Patents by Inventor Atsushi Mishima

Atsushi Mishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Patent number: 7029379
    Abstract: A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: April 18, 2006
    Assignee: Ibiden Co., Ltd.
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Publication number: 20050245177
    Abstract: A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Application
    Filed: July 6, 2005
    Publication date: November 3, 2005
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Patent number: 6916228
    Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: July 12, 2005
    Assignee: Ibiden Co., Ltd.
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Publication number: 20030008598
    Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Application
    Filed: September 5, 2002
    Publication date: January 9, 2003
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima
  • Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
    Patent number: 6475068
    Abstract: A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
    Type: Grant
    Filed: March 21, 2000
    Date of Patent: November 5, 2002
    Assignee: Ibiden Co., Ltd.
    Inventors: Naoyuki Jimbo, Yuji Okuda, Shigeharu Ishikawa, Atsushi Mishima