Patents by Inventor Atsushi Okoshi

Atsushi Okoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10359701
    Abstract: A material for forming an underlayer film for lithography, in which a compound represented by the following formula (0) is used.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: July 23, 2019
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kana Okada, Takashi Makinoshima, Masatoshi Echigo, Go Higashihara, Atsushi Okoshi
  • Patent number: 10338471
    Abstract: The composition for forming an underlayer film for lithography according to the present invention contains a compound represented by a specific formula (1) and 20 to 99% by mass of a solvent component (S), in which 27 to 100% by mass of the compound represented by the formula (1) is included in a component (A) other than the solvent component (S).
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: July 2, 2019
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kana Okada, Takashi Makinoshima, Masatoshi Echigo, Go Higashihara, Atsushi Okoshi
  • Publication number: 20180101096
    Abstract: A material for forming an underlayer film for lithography, in which a compound represented by the following formula (0) is used.
    Type: Application
    Filed: April 7, 2016
    Publication date: April 12, 2018
    Inventors: Kana OKADA, Takashi MAKINOSHIMA, Masatoshi ECHIGO, Go HIGASHIHARA, Atsushi OKOSHI
  • Publication number: 20180101097
    Abstract: A material for forming an underlayer film for lithography, including a cyanic acid ester compound obtained by cyanation of a modified xylene formaldehyde resin, a composition including the material, and a pattern forming method using the composition.
    Type: Application
    Filed: April 7, 2016
    Publication date: April 12, 2018
    Inventors: Kana OKADA, Takashi MAKINOSHIMA, Masatoshi ECHIGO, Go HIGASHIHARA, Atsushi OKOSHI
  • Publication number: 20180052392
    Abstract: The present invention provides a material for forming an underlayer film for lithography, including a cyanic acid ester compound obtained by cyanation of a modified naphthalene formaldehyde resin.
    Type: Application
    Filed: February 19, 2016
    Publication date: February 22, 2018
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kana OKADA, Takashi MAKINOSHIMA, Masatoshi ECHIGO, Go HIGASHIHARA, Atsushi OKOSHI
  • Publication number: 20170227849
    Abstract: The composition for forming an underlayer film for lithography according to the present invention contains a compound represented by a specific formula (1) and 20 to 99% by mass of a solvent component (S), in which 27 to 100% by mass of the compound represented by the formula (1) is included in a component (A) other than the solvent component (S).
    Type: Application
    Filed: July 31, 2015
    Publication date: August 10, 2017
    Inventors: Kana OKADA, Takashi MAKINOSHIMA, Masatoshi ECHIGO, Go HIGASHIHARA, Atsushi OKOSHI
  • Patent number: 9725551
    Abstract: There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. wherein R represents an organic group having 1 to 10 carbon atoms; l represents an integer of 0 to 2, and m and n represent integers satisfying 1?m+n?10, m?0 and n?1.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: August 8, 2017
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Go Higashihara, Atsushi Okoshi
  • Patent number: 9562130
    Abstract: There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. wherein R represents an organic group having 1 to 10 carbon atoms; m and n represent integers satisfying 1?m+n?10, m?0 and n?1.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: February 7, 2017
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Go Higashihara, Atsushi Okoshi
  • Publication number: 20160130384
    Abstract: There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. wherein R represents an organic group having 1 to 10 carbon atoms; m and n represent integers satisfying 1?m+n?10, m?0 and n?1.
    Type: Application
    Filed: June 16, 2014
    Publication date: May 12, 2016
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Go HIGASHIHARA, Atsushi OKOSHI
  • Publication number: 20160130383
    Abstract: There is provided an aromatic hydrocarbon formaldehyde resin obtained by reacting an aromatic hydrocarbon compound (A) represented by the following formula (1) with formaldehyde (B) in the presence of an acidic catalyst. wherein R represents an organic group having 1 to 10 carbon atoms; l represents an integer of 0 to 2, and m and n represent integers satisfying 1?m+n?10, m?0 and n?1.
