Abstract: Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.

Abstract: In a power supply unit disposed below a floor behind a seat, battery modules are disposed in a lower position, and a DC/DC converter and a motor driving inverter are disposed side by side in a vehicle width direction above the battery modules. Thus, cooling air flowing from the front side to the rear side of a vehicle body is divided into upper and lower portions to cool in parallel the DC/DC converter 41 and the motor driving inverter on the upper side and the battery modules on the lower side. Thus, it is possible to simplify a passage of the cooling air to reduce the size of the entire power supply unit, and improve mountability of the power supply unit on the vehicle body. Also, it is possible to apply cooling air at low temperature before heat exchange to all the battery module, the DC/DC converter, and the motor driving inverter, thereby enhancing cooling effect.

Abstract: Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.

Abstract: The present invention relates to shield structure of electronic device in which a base board on which high-frequency circuit blocks are mounted is housed in a conductive case thereby to be shielded. A notch is provided for the base board, and a cut-down piece is provided for the conductive case correspondingly to the notch. Hereby, erroneous insertion in which the insertion direction of the base board is wrong can be eliminated. Further, the insertion working of the base board can be readily performed, and productivity can be improved. By removing the useless space of the base board, high-density mounting can be realized, and the whole of the base board has the sufficient shield effect.

Abstract: Provided is a circuit device having a structure for suppressing a leakage current between patterns. A circuit device of the embodiments has a constitution in which a circuit element and desired conductive patterns are integrally resin-molded. Furthermore, the circuit device includes: a first conductive pattern connected to a high impedance input terminal of the circuit element; a second conductive pattern provided close to the first conductive pattern; and a guard conductive pattern extended between the first and second conductive patterns. Accordingly, the circuit device is constituted to prevent a leakage current between the first and second conductive patterns.

Abstract: Provided is a circuit device which has a wiring part for forming an electric circuit therein. A circuit device, in which a circuit element and conductive patterns, which form an electric circuit, are integrally resin-molded, includes: a conductive pattern through which an electric signal passes, the electric signal being inputted/outputted between the electric circuit and the outside; and a wiring part which branches off from the conductive pattern and through which an electric signal passes, the electric signal being inputted to another portion of the electric circuit. According to the circuit device of the present invention, an electric signal inputted/outputted between a built-in electric circuit and the outside can be inputted to another spot of the electric circuit through wiring formed inside the device. Therefore, a pattern structure of a mounting board can be simplified.

Abstract: Provided is a circuit device which achieves an increased stickiness between a circuit element and other constituent components. A circuit device comprises a conductive pattern, a covering resin covering the conductive pattern except for a first opening portion, and a semiconductor element electrically connected to the conductive pattern exposed from the first opening portion through a conductive paste. A size of the first opening portion is smaller than that of the semiconductor element, and the conductive paste comes into contact with both of the covering resin and the conductive pattern exposed from the first opening portion.

Abstract: A semiconductor apparatus includes a first conductive film and a second conductive film provided on respective sides of an insulating resin film. A circuit element is mounted on the second conductive film. The circuit element is electrically connected to the second conductive film. The second conductive film is provided to cover a via plug. The via plug is tapered with a progressively smaller diameter toward the second conductive film and away from the first conductive film.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: In a semiconductor device manufacturing method, at least a semiconductor element is arranged in a cavity of a resin molding die. A resin is supplied to a resin reservoir in direct contact with the cavity and is then injected in order to substantially fill the cavity. The resin filled in the cavity forms a resin seal for encapsulating the semiconductor element. The resin seal has a recess or a protrusion as a remainder of the resin reservoir.

Abstract: A terminal inserting guide assembly includes a pair of guide hooks for guiding a terminal into a connector housing. A first upper guiding surface is formed at an upper end of a cut-out portion inside a first one of the pair of guide hooks. A terminal side guiding projection is formed in a second one of the pair of guide hooks. A second upper guiding surface is formed in the tapered extending portion. The terminal side guiding projection and the tapered extending portion are received in the cut-out portion of the first one of guide hooks, when the pair of guide hooks are closed, in their lateral direction, without a terminal.

Abstract: A pair of terminal grasping picks and a pair of wire clamping plates, which are provided in an insertion unit so that they can freely rise/fall and open/close, fall to grasp a first wire-equipped terminal clipped on a clip of a wire clamping rod; rise to separate the first wire-equipped terminal from the wire clip; advance toward the housing to insert the first wire-equipped terminal into the corresponding terminal container; and thereafter retreated and returned to an initial position, thereby successively inserting wire-equipped terminals. At any timing during the process in which the wire-equipped terminal is separated from the clip and thereafter the insertion unit is retreated and returned, either one of the wire clamping rod and the connector housing is moved in parallel to the other so that a second wire-equipped terminal or the clip is previously positioned oppositely to the a next terminal container of the housing.

Abstract: A pair of terminal grasping picks and a pair of wire clamping plates, which are provided in an insertion unit so that they can freely rise/fall and open/close, fall to grasp a first wire-equipped terminal clipped on a clip of a wire clamping rod; rise to separate the first wire-equipped terminal from the wire clip; advance toward the housing to insert the first wire-equipped terminal into the corresponding terminal container; and thereafter retreated and returned to an initial position, thereby successively inserting wire-equipped terminals. At any timing during the process in which the wire-equipped terminal is separated from the clip and thereafter the insertion unit is retreated and returned, either one of the wire clamping rod and the connector housing is moved in parallel to the other so that a second wire-equipped terminal or the clip is previously positioned oppositely to the a next terminal container of the housing.

Abstract: A charge image recording medium (RM) comprising a lamination of an electrode (E) and at least one of a light-modulation material layer (PMLQ) and an insulating polymer film or dielectric layer (IL), wherein said light-modulation material layer (PMLQ) comprises a polymer-dispersed liquid crystals film comprising a liquid crystal dispersed in a polymer. The insulating polymer film (IL) may be provided thereon with a thin film (CL) of a fatty acid or a thin film (CL) of a metal salt of a fatty acid.The light-modulation material layer (PMLQ) comprising a polymer-dispersed liquid crystals film comprising a liquid crystal dispersed in a polymer may also be provided thereon with a thin film (CL) of a fatty acid or a thin film (CL) of a metal salt of a fatty acid.

Abstract: An information recording medium includes a first transparent electrode, and a carrier transport layer formed on the first transparent electrode for generating an electric current on the basis of fed carriers. A carrier generation layer formed on the carrier transport layer serves to generate carriers corresponding to a distribution of an intensity of incident information-writing light containing information, and serves to feed the generated carriers to the carrier transport layer. An electric power supply electrically connected to the first transparent electrode serves to generate an electric field corresponding to the distribution of the intensity of the incident information-writing light in cooperation with the carrier transport layer and the carrier generation layer.

Abstract: A combined radial and thrust bearing comprising: a radial rolling bearing including an outer ring provided with a large-diameter cylindrical portion the inner peripheral surface of which constitutes a raceway of rollers, a small-diameter cylindrical portion which extends from one end of the large-diameter cylindrical portion for carrying a thrust rolling bearing and which has a smaller diameter than the large-diameter cylindrical portion and a plurality of projections for preventing the thrust rolling bearing which is provided on the periphery at the end portion of the small-diameter cylindrical portion from coming off, and a plurality of rollers disposed on the inner peripheral surface of the outer ring and held by a retainer at regular circumferential intervals; and a thrust rolling bearing including axially arranged first race and second race, the first race being composed of an annular plate, a plurality of rollers disposed and held by an annular retainer at regular circumferential intervals and the secon