Abstract: An apparatus for analyzing that performs a plurality of treatment operations includes a plurality of treatment units arranged in a vertical direction of the apparatus. The apparatus for analyzing also includes a conveying mechanism configured to convey a sample between the treatment units. The sample is delivered above or in the treatment units. A pipette chip is also delivered above or in the treatment units.

Abstract: A sample processing apparatus prevents samples and reagents from being degraded due to a prolonged waiting time other than for reaction and improves the operation efficiency of the apparatus. The apparatus includes a plurality of processing sections for causing at least two samples to react independently, an input/output terminal 15 for inputting the upper limit of the waiting time and the reaction time for each of the samples, a schedule management section for determining at least the clock time of introducing each of the samples, the processing section to be used for processing the sample and/or the waiting time for the sample, and a general control section for controlling the processing of the samples at the plurality of processing sections according to the determination by the schedule management section.

Abstract: An apparatus for analyzing that performs a plurality of treatment operations includes a plurality of treatment units arranged in a vertical direction of the apparatus. The apparatus for analyzing also includes a conveying mechanism configured to convey a sample between the treatment units. The sample is delivered above or in the treatment units. A pipette chip is also delivered above or in the treatment units.

Abstract: A sample processing apparatus prevents samples and reagents from being degraded due to a prolonged waiting time other than for reaction and improves the operation efficiency of the apparatus. The apparatus includes a plurality of processing sections for causing at least two samples to react independently, an input/output terminal 15 for inputting the upper limit of the waiting time and the reaction time for each of the samples, a schedule management section for determining at least the clock time of introducing each of the samples, the processing section to be used for processing the sample and/or the waiting time for the sample, and a general control section for controlling the processing of the samples at the plurality of processing sections according to the determination by the schedule management section.

Abstract: A measuring apparatus having a probe that faces a surface of a target and is configured to supply AC current to the surface, measuring a voltage drop through a space between the probe and the surface, and obtaining a distance between the probe and the surface in accordance with the measured voltage drop. The apparatus includes a ground member facing, and apart from, the surface and configured to ground the surface by capacitive coupling, and a stage configured to hold either of the target and the probe and to move to define a measurement area on the surface. The ground member is configured so that the ground member faces all areas of the surface with respect to each of a plurality of measurement areas on the surface defined by a position of the stage.

Abstract: Measuring apparatuses each of which measures the distance between a probe and a target are disclosed. One of the disclosed measuring apparatuses includes a ground member which opposes the target in a non-contact manner and substantially grounds the target, and an output unit which is connected to the probe and the ground member and outputs a signal based on an AC current corresponding to a capacitance between the probe and the target.

Abstract: A measuring apparatus having a probe that faces a surface of a target and is configured to supply AC current to the surface, measuring a voltage drop through a space between the probe and the surface, and obtaining a distance between the probe and the surface in accordance with the measured voltage drop. The apparatus includes a ground member facing, and apart from, the surface and configured to ground the surface by capacitive coupling, and a stage configured to hold either of the target and the probe and to move to define a measurement area on the surface. The ground member is configured so that the ground member faces all areas of the surface, with respect to each of a plurality of measurement areas on the surface defined by a position of the stage.

Abstract: An exposure apparatus includes a projection optical system for projecting an image of a pattern of a reticle onto an object, via a fluid that is filled in a space between said projection optical system and the object, a vibrator part for vibrating at least one of the fluid, the object, and the projection optical system, and a controller for controlling the vibrator part so that the vibration of at least one of the fluid, the object, and the projection optical system becomes a tolerance during a processing of the object.

Abstract: A measurement apparatus which measures a distance between a sensor probe and a target to be measured by using an electrostatic capacitance sensor, comprises first and second sensor probes (101, 102) which are arranged at respective predetermined gaps to the target (4), and first and second sensor amplifiers (111, 112) which are connected respectively to the first and second sensor probes, wherein when the distance between the target and the first or second sensor probe is measured, said first amplifier supplies a first current with the first sensor probe and said second amplifier supplies a second current which is different phase and/or amplitude from the first current.

Abstract: An exposure apparatus includes a projection optical system for projecting an image of a pattern of a reticle onto an object, via a fluid that is filled in a space between said projection optical system and the object, a vibrator part for vibrating at least one of the fluid, the object, and the projection optical system, and a controller for controlling the vibrator part so that the vibration of at least one of the fluid, the object, and the projection optical system becomes a tolerance during a processing of the object.

Abstract: A light generation apparatus is capable of widely changing the intensity of generated light. The light generation apparatus includes an X-ray source, a high-voltage generation circuit, and a CPU. The high-voltage generation circuit has a plurality of capacitors, and a plurality of switches, which are arranged on the charging and discharging paths of the capacitors. The CPU controls the switches to switch a capacitor for supplying electric energy to the X-ray point source, thereby changing electric energy supplied to the X-ray point source.

