Patents by Inventor Atsushi Suzunaga

Atsushi Suzunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5915757
    Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: June 29, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono
  • Patent number: 5714794
    Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: February 3, 1998
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono