Abstract: An upper surface of a main portion of a die pad includes a first region overlapping a semiconductor chip, a second region arranged between a side and the first region, and a third region arranged between the first region and a connecting portion. In the upper surface of the main portion, each of a second trench length of a second trench arranged in the second region and a third trench length of a third trench arranged in the third region is larger than a first trench length of a first trench arranged in the connecting portion. Each of a second trench width of the second trench arranged in the second region and a third trench width of the third trench arranged in the third region is smaller than a first trench width of the first trench arranged in the connecting portion.

Abstract: A method of making a semiconductor chip 1 having a first electrodes 11, 12 on main surface 1a thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1b opposite to the main surface 1a of the semiconductor chip 1, and a side portion 132 extended from one end portion of the base portion 131 in the direction toward the main surface 1a of the semiconductor chip 1, wherein an end part of the side portion 132 of the second electrode 13 is exposed on the same side as the first electrodes 11, 12.

Abstract: A method of making a semiconductor chip 1 having a first electrodes 11, 12 on main surface la thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1b opposite to the main surface 1a of the semiconductor chip 1, and a side portion 132 extended from one end portion of the base portion 131 in the direction toward the main surface 1a of the semiconductor chip 1, wherein an end part of the side portion 132 of the second electrode 13 is exposed on the same side as the first electrodes 11, 12.

Abstract: A semiconductor chip 1 has a first electrodes 11,12 on a main surface 0a thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1b opposite to the main surface 1a of the semiconductor chip 1, and a side portion 132 extended from one end portion of the base portion 131 in the direction toward the main surface 1a of the semiconductor chip 1, and an end part of the side portion 132 of the second electrode 13 is provided over the main surface 1a of the semiconductor chip 1.