stacking direction.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 20, 2023
    Inventors: Takumi MASAKI, Atsushi KISHIMOTO, Masato INAOKA, Takashi SHIMIZU, Hiroshi NISHIKAWA, Takahiro TAKADA
  • Publication number: 20230101917
    Abstract: A multilayer circuit board includes a board body including insulator layers stacked upon each other, a first land pattern at the board body to mount a passive component, a second land pattern at the board body to mount an active component, and a heat-dissipation layer between the insulator layers and extending along main surfaces of the insulator layers. The heat-dissipation layer includes a hole extending therethrough in a stacking direction of the insulator layers. In a plan view from the stacking direction, an outer edge of the hole of the heat-dissipation layer is on an outer side of the first land pattern, or overlaps the first land pattern.
    Type: Application
    Filed: December 8, 2022
    Publication date: March 30, 2023
    Inventors: Atsushi KISHIMOTO, Takumi MASAKI, Masato INAOKA, Takashi SHIMIZU, Hiroshi NISHIKAWA, Takahiro TAKADA
  • Patent number: 11555656
    Abstract: A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: January 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Kishimoto, Osamu Chikagawa
  • Publication number: 20220094212
    Abstract: A power transmission apparatus includes a controller that controls a power transmitter that performs wireless power transmission. The controller is configured to: cause the processor to: cause the power transmitter to emit a first power transmission beam for which a first power is set; acquire feedback information on a result of reception of the first power transmission beam in a power reception apparatus; identify a power receiving capability in the power reception apparatus; and determine, with reference to the power receiving capability and the reception result, a second power which is usable in wireless power supply for the power reception apparatus and which is larger than the first power. The power receiving capability includes a maximum value of an input power range of the power reception apparatus. The wireless power transmission uses an electromagnetic wave having a frequency equal to or higher than that of a microwave.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 24, 2022
    Applicant: Space Power Technologies Inc.
    Inventors: Nobuyuki TAKABAYASHI, Atsushi KISHIMOTO, Minoru FURUKAWA, Takuji MORITA, Yuji TAKEDA
  • Patent number: 11277940
    Abstract: A vapor chamber that includes a housing, a wick structure joined to a major inside surface of the housing, and a working liquid enclosed inside the housing. The wick structure is joined to the housing at a joint portion within a joint region, and a proportion of a total area of the joint portion within the joint region to an area of the joint region is 50% or less.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: March 15, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takuo Wakaoka, Norikazu Kume, Haruhiko Ikeda, Tatsuhiro Numoto, Atsushi Kishimoto
  • Publication number: 20210337663
    Abstract: A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 28, 2021
    Inventors: Atsushi KISHIMOTO, Masatoshi KAKUE, Shuichi KAWATA, Hiroshi NISHIKAWA
  • Patent number: 11150030
    Abstract: A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90° or less between a joint and a support nearest to the joint. The expression 0.02?b/a?0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: October 19, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Kishimoto, Norikazu Kume, Haruhiko Ikeda, Takuo Wakaoka, Osamu Chikagawa, Tatsuhiro Numoto
  • Patent number: 11058031
    Abstract: A vapor chamber that includes a housing composed of a first sheet and a second sheet facing each other and having outer edge portions thereof joined to each other to define an internal space, the second sheet having a plurality of projecting portions on an inner surface thereof that faces the internal space; a pillar between the first sheet and the second sheet and supporting them from the internal space; a wick arranged in the housing, and a working fluid enclosed in the housing. A first flow path and a second flow path are formed in the internal space, and a cross-sectional area of the second flow path is larger than a cross-sectional area of the first flow path.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: July 6, 2021
    Assignee: MURATA MANUFACTURING CO., LTD
    Inventors: Tatsuhiro Numoto, Takuo Wakaoka, Atsushi Kishimoto, Osamu Chikagawa
  • Publication number: 20200333081
    Abstract: A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.
    Type: Application
    Filed: July 7, 2020
    Publication date: October 22, 2020
    Inventors: Atsushi Kishimoto, Osamu Chikagawa
  • Publication number: 20200124352
    Abstract: A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, wherein the sheet-shaped container includes a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet are superposed and at least partially bonded to provide a closed internal space therebetween, and a thickness of the sheet-shaped container is about 0.5 mm or less.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Inventors: Takuo WAKAOKA, Atsushi KISHIMOTO, Tadamasa MIURA
  • Publication number: 20200060044
    Abstract: A vapor chamber that includes a housing composed of a first sheet and a second sheet facing each other and having outer edge portions thereof joined to each other to define an internal space, the second sheet having a plurality of projecting portions on an inner surface thereof that faces the internal space; a pillar between the first sheet and the second sheet and supporting them from the internal space; a wick arranged in the housing, and a working fluid enclosed in the housing. A first flow path and a second flow path are formed in the internal space, and a cross-sectional area of the second flow path is larger than a cross-sectional area of the first flow path.
