Abstract: A camera system includes a body and a camera. The body includes a controller and an image processing circuit. The camera is configured to be detachably connected to the body and includes a sensor. The sensor is configured to convert an optical image into an electrical signal and including a plurality of pixels. The controller is configured to determine a type of the camera or the first sensor according to whether one pixel or multiple pixels are used as a unit pixel of the first sensor. The image processing circuit is configured to perform predetermined image processing corresponding to the type of the camera or the first sensor on output electrical signals of the plurality of pixels.

Abstract: A camera system includes a body and a camera. The body includes a controller and an image processing circuit. The camera is configured to be detachably connected to the body and includes a sensor. The sensor is configured to convert an optical image into an electrical signal and including a plurality of pixels. The controller is configured to determine a type of the camera or the first sensor according to whether one pixel or multiple pixels are used as a unit pixel of the first sensor. The image processing circuit is configured to perform predetermined image processing corresponding to the type of the camera or the first sensor on output electrical signals of the plurality of pixels.

Abstract: A camera system includes a body, a support member, and a camera. The body includes an image processing circuit. The support member is configured to rotatably support the body. The camera is configured to be detachably arranged at the body and includes a holding member and a sensor. The holding member is configured to detachably hold a lens. The sensor is configured to convert an optical image formed by the lens into an electrical signal. The image processing circuit is configured to perform image processing on the electrical signal from the sensor.

Abstract: A camera system includes a body, a support member, and a camera. The body includes an image processing circuit. The support member is configured to rotatably support the body. The camera is configured to be detachably arranged at the body and includes a holding member and a sensor. The holding member is configured to detachably hold a lens. The sensor is configured to convert an optical image formed by the lens into an electrical signal. The image processing circuit is configured to perform image processing on the electrical signal from the sensor.

Abstract: An electronic apparatus having a photographing function includes: a flash that emits light including a visible light wavelength range and an infrared wavelength range and radiates the light onto a subject; an infrared detector that absorbs light in the infrared wavelength range and generates a detection signal corresponding to the light; an image sensor that photoelectrically transforms incident light and generates an image signal; and a controller that controls an exposure time of the image sensor based on the detection signal.

Abstract: An electronic apparatus having a photographing function includes: a flash that emits light including a visible light wavelength range and an infrared wavelength range and radiates the light onto a subject; an infrared detector that absorbs light in the infrared wavelength range and generates a detection signal corresponding to the light; an image sensor that photoelectrically transforms incident light and generates an image signal; and a controller that controls an exposure time of the image sensor based on the detection signal.

Abstract: The present invention is directed to an alloy for a high-performance rare earth permanent magnet. This alloy has a metallographic structure of approximately two phases that comprises a Nd2Fe14B phase (1) consisting of hard magnetic crystal grains and an &agr;-Fe phase (2) consisting of soft magnetic crystal grains. The metallographic structure has an ultra-thin film (3) that contains a large amount of nonmagnetic metallic elements that have an atomic radius of between the atomic radius of Fe and the atomic radius of Nd at each of the crystal grain boundaries between the phases (1, 2) and that will not form solid solutions with either Fe or Nd. The nonmagnetic metallic elements consist of one or two or more elements selected from among Nb, Zr, Ta and Hf, the thickness of each ultra-thin film is 10 to 20 angstroms, and the sizes of the crystal grains in each of the phases (1, 2) are in the range 5 to 100 nm, preferably 10 to 40 nm.

Abstract: An image sensor is fabricated on an n type silicon substrate haivng a p type well overlain by a photo shield plate, and photo diodes are formed in the p type well and exposed through an opening in the photo shield plate to an optical image, in which the silicon substrate and the photo shield plate are biased so that punch through phenomena take place between the silicon substrate and the photo diodes for sweeping ineffectual electric charges into the substrate, thereby achieving an electronic shutter mode of operating without any complicate impurity profiles.

Abstract: An image sensor is fabricated on a semiconductor substrate and comprises a well formed in the substrate, photo sensing elements formed in the well, vertical shift registors coupled to the columns of the photo sensing elements, a horizontal shift registor coupled to the vertical shift registors and a photo shield plate exposing the photo sensing elements to optical images, in which the photo shield plate remains in a first voltage level for restriction of production of ineffectual electric charges but is biased to a second voltage level for promoting the production of effectual electric charges after the semiconductor substrate is biased so as to allow a punch-through phenomenon to take place for discharging the ineffectual electric charges from the photo-sensing elements to the substrate, so that a variable electronic shutter is achieved under biasing the photo shield plate and the substrate without an extremely high voltage level.