Patents by Inventor Atsushi Taira

Atsushi Taira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7960443
    Abstract: The present invention relates to an extruded styrenic resin foam and a method for producing the same, wherein a base resin composing the extruded styrenic resin foam is a styrenic resin mixture of a styrene-(meth)acrylic ester copolymer, or a combination of a styrene-(meth)acrylic ester copolymer and polymethyl methacrylate, and a styrenic resin except the styrene-(meth)acrylic ester copolymer, and the styrenic resin mixture contains a (meth)acrylic ester component at a ratio of 4 to 45% by weight with reference to the styrenic resin mixture. The present invention provides an extruded styrenic resin foam having an apparent density of 20 to 60 kg/m3, a thickness of 10 to 150 mm, and a low thermal conductivity, and keeping excellent heat insulation performance over a long period of time and flame retardancy, even when the styrenic resin extruded foam is foamed using a blowing agent having an ozone depleting potential of 0 (zero) and a low global warming potential.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: June 14, 2011
    Assignee: JSP Corporation
    Inventors: Shunsuke Sekiya, Atsushi Taira, Noritoshi Nishiyama, Naochika Kogure
  • Publication number: 20090069455
    Abstract: The present invention relates to an extruded styrenic resin foam and a method for producing the same, wherein a base resin composing the extruded styrenic resin foam is a styrenic resin mixture of a styrene-(meth)acrylic ester copolymer, or a combination of a styrene-(meth)acrylic ester copolymer and polymethyl methacrylate, and a styrenic resin except the styrene-(meth)acrylic ester copolymer, and the styrenic resin mixture contains a (meth)acrylic ester component at a ratio of 4 to 45% by weight with reference to the styrenic resin mixture. The present invention provides an extruded styrenic resin foam having an apparent density of 20 to 60 kg/m3, a thickness of 10 to 150 mm, and a low thermal conductivity, and keeping excellent heat insulation performance over a long period of time and flame retardancy, even when the styrenic resin extruded foam is foamed using a blowing agent having an ozone depleting potential of 0 (zero) and a low global warming potential.
    Type: Application
    Filed: April 15, 2008
    Publication date: March 12, 2009
    Applicant: JSP CORPORATION
    Inventors: Shunsuke Sekiya, Atsushi Taira, Noritoshi Nishiyama, Naochika Kogure