Patents by Inventor Atsushi Koshizawa

Atsushi Koshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power Semiconductor Module, Method of Manufacturing Power Semiconductor Module, and Power Conversion Device
    Publication number: 20130328185
    Abstract: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is housed; and a connecting member which connects the circuit body and the case. The case includes: a first heat dissipating member and a second heat dissipating member which are disposed in opposed relation to each other while interposing the circuit body in between; a side wall which joins the first heat dissipating member and the second heat dissipating member; and an intermediate member which is formed on the periphery of the first heat dissipating member and connected to the side wall, the intermediate member including a curvature that is projected toward a housing space of the case.
    Type: Application
    Filed: February 21, 2012
    Publication date: December 12, 2013
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Shinji Hiramitsu, Atsushi Koshizawa, Masato Higuma, Hiroshi Tokuda, Keiji Kawahara