    Type: Application
    Filed: June 16, 2014
    Publication date: May 12, 2016
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Go HIGASHIHARA, Atsushi OKOSHI
  • Patent number: 8703010
    Abstract: A curing agent for epoxy resins which comprises cyclohexanetricarboxylic acid anhydride (A) comprising trans,trans-1,2,4-cyclohexanetricarboxylic acid 1,2-anhydride expressed by formula (1) and aliphatic dicarboxylic acid anhydride (B) and an epoxy resin composition which comprises the curing agent and an epoxy resin are provided. The curing agent of the present invention can be handled easily since the curing agent is liquid at the ordinary temperature, exhibits an excellent curing property without addition of a curing accelerator and provides a cured product of an epoxy resin exhibiting excellent transmission of light and heat stability. The epoxy resin composition can be advantageously used for coating materials, adhesives, molded products, resins for encapsulating photo-semiconductors and coating fluids for protective films of color filters constituting liquid crystal display devices (LCD), solid state imaging devices (CCD) and electroluminescence (EL) devices.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: April 22, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Atsushi Okoshi, Ryuji Ideno, Takao Ota
  • Patent number: 8034962
    Abstract: The present invention provides an acid anhydride ester obtained by esterifying cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and a composition of the ester, and a heat-curable resin composition and a cured product of the composition. _Provided is an epoxy resin composition using the acid anhydride ester as a curing agent for an epoxy resin, the epoxy resin composition having, for example, the following properties (1), (2), and (3): (1) the epoxy resin composition has a low viscosity at room temperature, so the components of the composition can be favorably blended with each other, (2) the acid anhydride ester has a low vapor pressure at curing temperature, so no evaporation loss occurs after curing, and the intended design of blend is capable, and (3) a cured product to be made from the composition is colorless and transparent, and changes its color to a small extent even when the product is irradiated with light or heated for a long time period.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: October 11, 2011
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tomohiro Sugawara, Takeshi Koyama, Atsushi Okoshi, Takashi Sato, Shuichi Ueno
  • Patent number: 7569708
    Abstract: Trans, trans-1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride represented by the following formula 1: a cyclohexanetricarboxylic anhydride being liquid at ordinary temperatures which contains such a anhydride, and a production method thereof. The cyclohexanetricarboxylic anhydride being liquid at ordinary temperatures is produced by melting 1,2,4-cyclohexanetricarboxylic acid and/or 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride at 180 to 300° C. under heating. Since the cyclohexanetricarboxylic anhydride is liquid at ordinary temperatures, it is advantageously used in industrial applications such as raw materials or modifiers for coating compositions, adhesives, shaped articles, sealing resins for photosemiconductors, curing agents and polyimide resins, raw materials for plasticizers and lubricant oils, intermediates for medicines and agricultural chemicals, raw material for coating resins, raw material for toner resins, etc.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: August 4, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventor: Atsushi Okoshi
  • Patent number: 7569707
    Abstract: A method of producing pyromellitic dianhydride. The method includes a step of heating a crude pyromellitic acid in the absence of acetic anhydride to convert a part of pyromellitic acid to pyromellitic anhydride, and a subsequent step of heating the resultant mixture in the presence of acetic anhydride to complete the anhydrization of pyromellitic acid. The pyromellitic dianhydride by the method contains little pyromellitic monoanhydride and other monoanhydrides derived from impurities and is less discolored. The pyromellitic dianhydride has particle properties not causing plugging, etc. during its transportation, storage and use.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: August 4, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hiroshi Ogawa, Atsushi Okoshi, Masashi Yabuno, Masato Inari
  • Publication number: 20080306223
    Abstract: A curing agent for epoxy resins which comprises cyclohexanetricarboxylic acid anhydride (A) comprising trans,trans-1,2,4-cyclohexanetricarboxylic acid 1,2-anhydride expressed by formula (1) and aliphatic dicarboxylic acid anhydride (B) and an epoxy resin composition which comprises the curing agent and an epoxy resin are provided. The curing agent of the present invention can be handled easily since the curing agent is liquid at the ordinary temperature, exhibits an excellent curing property without addition of a curing accelerator and provides a cured product of an epoxy resin exhibiting excellent transmission of light and heat stability. The epoxy resin composition can be advantageously used for coating materials, adhesives, molded products, resins for encapsulating photo-semiconductors and coating fluids for protective films of color filters constituting liquid crystal display devices (LCD), solid state imaging devices (CCD) and electroluminescence (EL) devices.