    Type: Application
    Filed: September 19, 2019
    Publication date: February 20, 2020
    Inventors: Tatsuhiro Numoto, Takuo Wakaoka, Atsushi Kishimoto, Osamu Chikagawa
  • Publication number: 20200045848
    Abstract: A vapor chamber that includes a housing, a wick structure joined to a major inside surface of the housing, and a working liquid enclosed inside the housing. The wick structure is joined to the housing at a joint portion within a joint region, and a proportion of a total area of the joint portion within the joint region to an area of the joint region is 50% or less.
    Type: Application
    Filed: October 10, 2019
    Publication date: February 6, 2020
    Inventors: Takuo Wakaoka, Norikazu Kume, Haruhiko Ikeda, Tatsuhiro Numoto, Atsushi Kishimoto
  • Patent number: 10544994
    Abstract: A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: January 28, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takuo Wakaoka, Atsushi Kishimoto, Tadamasa Miura
  • Publication number: 20190271511
    Abstract: A vapor chamber includes a housing including first and second sheets that face each other and that include respective outer edge portions joined to each other, supports that support the first and second sheets from inside and that are disposed therebetween, and a hydraulic fluid enclosed in the housing. The first and second sheets do not include an angled portion having an angle of about 90° or less between a joint and a support nearest to the joint. The expression 0.02?b/a?0.3 is satisfied, where a is a distance from an outer edge of the outermost support to an inner edge of the joint between the first and second sheets, and b is a distance between the first and second sheets at the outer edge of the outermost support.
    Type: Application
    Filed: May 17, 2019
    Publication date: September 5, 2019
    Inventors: Atsushi KISHIMOTO, Norikazu KUME, Haruhiko IKEDA, Takuo WAKAOKA, Osamu CHIKAGAWA, Tatsuhiro NUMOTO
  • Publication number: 20180010861
    Abstract: A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.
    Type: Application
    Filed: September 22, 2017
    Publication date: January 11, 2018
    Inventors: Takuo WAKAOKA, Atsushi KISHIMOTO, Tadamasa MIURA
  • Patent number: 9273574
    Abstract: According to the present invention, there is provided an exhaust gas purifying filter capable of effectively removing collected particulate matter. An exhaust gas purifying filter of the present invention includes an inflow surface into which exhaust gas including particulate matter flows, an exhaust surface which exhausts purified gas, and a filter substrate which is constructed of a porous body, wherein the filter substrate includes porous partitions and gas passages which are enclosed by the partitions, and a porous film, which includes silicon carbide and pores having a smaller pore diameter than the pores of the partitions, is provided on the surface of the partitions, and a silicon dioxide layer is formed on at least an outer surface portion of the porous film.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: March 1, 2016
    Assignees: SUMITOMO OSAKA CEMENT CO., LTD., HONDA MOTOR CO., LTD.
    Inventors: Masamichi Tanaka, Atsushi Kishimoto, Tadashi Neya, Keita Ishizaki
  • Patent number: 8741020
    Abstract: An object is to provide an exhaust gas purification filter that can achieve high trapping efficiency of particulate matter and low pressure loss, and the exhaust gas purification filter includes an inflow surface through which exhaust gas containing particulate matter flows in, a discharge surface from which purified gas is discharged, and a filter base body that is formed from a porous body, wherein the filter base body includes porous partition walls and gas flow paths surrounded by the partition walls, a porous film having a pore size smaller than that of pores of the partition walls is provided on each surface of the partition walls, and microgrooves having a depth shallower than the thickness of the porous film are formed on at least a part of a surface of the porous film.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: June 3, 2014
    Assignees: Sumitomo Osaka Cement Co., Ltd., Honda Motor Co., Ltd.
    Inventors: Atsushi Kishimoto, Masamichi Tanaka, Keita Ishizaki, Katsunori Hanamura
  • Patent number: 8657914
    Abstract: There is provided an exhaust gas purifying filter, which includes an inflow surface into which exhaust gas including particulate matter flows, an exhaust surface from which purified gas is exhausted, and a filter substrate which is constructed of a porous body, the filter substrate including a porous partition and a gas passage which is enclosed by the porous partition, a porous film which includes silicon carbide is provided on a surface of the porous partition, and in a pore diameter distribution of the porous film, pores with the pore diameter of 0.01 ?m or more and 3.0 ?m or less are 70% or more of total volume of the pores, and pores with the pore diameter of 0.01 ?m or more and 0.3 ?m or less are 5% or more and 90% or less of total volume of the pores.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: February 25, 2014
    Assignees: Sumitomo Osaka Cement Co., Ltd., Honda Motor Co., Ltd.
    Inventors: Masamichi Tanaka, Atsushi Kishimoto, Tadashi Neya, Keita Ishizaki