Patents by Inventor Atsushi OCHIYA

Atsushi OCHIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor module
    Patent number: 11626361
    Abstract: A power semiconductor module includes an insulating substrate, conductor patterns and a power semiconductor element. The conductor patterns are formed on both surfaces of the insulating substrate. The power semiconductor element is mounted on the conductor patterns. The conductor patterns include an anode terminal connection portion and a cathode terminal connection portion. A circuit is formed such that a current that flows between the anode terminal connection portion and the cathode terminal connection portion via the power semiconductor element flows on the both surfaces of the insulating substrate.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: April 11, 2023
    Assignee: KYOCERA Corporation
    Inventors: Takashi Tojima, Yasushi Nemoto, Tsutomu Morita, Atsushi Ochiya
  • POWER SEMICONDUCTOR MODULE
    Publication number: 20210210421
    Abstract: A power semiconductor module includes an insulating substrate, conductor patterns and a power semiconductor element. The conductor patterns are formed on both surfaces of the insulating substrate. The power semiconductor element is mounted on the conductor patterns. The conductor patterns include an anode terminal connection portion and a cathode terminal connection portion. A circuit is formed such that a current that flows between the anode terminal connection portion and the cathode terminal connection portion via the power semiconductor element flows on the both surfaces of the insulating substrate.
    Type: Application
    Filed: May 16, 2019
    Publication date: July 8, 2021
    Applicant: KYOCERA Corporation
    Inventors: Takashi TOJIMA, Yasushi NEMOTO, Tsutomu MORITA, Atsushi OCHIYA