    Type: Application
    Filed: May 17, 2005
    Publication date: December 11, 2008
    Inventors: Atsushi Okoshi, Ryuji Ideno, Takao Ota
  • Publication number: 20080039591
    Abstract: The present invention provides an acid anhydride ester obtained by esterifying cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride and a composition of the ester, and a heat-curable resin composition and a cured product of the composition. _Provided is an epoxy resin composition using the acid anhydride ester as a curing agent for an epoxy resin, the epoxy resin composition having, for example, the following properties (1), (2), and (3): (1) the epoxy resin composition has a low viscosity at room temperature, so the components of the composition can be favorably blended with each other, (2) the acid anhydride ester has a low vapor pressure at curing temperature, so no evaporation loss occurs after curing, and the intended design of blend is capable, and (3) a cured product to be made from the composition is colorless and transparent, and changes its color to a small extent even when the product is irradiated with light or heated for a long time period.
    Type: Application
    Filed: August 8, 2007
    Publication date: February 14, 2008
    Inventors: Tomohiro Sugawara, Takeshi Koyama, Atsushi Okoshi, Takashi Sato, Shuichi Ueno
  • Patent number: 7323522
    Abstract: The cyclohexanetricarboxylic monoester of the present invention is represented by the following formula 1: wherein R is as defined in the specification. The cyclohexanetricarboxylic monoester is useful particularly as the curing agent for epoxy-containing compounds. A heat-curable resin composition comprising the cyclohexanetricarboxylic monoester and an epoxy-containing compound exhibits an excellent curability without using a curing accelerator and provides a colorless transparent cured product which is little discolored even under a long-term exposure to high-temperature conditions. Such a heat-curable resin composition is suitable as sealing materials for photoelectric transducers such as blue LED and white LED, shaped articles, coating materials, adhesives, etc.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: January 29, 2008
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Ryuji Ideno, Takeshi Koyama, Atsushi Okoshi, Takao Ota
  • Publication number: 20070123716
    Abstract: Trans, trans-1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride represented by the following formula 1: a cyclohexanetricarboxylic anhydride being liquid at ordinary temperatures which contains such a anhydride, and a production method thereof. The cyclohexanetricarboxylic anhydride being liquid at ordinary temperatures is produced by melting 1,2,4-cyclohexanetricarboxylic acid and/or 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride at 180 to 300° C. under heating. Since the cyclohexanetricarboxylic anhydride is liquid at ordinary temperatures. it is advantageously used in industrial applications such as raw materials or modifiers for coating compositions, adhesives, shaped articles, sealing resins for photosemiconductors, curing agents and polyimide resins, raw materials for plasticizers and lubricant oils, intermediates for medicines and agricultural chemicals, raw material for coating resins, raw material for toner resins, etc.
    Type: Application
    Filed: November 19, 2004
    Publication date: May 31, 2007
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Atsushi Okoshi
  • Publication number: 20070021622
    Abstract: A method of producing pyromellitic dianhydride. The method includes a step of heating a crude pyromellitic acid in the absence of acetic anhydride to convert a part of pyromellitic acid to pyromellitic anhydride, and a subsequent step of heating the resultant mixture in the presence of acetic anhydride to complete the anhydrization of pyromellitic acid. The pyromellitic dianhydride by the method contains little pyromellitic monoanhydride and other monoanhydrides derived from impurities and is less discolored. The pyromellitic dianhydride has particle properties not causing plugging, etc. during its transportation, storage and use.
    Type: Application
    Filed: July 21, 2006
    Publication date: January 25, 2007
    Inventors: Hiroshi Ogawa, Atsushi Okoshi, Masashi Yabuno, Masato Inari
  • Patent number: 7071362
    Abstract: In the production of an alicyclic aldehyde, a starting aromatic aldehyde is converted into an aromatic acetal for protecting the formyl group. The aromatic ring of the aromatic acetal is then hydrogenated to convert the aromatic acetal into an alicyclic acetal, which is then hydrolyzed to cleave the acetal protecting group to obtain the aimed alicyclic aldehyde.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: July 4, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tomohiro Sugawara, Fumiya Zaima, Atsushi Okoshi, Kinji Kato, Masato Inari