Abstract: A method for manufacturing a nonaqueous electrolyte secondary battery disclosed herein includes the steps of: preparing a battery assembly including a positive electrode, a negative electrode, and a nonaqueous electrolyte; performing initial charging on the battery assembly; and performing an aging process on the battery assembly having been subjected to the initial charging. The positive electrode includes a positive electrode active material layer containing a positive electrode active material and a thiophosphoric acid salt. A content of the thiophosphoric acid salt in the positive electrode active material layer is 1 mass % to 10 mass %. The initial charging is performed up to a voltage more than or equal to a decomposition start potential of the thiophosphoric acid salt. The aging process is performed in a state where the battery assembly is charged to the voltage more than or equal to the decomposition start potential of the thiophosphoric acid salt.

Abstract: An electronic parts insertion head including a supporting block, an insertion guide movable between first and second positions with respect to the supporting block and configured to guide a lead wire of an electronic part to an attaching hole of a printed wiring board in the first position, an insertion guide moving mechanism configured to move the insertion guide between the first and second positions, a cam capable of moving with respect to the supporting block, a cam follower arranged on the insertion guide and positioned to move along a cam face of the cam, and a cam position changing mechanism configured to change a position of the cam with respect to the support block, wherein the insertion guide changes a movement locus when the position of the cam is changed by the cam position changing mechanisms.

Abstract: An apparatus for automatically mounting an electronic device having a plurality of leads on a printed circuit board, by inserting the leads into mount holes of the printed circuit board. A plurality of extension pins are connected straight to the leads to hold the leads of the electronic device. The extension pins are inserted into the mount holes, while the connection between the extension pins and the leads is maintained. The extension pins are then removed from an opposite side of the printed circuit board, thus guiding and inserting the tips of the leads into the mount holes.