Abstract: a measurement apparatus which measures a distance between a sensor probe and a target to be measured by using an electrostatic capacitance sensor, comprises first and second sensor probes (101, 102) which are arranged at respective predetermined gaps to the target (4), and first and second sensor amplifiers (111, 112) which are connected respectively to the first and second sensor probes, wherein when the distance between the target and the first or second sensor probe is measured, said first amplifier supplies a first current with the first sensor probe and said second amplifier supplies a second current which is different phase and/or amplitude from the first current.

Abstract: Measuring apparatuses each of which measures the distance between a probe and a target are disclosed. One of the disclosed measuring apparatuses includes a ground member which opposes the target in a non-contact manner and substantially grounds the target, and an output unit which is connected to the probe and the ground member and outputs a signal based on an AC current corresponding to a capacitance between the probe and the target.

Abstract: An X-ray exposure apparatus includes an X-ray source for generating pulsed X-rays, which are emitted radially, and first to nth exposure devices, disposed in a position facing the X-ray source and receiving the X-rays in an approximately perpendicular direction, and which use the received X-rays. The exposure devices project patterns of first to nth masks onto respective ones of first to nth substrates that are to be exposed.

Abstract: Disclosed is a light generation apparatus capable of widely changing the intensity of generated light. The light generation apparatus includes an X-ray source (10), high-voltage generation circuit (20), and CPU (40). The high-voltage generation circuit (20) has a plurality of capacitors (C1-C3), and a plurality of switches (S1-S6) which are arranged on the charging and discharging paths of the capacitors. The CPU (40) controls the switches to switch a capacitor for supplying electric energy to the X-ray point source (10), thereby changing electric energy supplied to the X-ray point source (10).

Abstract: A position detecting method and position detecting system, for measuring a position of a pattern formed on an object to be observed, for use in an exposure apparatus. The method includes providing incoherence-transformed illumination light for illuminating the pattern surface of the object by use of coherent light, and incoherence-transformed reference light, changing the quantity of the reference light in accordance with a reflection factor of the pattern surface, imaging reflection light from the pattern surface and reference light reflected by a conjugate mirror, together, upon a photoelectric converting element, and measuring the position of the pattern on the basis of an interference image signal obtainable by the imaging.

Abstract: An X-ray exposure apparatus for raising the efficiency of utilization of all radiant energy possessed by X rays includes a point-source X-ray source device (101); a first collimator (110) to a third collimator (130) for varying at least one of angle and intensity of X rays generated by the point-source X-ray source device; and a first exposure unit 119, second exposure unit 129 and third exposure unit 139, which correspond to respective ones of the collimators, for transferring patterns on masks (113, 123, 133) to wafers (114, 124, 134) using X rays emitted from respective ones of the collimators.

Abstract: Disclosed is a position detecting method and position detecting system for measuring a position of a pattern formed on an object to be observed, for use in an exposure apparatus. The method includes providing incoherence-transformed illumination light for illuminating the pattern surface of the object by use of coherent light, and incoherence-transformed reference light, changing the quantity of the reference light in accordance with a reflection factor of the pattern surface, and imaging reflection light from the pattern surface and reference light reflected by a conjugate mirror, together, upon a photoelectric converting element, and measuring the position of the pattern on the basis of an interference image signal obtainable by the imaging.

Abstract: A substrate holding system includes a holding mechanism for holding a substrate through vacuum attraction, a vacuum evacuating device for supplying a vacuum to the holding mechanism, a first voltage source for supplying electric power to the vacuum evacuating device, a second voltage source, separate from the first voltage source, for supplying electric power to the vacuum evacuating device, and a controller for energizing the vacuum evacuating device at a higher evacuation capacity level, when the first voltage source is in operable order, and for energizing the vacuum evacuating device at a lower evacuation capacity level, when the second voltage source supplies electric power to the vacuum evacuating device, and the first voltage source is not in operable order.

Abstract: A method of aligning a mask and a wafer includes a step for providing the mask with first and second patterns each having an optical power and providing the wafer with first and second marks each having an optical power. A radiation beam irradiating the first pattern and the first mark produces a first beam, displaceable at a first magnification with a positional deviation of the wafer with respect to the mask, and irradiating the second pattern and the second mark produces a second beam, displaceable at a second magnification, larger than the first magnification, with a positional deviation of the wafer with respect to the mask. A first detecting step projects a radiation beam to the first mark and the first pattern to produce the first beam and detects a positional deviation of the wafer with respect to the mask based on the first beam. A first aligning step roughly aligns the wafer with the mask in accordance with the first detecting step.