Patents by Inventor Atsushi Morinaga

Atsushi Morinaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240182258
    Abstract: A sheet folding apparatus includes a conveyor, a first folding roller, a second folding roller, a third folding roller, a guide, a motor, and a driving force transmission mechanism. The motor causes the second folding roller to perform either forward rotation in which the second folding roller rotates to convey a sheet on a main conveying path in a conveying direction and to convey the sheet on a reflux conveying path from a joining position toward a branching position or backward rotation in a direction opposite to the forward rotation. The driving force transmission mechanism rotates the guide toward a first posture from a second posture in conjunction with the forward rotation of the second folding roller and rotates the guide from the first posture toward the second posture in conjunction with the backward rotation of the second folding roller.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Inventors: Yuusuke SHIBASAKI, Yusuke HIRONO, Atsushi SHINODA, Shuuto TOHKAISHI, Satoshi HIRATA, Shingo YOSHIZAWA, Suzuka FUJITA, Naofumi YOSHIDA, Ryota TAKAYAMA, Takahiro WATANABE, Takuya MORINAGA, Yuji SUZUKI, Wataru NOZAKI, Kanako FUJISAKI, Jun YAMADA
  • Patent number: 11970019
    Abstract: An envelope processing apparatus that inserts an enclosure into an envelope includes an envelope conveyor, a flap opener, an enclosure pusher, and circuitry. The envelope conveyor extends in a vertical direction and conveys the envelope to an enclosing position via an envelope conveyance passage as a passage in which the envelope is conveyed. The flap opener opens a flap of the envelope. The enclosure pusher pushes the enclosure toward an opening of a body of the envelope conveyed to the enclosing position with the flap open. The circuitry changes a pushing amount of the enclosure into the envelope and adjusts the pushing amount based on the opening of the body of the envelope within a specified range from an inside to an outside of the body of the envelope.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: April 30, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Nobuyoshi Suzuki, Michitaka Suzuki, Yuusuke Shibasaki, Takahiro Matsuda, Atsushi Shinoda, Shingo Yoshizawa, Takahiro Watanabe, Takuya Morinaga
  • Publication number: 20240075767
    Abstract: An envelope processing apparatus conveys an envelope to an enclosing position and encloses an enclosure on which specific information is formed at a formation position. The enclosing device includes: an envelope conveyor to convey the enclosure to the enclosing position to insert the enclosure into the envelope; a sensor to acquire, as an image, a structure of the envelope during conveyance, and acquire transparent-portion information indicating a position of a transparent portion in the envelope; an envelope holder to hold the envelope in a state in which the enclosure is insertable; and control circuitry to output position adjustment information for adjusting a position of the envelope in a width direction of the envelope at the enclosing position or a position of the specific information in a conveyance direction of the envelope, based on relative positions between the formation position of the specific information and the position of the transparent portion.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Shingo YOSHIZAWA, Michitaka SUZUKI, Nobuyoshi SUZUKI, Yuusuke SHIBASAKI, Takahiro MATSUDA, Atsushi SHINODA, Takahiro WATANABE, Takuya MORINAGA
  • Publication number: 20230357460
    Abstract: Provided is a dip molding composition containing at least a nitrile rubber elastomer containing a carboxyl group and an amide group. In this dip molding composition, the elastomer contains 50% by weight or more, 78% by weight or less of a conjugated diene monomer-derived structural unit, 17% by weight or more, 35% by weight or less of an ethylenically unsaturated nitrile monomer-derived structural unit, 2.0% by weight or more, 8.0% by weight or less of an ethylenically unsaturated carboxylic acid monomer-derived structural unit, and 0.5% by weight or more, 5.0% by weight or less of an amide group-containing monomer-derived structural unit, and has an MEK-insoluble content of 50% by weight or more, 80% by weight or less.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 9, 2023
    Inventors: Norihide Enomoto, Atsushi Morinaga, Yamato Takeuchi, Hisanori Ota
  • Publication number: 20230159686
    Abstract: Provided is a dip molding composition which contains at least: a carboxyl group-containing nitrile rubber elastomer; an epoxy crosslinking agent containing an epoxy compound that contains three or more glycidyl ether groups in one molecule and has a basic skeleton containing an alicyclic, aliphatic or aromatic hydrocarbon; and a pH modifier. In this dip molding composition, the elastomer contains 50% by weight or more, 78% by weight or less of a conjugated diene monomer-derived structural unit, 20% by weight or more, 30% by weight or less of an ethylenically unsaturated nitrile monomer-derived structural unit, and 3.5% by weight or more, 6% by weight or less of an ethylenically unsaturated carboxylic acid monomer-derived structural unit; the elastomer has an MEK-insoluble content of 60% by weight or more, 80% by weight or less; and the epoxy crosslinking agent has an MIBK/water distribution ratio of 50% or higher.
    Type: Application
    Filed: March 30, 2021
    Publication date: May 25, 2023
    Inventors: Norihide Enomoto, Atsushi Morinaga, Hisanori Ota