Patents by Inventor Atsushi MARUNO

Atsushi MARUNO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of testing a semiconductor element with improved pressing force direction
    Patent number: 11573169
    Abstract: A method of conducting a shear strength test on a semiconductor element with improved pressing force direction includes pressing a peripheral surface of the semiconductor element with a shear tool in a direction inclined to gradually head away from the surface of the substrate along the direction of pressing to conduct a shear strength test with a die shear strength tester.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: February 7, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Atsushi Maruno, Wataru Okamoto
  • METHOD OF TESTING SEMICONDUCTOR ELEMENT
    Publication number: 20210096058
    Abstract: A method of testing a semiconductor element, in the method a bond strength of the semiconductor element bonded to a surface of a substrate is tested, includes pressing a peripheral surface of the semiconductor element with a shear tool in a direction inclined to gradually head away from the surface of the substrate along the direction of pressing.
    Type: Application
    Filed: September 25, 2020
    Publication date: April 1, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Atsushi MARUNO, Wataru OKAMOTO