Abstract: There are provided a liquid jet head and a liquid jet device capable of achieving reduction in size. There are included a first head chip and a second head chip stacked on one another in the Y direction, a first flow channel member disposed on the ?Y direction side of the first head chip, and having an inflow port communicated with an ink tank, and a first ink flow channel adapted to communicate the inflow port and the first head chip with each other, a second flow channel member disposed on the +Y direction of the second head chip, and having a second ink flow channel communicated with the second head chip, and a communication flow channel located between the first flow channel member and the second flow channel member, and adapted to communicate the first ink flow channel and the second ink flow channel with each other.

Abstract: An object of the present invention is to provide a method for producing a nozzle plate and a method for producing a liquid jet head, each capable of improving the discharge accuracy of a nozzle. A method for producing a nozzle plate according to an embodiment includes a substrate preparation step of preparing a coating agent-applied substrate in which a coating agent is applied to at least a part of a nozzle plate substrate, a nozzle hole formation step of forming a nozzle hole in a region, to which the coating agent is applied, of the coating agent-applied substrate after the substrate preparation step, and a coating agent removal step of removing the coating agent after the nozzle hole formation step.

Abstract: There are provided a flow channel member, a liquid jet head, and a liquid jet device each capable of achieving thickness reduction while ensuring the effective area of a filter.

Abstract: There are provided a flow channel member, a liquid jet head, and a liquid jet device which prevent generation of bubbles in an ink flow channel, and are excellent in ejection performance. There is included a first flow channel plate provided with a first ink flow channel adapted to communicate an ink tank and a first head chip with each other, the first ink flow channel includes a narrow flow channel located on an upstream side, a filtration flow channel located on a downstream side with respect to the narrow flow channel, and a connecting flow channel adapted to connect the narrow flow channel and the filtration flow channel to each other, and the connecting flow channel gradually increases in flow channel width in a direction from the upstream side toward the downstream side, and decreases in flow channel depth in the direction from the upstream side toward the downstream side.

Abstract: There are provided a liquid jet head and a liquid jet device capable of achieving reduction in size. There are included a first head chip and a second head chip stacked on one another in the Y direction, a first flow channel member disposed on the ?Y direction side of the first head chip, and having an inflow port communicated with an ink tank, and a first ink flow channel adapted to communicate the inflow port and the first head chip with each other, a second flow channel member disposed on the +Y direction of the second head chip, and having a second ink flow channel communicated with the second head chip, and a communication flow channel located between the first flow channel member and the second flow channel member, and adapted to communicate the first ink flow channel and the second ink flow channel with each other.

Abstract: An electronic device includes an insulating base substrate having a through electrode, an electronic element provided on one surface of the insulating base substrate and connected to the through electrode, a lid provided on the one surface of the insulating base substrate, and an external electrode covering an end face of the through electrode that is exposed on another surface of the insulating base substrate different from the one surface thereof. The external electrode has a conductive film, a first electrolytic plating film provided on the conductive film, and a second electrolytic plating film provided on the first electrolytic plating film. The conductive film is provided on the exposed end face of the through electrode and on portions of the another surface of the insulating base substrate in the vicinity of the exposed end face of the through electrode.

Abstract: An exposure portion which exposes a protection plate is formed on a back face of a nozzle plate at a part of a position other than an actuator joining face of the nozzle plate.

Abstract: A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

Abstract: An exposure portion which exposes a protection plate is formed on a back face of a nozzle plate at a part of a position other than an actuator joining face of the nozzle plate.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract: An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and is bonded to the one surface of the base substrate; and an external electrode which covers a region ranging from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in a vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, a first electrolytic plating film which is formed on a surface of the conductive film by an electrolytic plating method, and a second electrolytic plating film which is formed on a surface of the first electrolytic plating film by an electrolytic plating method.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract: A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

Abstract: An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face.